• Microdisplays deliver high image quality (29/12/06) [ Optoelectronics/Displays ]
• DC/DC converters offer 50% more power (29/12/06) [ Power/Alternative Energy ]
• PCB mountable test points speed identification (29/12/06) [ T&M ]
• Zetex launches IF switch for LNBs design (29/12/06) [ Interface ]
• Avago intros 'thinnest' SMT ChipLED lamps (29/12/06) [ Optoelectronics/Displays ]

• Integrated Microelectronics eyes global foothold (29/12/06) [ Embedded ]
• Rim Semi partners with TSMC to manufacture processors (29/12/06) [ Interface ]
• Samsung president pleads guilty in DRAM price fixing probe (29/12/06) [ Manufacturing/Packaging ]
• Gartner lowers silicon foundry forecast for 2007 (29/12/06) [ Manufacturing/Packaging ]
• Cypress plans to set up 'solar' fab in India (29/12/06) [ Manufacturing/Packaging ]

• TSMC, UMC report no damage from earthquakes in Taiwan (28/12/06) [ Manufacturing/Packaging ]
• Femtocells emerges as alternative to Wi-Fi cell phones (28/12/06) [ Embedded ]
• PC shipmets strong despite flat US growth (28/12/06) [ Embedded ]
• Organic electronics will flourish (28/12/06) [ RF/Microwave ]
• India edges China, Taiwan as semicon destinations (28/12/06) [ EDA/IP ]

• Gore announces high-flex FireWire cable assemblies (28/12/06) [ Networks ]
• AC/DC power supplies deliver full load at 70°C (28/12/06) [ Power/Alternative Energy ]
• NEC adds 16 devices to its line of 16bit, 32bit MCUs (28/12/06) [ Embedded ]
• 3Mpixel CIS cuts camera phone size (28/12/06) [ Amplifiers/Converters ]
• Video processor engines designed for media devices (28/12/06) [ Amplifiers/Converters ]

• Forte Design Systems announces new appointments (27/12/06) [ Manufacturing/Packaging ]
• NXP, 1&1 and TeleGent to enable mass adoption of IPTV (27/12/06) [ Optoelectronics/Displays ]
• Chinese firms make final effort on Enhanced Versatile Disc (27/12/06) [ Memory/Storage ]
• Taiwan handset firms face pressure (27/12/06) [ Embedded ]
• Shanghai firm prepares chip for China DTV (27/12/06) [ Amplifiers/Converters ]

• Silicon Image, Genesis resolve patent matter (27/12/06) [ Manufacturing/Packaging ]
• Motorola, Tut Systems sign definitive merger agreement (27/12/06) [ Networks ]
• Sony, Panasonic, Samsung target the connected home (27/12/06) [ Embedded ]
• Current monitors feature 8-450V operating range (27/12/06) [ Embedded ]
• Mentor rolls out rule decks for TSMC's 65nm tech (27/12/06) [ EDA/IP ]

• 'Smallest' high-speed 1.8V UARTs run at 5Mbps (27/12/06) [ Interface ]
• AC/DC power supplies deliver 600W from tiny package (27/12/06) [ Power/Alternative Energy ]
• 802.11n chipset enables first 100m performance (27/12/06) [ RF/Microwave ]
• SMSC introduces line of advanced temperature sensors (27/12/06) [ Amplifiers/Converters ]
• Renesas launches 'first' PFC control IC (27/12/06) [ Power/Alternative Energy ]

• Hardware security module delivers simple drop-in solution to OEMS (27/12/06) [ Embedded ]
• Taiyo Yuden introduces 'smallest' low-ESL MLCCs (27/12/06) [ Power/Alternative Energy ]
• Lenmar launches portable 'Bat Paks' for CEs (27/12/06) [ Embedded ]
• Delaware court issues claims in Magma construction ruling (26/12/06) [ EDA/IP ]
• AMD opens Advanced Architecture and Tech Lab (26/12/06) [ EDA/IP ]

• TI selects ARM Cortex processors for automotive apps (26/12/06) [ Embedded ]
• Tundra delivers silicon with LogicVision boundary scan (26/12/06) [ Embedded ]
• Beceem expands usage of Magma software (26/12/06) [ Embedded ]
• GPS module delivers even in weak-signal areas (26/12/06) [ RF/Microwave ]
• Avago expands interface optocoupler family (26/12/06) [ Power/Alternative Energy ]

• Crystal oscillator delivers frequency stability in small package (26/12/06) [ RF/Microwave ]
• ARM releases DDR1, DDR2 memory interface IP (26/12/06) [ Memory/Storage ]
• Faraday adds Ethernet PHY cores to IP portfolio (26/12/06) [ Embedded ]
• Vivace, Huaqi collaborate on multimedia platforms (25/12/06) [ Embedded ]
• Revenues for silicon, crystal timers to flourish (25/12/06) [ Amplifiers/Converters ]

• Shinden Hightex to represent Imsys (25/12/06) [ Embedded ]
• Cincom appoints new director for dev centre (25/12/06) [ Embedded ]
• Wipro signs up as Tensilica's latest design centre partner (25/12/06) [ EDA/IP ]
• Vishay resistor claims more than 25,000V ESD (25/12/06) [ Power/Alternative Energy ]
• QNX RTOS library supports DAQ, control cubes (25/12/06) [ Embedded ]

• SOG LCD module features QHD array of 960 x 540 pixels (25/12/06) [ Optoelectronics/Displays ]
• Xilinx launches low-cost I/O optimised FPGAs (25/12/06) [ Amplifiers/Converters ]
• Oki ships samples of 'smallest' audio DAC LSI (25/12/06) [ Amplifiers/Converters ]
• austriamicro 50V CMOS process suits automotive, medical apps (22/12/06) [ Manufacturing/Packaging ]
• ADI sues SiLabs for mulitple patent infringement (22/12/06) [ Embedded ]

• MEW opens subsidiary in China (22/12/06) [ Embedded ]
• Intel's World Ahead program debuts in the Philippines (22/12/06) [ Embedded ]
• SEMI's book-to-bill remains flat (22/12/06) [ Manufacturing/Packaging ]
• South Korea govt to invest in IT projects (22/12/06) [ Manufacturing/Packaging ]
• Qualcomm chips support OneNAND flash memory (22/12/06) [ Embedded ]

• India's IC industry needs 'pull strategy', says ISA (22/12/06) [ EDA/IP ]
• Aperto to set up WiMAX facility in Chennai (22/12/06) [ RF/Microwave ]
• Battery ICs protect muticell, Li-based battery packs (22/12/06) [ Amplifiers/Converters ]
• Wireless library tool speeds up dev of 3GPP LTE designs (22/12/06) [ EDA/IP ]
• Broadcom samples 10GbE transceiver for DSP tech (22/12/06) [ RF/Microwave ]

• Current sensors roll for battery-automotive apps (22/12/06) [ Amplifiers/Converters ]
• Full-Size SBC features DDR2 memory at 533/66MHz (22/12/06) [ Embedded ]
• 2-/4-channel controllers convert DC to AC voltage (22/12/06) [ Power/Alternative Energy ]
• JMD announces WiMAX front-end module (22/12/06) [ RF/Microwave ]
• PMC-Sierra develops 336-channel framer for wireless network evolution (22/12/06) [ RF/Microwave ]

• Xilinx, AXIS release radio card platform for W-CDMA, WiMAX (22/12/06) [ RF/Microwave ]
• PCIe controller targets storage, embedded apps (22/12/06) [ Embedded ]
• IR develops 150V MOSFET for DC/DC converters (21/12/06) [ Power/Alternative Energy ]
• Current sensors provide high accuracy, low noise (21/12/06) [ Amplifiers/Converters ]
• Rocker switches feature quick connect terminal option (21/12/06) [ Networks ]

• RS-232-to-USB converter reduces engineering time (21/12/06) [ Networks ]
• MCUs include power-saving tech for security, home apps (21/12/06) [ Power/Alternative Energy ]
• AMI Semiconductor announces XtreMOS Tech (21/12/06) [ Power/Alternative Energy ]
• Oxford Semi intros USB controller for storage apps (21/12/06) [ Embedded ]
• NI releases LabVIEW toolkit for MINDSTORMS NXT (21/12/06) [ Manufacturing/Packaging ]

• Fan controllers offer accurate thermal management (21/12/06) [ Amplifiers/Converters ]
• GaAs, semicon tech market to grow at 8% CAGR (21/12/06) [ Manufacturing/Packaging ]
• Matsushita to produce 'safer' Li-ion batteries with HRL (21/12/06) [ Power/Alternative Energy ]
• Samsung selects ST's Nomadik processor (21/12/06) [ Embedded ]
• Microsemi opens Taiwan centre for closer Asian support (21/12/06) [ EDA/IP ]

• China semicon market to jump, says SEMI (21/12/06) [ Manufacturing/Packaging ]
• HDMI 1.3 to offer better DTV images (21/12/06) [ Interface ]
• AMD licenses Amkor's Pb-free bumping tech (21/12/06) [ Manufacturing/Packaging ]
• Chip designers satisfied with IC verification environments (21/12/06) [ EDA/IP ]
• Mentor to focus on R&D centres in India (21/12/06) [ EDA/IP ]