• Cables To Go unveils HDMI, DVI rotating connectors (31/12/07) [ Network Design ]
• Feed-through version of M12 connectors debuts (31/12/07) [ Network Design ]
• High-reliability markets require tantalum caps (31/12/07) [ Power Design ]
• Quantum computer performs image recognition tasks (31/12/07) [ Embedded Design ]
• Japanese tech companies mull over outsourcing (31/12/07) [ Manufacturing/Packaging ]

• Apple files patent for order-processing wireless system (31/12/07) [ RF/Wireless Design ]
• Audio, power mgmt IC powers Core Logic PNDs (28/12/07) [ Signals ]
• Linear touts 100% duty cycle DC/DC controller (28/12/07) [ Embedded Design ]
• EMI suppression devices protect Ethernet apps (28/12/07) [ RF/Wireless Design ]
• Transceiver enables low-cost Gbit links over POF (28/12/07) [ Network Design ]

• Tensilica enhances Xtensa cores, tools (28/12/07) [ Embedded Design ]
• Metalink unveils dual-mode 802.11n chipset (28/12/07) [ RF/Wireless Design ]
• NIC unveils stacked film chip capacitors (28/12/07) [ Manufacturing/Packaging ]
• Three-axis linear accelerometers suit portable apps (28/12/07) [ Signals ]
• Saifun-Spansion merger expected to close in Q1'08 (28/12/07) [ Manufacturing/Packaging ]

• Samsung files complaint against Sharp (28/12/07) [ Manufacturing/Packaging ]
• Russia extends Global navigation Satellite System's coverage (28/12/07) [ RF/Wireless Design ]
• SMIC licenses IBM's 45nm bulk CMOS tech (28/12/07) [ Manufacturing/Packaging ]
• Intel, ST delay Numonyx debut (28/12/07) [ Manufacturing/Packaging ]
• Google to offer iphone apps over DoCoMo i-Mode net (28/12/07) [ Embedded Design ]

• Ford tech enables hydrogen to fuel cars (28/12/07) [ Power Design ]
• India chip designers prepare for business surge (28/12/07) [ EDA ]
• Backlight control algorithm for LCD drivers debuts (27/12/07) [ Embedded Design ]
• Software initiator package drives FCoE solutions (27/12/07) [ Embedded Design ]
• Zilog tips 1.8V flash MCU with extended peripherals (27/12/07) [ Embedded Design ]

• Jennic rolls ZigBee stack for 32bit wireless MCUs (27/12/07) [ Embedded Design ]
• Linux quick-start BSP targets Python SBC (27/12/07) [ Embedded Design ]
• Audio 2Vrms-output DACs feature integrated charge pumps (27/12/07) [ Signals ]
• Non-stick 'nanonails' repel all kinds of liquids (27/12/07) [ Manufacturing/Packaging ]
• Instrumentation amps feature autozeroing tech (27/12/07) [ Signals ]

• NXP acquires GPS single-chip solutions company (27/12/07) [ Embedded Design ]
• Hitachi, Canon, Matsushita confirm LCD tech alliance (27/12/07) [ Optoelectronics & Displays ]
• Bahrain bank acquires 75% stake in Open-Silicon (27/12/07) [ EDA ]
• Analysts see DTV chip market consolidation ahead (27/12/07) [ Signals ]
• HDTV return rate rises due to consumer confusion (27/12/07) [ Signals ]

• AMEC rolls out 65nm tools, unveils strategy (27/12/07) [ EDA ]
• Applied, AMEC disagree over trade secrets (27/12/07) [ Manufacturing/Packaging ]
• Indian scientists trap light in 'nano' magnetic spheres (27/12/07) [ Embedded Design ]
• Cypress unveils CMOS image sensor for D-20 camera (26/12/07) [ Signals ]
• Dual 100V linear regulator suits telecom, net systems (26/12/07) [ Power Design ]

• Automotive contact monitors consume low current (26/12/07) [ Power Design ]
• Vishay touts EPIC with Joule effect ignition (26/12/07) [ Power Design ]
• Allegro unveils current sensors for car apps (26/12/07) [ Signals ]
• ODM module field tests fibre-optic networks (26/12/07) [ Test & Measurement ]
• Reactive power splitter has split loss of 7dB (26/12/07) [ Power Design ]

• STB decoder targets advanced codec market (26/12/07) [ RF/Wireless Design ]
• Marvell app processor powers Samsung PDA phone (26/12/07) [ Embedded Design ]
• Engineous, Fujitsu develop integrated IT solution (26/12/07) [ Embedded Design ]
• Hitachi stimulates greenhouse gas emission plan (26/12/07) [ Manufacturing/Packaging ]
• EC approves Huawei-Symantec JV (26/12/07) [ Network Design ]

• Market research: Holiday CE sales declined this year (26/12/07) [ Manufacturing/Packaging ]
• Report: Apple negotiates to launch iPhone in Japan (26/12/07) [ RF/Wireless Design ]
• AMD: Barcelona issues effect quad-core distribution (26/12/07) [ Embedded Design ]
• Global economic woes lower chip revenue growth in 2008 (26/12/07) [ Manufacturing/Packaging ]
• Hybrid ASIC enables rapid, economical product devt (24/12/07) [ EDA ]

• RF audio solution avoids interference within power budget (24/12/07) [ RF/Wireless Design ]
• Aldec introduces multi-threaded VHDL compilation (24/12/07) [ EDA ]
• UTStarcom, BSNL launch multiplay broadband services (24/12/07) [ RF/Wireless Design ]
• Cranes releases NISA 64bit with multicore capability (24/12/07) [ Embedded Design ]
• Aeroflex adds encryption support to its base station tester (24/12/07) [ Test & Measurement ]

• Fujitsu packs high-speed connectivity into 3.5G devices (24/12/07) [ Embedded Design ]
• Adlink unveils multislot PCIe-to-PCI extension systems (24/12/07) [ Interface Design ]
• ASSOCHAM: Defence import to reach Rs.118,379.91 crore ($30bn) by 2012 (24/12/07) [ Embedded Design ]
• RFMD acquires Filtronic Compound Semiconductors (24/12/07) [ RF/Wireless Design ]
• Apple closes down Mac enthusiast website (24/12/07) [ Embedded Design ]

• Report: Software errors to reduce hybrid drive shipments (24/12/07) [ Embedded Design ]
• Three Japan firms negotiate to produce LCD panels (24/12/07) [ Manufacturing/Packaging ]
• Nokia, RadioFrame team to develop 3G femtocell tech (24/12/07) [ RF/Wireless Design ]
• Researchers create synthetic fuel from sunlight, CO₂, water (24/12/07) [ Power Design ]
• Agilent acquires life science lab robotics company (24/12/07) [ Test & Measurement ]

• Automotive grade BLDC motor controller ICs debut (21/12/07) [ Embedded Design ]
• Transceiver suits factory automation apps (21/12/07) [ RF/Wireless Design ]
• Power conversion solution for buck apps debuts (21/12/07) [ Network Design ]
• CML limiting post amps offer twice the signal gain (21/12/07) [ Signals ]
• Raltron unveils PLL VCOs for RF apps (21/12/07) [ RF/Wireless Design ]

• Audio baseband chip for wireless platforms debuts (21/12/07) [ Embedded Design ]
• Red Hat announces virtualization at no additional cost (21/12/07) [ Embedded Design ]
• Infineon touts 'smallest' TVS diodes (21/12/07) [ Embedded Design ]
• Cypress plans to sell Texas fab (21/12/07) [ Manufacturing/Packaging ]
• Cisco details its plan to push WLAN in 2008 (21/12/07) [ RF/Wireless Design ]

• Israeli researchers write 'nano-Bible' (21/12/07) [ Manufacturing/Packaging ]
• 266 bidders eye 700MHz auction (21/12/07) [ RF/Wireless Design ]
• NEC cuts investment on research, chip factories (21/12/07) [ RF/Wireless Design ]
• iSuppli finds unique design features in iPod Touch (21/12/07) [ Interface Design ]
• NASSCOM: IT to boost Indian auto component industry (21/12/07) [ Embedded Design ]

• Top ten wireless trends in 2008 (21/12/07) [ RF/Wireless Design ]