
Dell deploys private cloud infrastructure for Max Healthcare
Dell deploys private cloud infrastructure for the combined IT of eight Max Healthcare facilities to set the stage for rollout of Electronic Health Records (EHR) for enhanced patient care.
Citrix's second 'largest' R&D centre to rise in India
Citrix will set up an R&D centre in Bangalore which will be its largest out of the U.S. and open a sales office in Mumbai to handle an expanding sales team.
R&D centre...
Real-time testing software supports ruggedized apps
NI introduces the NI VeriStand 2010, real-time testing software with enhancements to support high-performance, multiple chassis PXI systems and low-cost, ruggedized options.
- AlInGaP LEDs claim extended product lifetime
- 36V LDO regulators designed for noise-sensitive apps
- LED design tool optimises complex lighting systems
- Interconnect improves oscilloscope performance
- System Simulator software enhances RF design
- 10GbE iSCSI HBA solution boasts over 10 lakh IOPs
- Audio scrambler allows comprehensive voice processing
Batteries to be a part of clothing?
Scientists have reported headway in using a common virus to develop lightweight, rechargeable lithium-ion batteries that could be woven into clothing to power portable electronic devices.
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SuperSpeed USB to penetrate DSCs, camcorders
Researchers claim to have developed a method to increase the density of the MRAMs over flash, with a ferroelectric interface that allows perpendicular magnetic domains to be as small as 40nm.

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Basic Electronics and Lab: Lecture 10 - Transistors
This lecture covers these topics: transistor action, types of transistors, transistor as current amplifier and Darlington transistor. Prof. T.S. Natarajan from the Department of Physics, IIT Madras conducted this lecture.
In this second part, we focus on the receiver side of the interface—the video analogue front end (video AFE or V-AFE).
Using virtual prototypes in software-centric power debugging
This article outlines how VPs provide all the necessary elements for a debug solution that can spot and remove power related defects from software.
- Reap the benefits of a design preservation flow
- Employing DTCP to secure data
- Implementing Virtual Line Crossing Detection
The essential aspects of LTE's PHY (Part 2)
To allow for coherent demodulation at the user equipment, reference symbols (or pilot symbols) are inserted in the OFDM time-frequency grid to allow for channel estimation.
- The essential aspects of LTE's PHY (Part 1)
- Connect embedded systems with 802.11n
- High level synthesis enables low-power design
Employing scripting for test and measurement
Regardless of how a script is developed, scripting brings some new concerns to test management.
- Shorten test time with package-based MBIST strategy
- Detailing the Agilent HDMI 1.4 testing
- Target small delay defects with ATPG
What makes SuperSpeed USB different from USB 2.0?
This article looks at what is new and better with SuperSpeed USB (USB 3.0) protocols and power management vs. USB 2.0.
- Implementing analogue video interfaces (Part 2)
- Implementing analogue video interfaces (Part 1)
- Improving RS-485's performance, safety (Part 2)
How to build memory management for wired/wireless nets (Part 2)
To evaluate the performance of the proposed variable-size memory pool scheme described in Part 1 in this series—we used discrete-event simulation to generate random requests to the memory pool.
- How to build memory management for wired/wireless nets (Part 1)
- Addressing deterministic dynamic memory allocation issues
- How to protect data with battery-free RAID solution

ABI Research estimates that 97.90 crore devices will ship in 2015 that combine different radio technologies including FM broadcast reception, Bluetooth, Wi-Fi and GPS.
- Automotive electronics market on the roll
- IC market to surge ahead while ROM, EPROM lags
- Embedded pico projectors to rise
- Femtocells to reach Rs.18,787.55 crore by 2014
Smart home apps welcome PLC, Bluetooth
A good smart home system must be simple to install and use. Providing the right infrastructure for connecting devices will determine the success of the smart home.
- I-BCM controllers eliminate the need for SiC diodes
- Employing buck controller in buck boost design
- Industrial apps reap benefits from PFC device
Runtime case study: Flat vs. hierarchical
This article details the difference in terms of runtimes, routing congestion, timing summary and utilisation for a design that is done as hierarchical vs. the same design using the flat approach.
- The benefits of early chip planning (Part 2)
- The benefits of early chip planning (Part 1)
- Verifying your PCB/IC thermal modelling
As consumers thirst for the high-definition experiences delivered by expanding amounts of signal bandwidth, design challenges related to clocking become increasingly difficult and complicated.
- Exploring the types of combinational loops
- Providing superior Internet video QoE
- Using reference designs in implementing low, high frequency ADCs
Reconsider home net connections
Bear in mind the possibilities of emerging home networking standards. It is to your advantage to be part of the home networking community.
- Uses of IOV in network infrastructure, Part 3
- Uses of IOV in network infrastructure, Part 2
- Uses of IOV in network infrastructure, Part 1
Architecting next-generation smart LED lamp apps
This article explores a few of these intelligent options suited for LED lamps and the steps involved in achieving them.
- Ease image sensor calibration in camera phones
- Understanding automotive instrument cluster apps
- How to increase street light solar panels' efficiency
Examining packaging options for RF power ICs
More robust packaging technology has helped RF power IC makers support the higher frequencies and bandwidths today's designers require.
- The benefits of creating patterns
- SMD package for power MOSFETs
- Address power during manufacturing test

Looking for parts to specify for your design project? Browse our library of datasheets NOW!


Get a dose of the latest application notes.
- I2C driver for the MC9S08GW64
- Layout recommendations for the MC34848
- Using MM/JE Flexis families for IR communication
- LCD driver for the MC9S08LGW64
- PCB layout design guide for analogue applications


- Analyst: McAfee buy moves Intel away from chip sales
- Intel steps into mobile security with McAfee
- ReneSola inks solar wafer deals
- CSR counters Broadcom's patent infringement suit
- SSDs still rule the NAND flashmarket
- Solar cell spot price records 7.2% growth
- Germany taps NXP chip for national ID card
- US senators launch campaign against Huawei
- Toshiba shows off 2.5TB HDD

Sneak a peek inside popular products!
iPhone 4 design exhibits high reuse 
The new Apple iPhone 4 could very well be called an iPad since it uses at least seven chips from the popular Apple tablet, according to analysts from UBM TechInsights.











