• SEMI releases 11 tech standards (20/02/07) [ Manufacturing/Packaging ]
• Court favours TI on infringement lawsuit (20/02/07) [ Embedded ]
• SK Telecom, WJ ink RFID solutions agreement (20/02/07) [ RF/Microwave ]
• TI enters medical electronics arena (20/02/07) [ Embedded ]
• ESS sells HD-DVD, Blu-ray tech (20/02/07) [ Memory/Storage ]

• Cisco extends Apple's deadline in iPhone lawsuit (20/02/07) [ Embedded ]
• Silicon Hive to supply processors for MagnaChip image sensors (20/02/07) [ Embedded ]
• LSI to acquire SiliconStor (20/02/07) [ Networks ]
• RFMD integrates shielding tech into RFICs (20/02/07) [ Amplifiers/Converters ]
• Dell joins HyperTransport Consortium (20/02/07) [ Networks ]

• OmniVision rolls VGA camera chip sensor for ultrathin apps (20/02/07) [ Amplifiers/Converters ]
• MOSFETs offer system efficiency, space optimisation (20/02/07) [ Power/Alternative Energy ]
• GNSS receivers support position location in handsets (20/02/07) [ Embedded ]
• Data-parallel DSPs offer 80GMACs/s performance (20/02/07) [ Embedded ]
• Tactile switches eye handheld devices (20/02/07) [ Networks ]

• ST samples 'smallest' 65nm NOR flash (20/02/07) [ Memory/Storage ]
• UMTS transmit system targets multi-mode 3G handsets (20/02/07) [ RF/Microwave ]
• Software enables RTOS to run simultaneously with general purpose OS (20/02/07) [ Embedded ]
• Power MOSFETs suit space-constrained apps (20/02/07) [ Power/Alternative Energy ]
• NI intros high-performance PXI embedded controllers (20/02/07) [ Embedded ]

• Outsourcing not slowing down, says study (19/02/07) [ Manufacturing/Packaging ]
• IBM, Nortel expand existing IPM pact (19/02/07) [ RF/Microwave ]
• Crolles2 alliance continues work despite issues (19/02/07) [ Manufacturing/Packaging ]
• IBM to put 48MB on next-gen microprocessor (19/02/07) [ Embedded ]
• Sony to follow fab-lite operation on semi biz (19/02/07) [ Manufacturing/Packaging ]

• Motorola licenses TTPCom tech to Marvell (19/02/07) [ Embedded ]
• The future of test is virtual, says NI (19/02/07) [ EDA/IP ]
• International conference on contract manufacturing held in Delhi (19/02/07) [ Manufacturing/Packaging ]
• ST, BITS Pilani, IIT to set up research labs (19/02/07) [ EDA/IP ]
• Microchip releases energy-measurement IC (19/02/07) [ Amplifiers/Converters ]

• MCU integrates 8bit CPU core, voice synthesis LSI (19/02/07) [ Embedded ]
• Camera captures better images for mobile handsets (19/02/07) [ Optoelectronics/Displays ]
• HEDGE processor targets HSDPA, W-CDMA (19/02/07) [ Embedded ]
• Microsoft rolls out .NET toolkit for embedded systems (19/02/07) [ Embedded ]
• WiMAX PA supports 802.16e-2005 standard (19/02/07) [ RF/Microwave ]

• LDO regulator withstands 80V input at 140°C (19/02/07) [ Power/Alternative Energy ]
• FPGA design kit expands analyser capabilities (19/02/07) [ Embedded ]
• Cable assemblies suit rugged, high speed apps (19/02/07) [ Interface ]
• Altera intros design platform for automotive apps (19/02/07) [ Embedded ]
• Designing low-power multi-processor chips (16/02/07) [ Amplifiers/Converters ]

• View from assertion-level logic for circuit design (16/02/07) [ EDA/IP ]
• Venture capital shows increasing trend again (16/02/07) [ EDA/IP ]
• Circuit designers take control over layout parameters (16/02/07) [ EDA/IP ]
• Overcoming challenges in implant system design (16/02/07) [ Embedded ]
• Electronics gears up for health care devices (16/02/07) [ Embedded ]

• Amimon demos interface for HDTV video (16/02/07) [ Interface ]
• Data centre power still a major concern (16/02/07) [ Power/Alternative Energy ]
• Long way to go for multi-core processors (16/02/07) [ Embedded ]
• Home network still untamed territory (16/02/07) [ RF/Microwave ]
• Digital content issues remain (16/02/07) [ Embedded ]

• Entrepreneurs target space market (16/02/07) [ Embedded ]
• Wi-Fi enables Internet radio (16/02/07) [ RF/Microwave ]
• Antenova module integrates GPS radio IC and antenna (16/02/07) [ RF/Microwave ]
• Vishay IR sensor targets code learning apps (16/02/07) [ Amplifiers/Converters ]
• Power amp optimises battery life of 3G handsets (16/02/07) [ Amplifiers/Converters ]

• Broadcom, Skyworks announce EDGE solutions for mobile phones (16/02/07) [ Embedded ]
• Frontier Silicon DVB-H receiver enables smaller mobile TVs (16/02/07) [ Amplifiers/Converters ]
• Platform enables 'error-free delivery' of media files to mobile TV (16/02/07) [ Embedded ]
• Radio solution eliminates need to individually filter each FM channel (16/02/07) [ Amplifiers/Converters ]
• India to lead global semicon design (15/02/07) [ EDA/IP ]

• Study 'grades' India's semicon industry (15/02/07) [ EDA/IP ]
• ST deploys Synopsys compiler for ASIC design flow (15/02/07) [ Embedded ]
• CEVA develops fully programmable multi-media solution (15/02/07) [ Embedded ]
• Renesas licenses ARM processor for mobile, CE apps (15/02/07) [ Embedded ]
• Wafer shipments increase by 20% in '06 (15/02/07) [ Manufacturing/Packaging ]

• Infineon closes Israeli UWB R&D operation (15/02/07) [ RF/Microwave ]
• Crolles2 reports no new partnerships (15/02/07) [ Manufacturing/Packaging ]
• More than 100 crore Wi-Fi chips to ship in 2012 (15/02/07) [ RF/Microwave ]
• Wireless industry's growth to slow dramatically (15/02/07) [ RF/Microwave ]
• ST delays DVB-H mobile chip development (15/02/07) [ RF/Microwave ]

• Chipnuts rolls 'platform' for smartphones (15/02/07) [ Embedded ]
• ADI launches integrated 3G transceivers (15/02/07) [ RF/Microwave ]
• AMD releases 3 processors for mobile apps (15/02/07) [ Embedded ]
• CSR unveils embedded GPS software for short TTFF (15/02/07) [ Embedded ]
• Image sensors suit camera phones (15/02/07) [ Amplifiers/Converters ]

• austriamicro launches 'smallest' 700mA flash LED driver (15/02/07) [ Amplifiers/Converters ]
• Dual SIM card power supply IC features fast channel transition (15/02/07) [ Power/Alternative Energy ]
• Atmel integrates MCU, LIN SBC in one package (15/02/07) [ EDA/IP ]
• 1Gb mobile DRAM chip eyes feature-rich phones (15/02/07) [ Memory/Storage ]
• Sequence Design announces 'statistically accurate' PVT corner extraction (15/02/07) [ Embedded ]

• Signal generator features phase synchronous channels (14/02/07) [ T&M ]
• SiGe RFIC switch features single-voltage control (14/02/07) [ RF/Microwave ]
• Statistical tool avoids overdesign (14/02/07) [ EDA/IP ]
• RF transceiver eases EDGE handset designs (14/02/07) [ Embedded ]
• TI introduces multi-core DSPs for wireless apps (14/02/07) [ Embedded ]

• Infineon announces power efficient chip solutions (14/02/07) [ RF/Microwave ]
• Current sense amplifier offers 'unprecedented flexibility' (14/02/07) [ Amplifiers/Converters ]
• Dual-head PMC displays two graphic streams (14/02/07) [ Optoelectronics/Displays ]
• High-current inductors feature high frequency ranges (14/02/07) [ Power/Alternative Energy ]
• PWM control IC targets DC/DC buck apps (14/02/07) [ Power/Alternative Energy ]

• Comneon, Infineon, FSMLabs join hands on Linux-based phone (14/02/07) [ Embedded ]
• SiRF, NXP collaborate on GPS-enabled 3G handsets (14/02/07) [ RF/Microwave ]
• China IT exports jump 35% (14/02/07) [ Embedded ]
• Huawei sales witness 34% hike (14/02/07) [ RF/Microwave ]
• AUO posts 28% higher revenue in Jan (14/02/07) [ Manufacturing/Packaging ]

• Irico announces investment to set up LCD fab (14/02/07) [ Manufacturing/Packaging ]
• ST, AMD sign mobile graphics agreement (14/02/07) [ Embedded ]
• HDMI adoption in desktop, notebook PCs increases (14/02/07) [ Interface ]
• Wi-Fi/Bluetooth products continue to spread (14/02/07) [ RF/Microwave ]
• Government initiatives to push electronics sector (13/02/07) [ EDA/IP ]

• SCL to conduct advanced R&D for strategic sectors (13/02/07) [ EDA/IP ]
• DRAM ASP falls by 30% (13/02/07) [ Manufacturing/Packaging ]
• Qualcomm, Huawei to deliver TV to mobile solution (13/02/07) [ RF/Microwave ]
• Analogix denies lawsuit charges by Silicon Image (13/02/07) [ RF/Microwave ]
• Intel announces teraflop capacity on a chip (13/02/07) [ EDA/IP ]

• PCIe spec extends 'outside the box' (13/02/07) [ Networks ]
• Freescale tops automotive IC market (13/02/07) [ Embedded ]
• ITC to investigate Hynix on NAND flash import (13/02/07) [ Memory/Storage ]
• eInfochips sets up 4th design centre in Ahmedabad (13/02/07) [ EDA/IP ]
• Phone platform targets Japan market (13/02/07) [ Embedded ]

• D-wave releases quantum processor (13/02/07) [ Embedded ]
• Low-cost accelerometer targets vehicle safety requirements (13/02/07) [ Embedded ]
• RMI launches midrange processor family (13/02/07) [ Embedded ]
• Serdes ICs reduce number of interconnect leads (13/02/07) [ Interface ]
• Elektrobit intros latest version of air interface emulator (13/02/07) [ Embedded ]

• Minidrive performs high precision motion control (13/02/07) [ Amplifiers/Converters ]
• MDTV chip enables longer battery life (13/02/07) [ RF/Microwave ]
• Power resistors feature wide resistance range (13/02/07) [ Power/Alternative Energy ]
• High-voltage LED driver targets automotive apps (13/02/07) [ Amplifiers/Converters ]
• Fairchild rolls MOSFET gate drivers for industrial apps (12/02/07) [ Power/Alternative Energy ]

• Freescale unveils smallest 3G RF subsystem (12/02/07) [ RF/Microwave ]
• Catalyst claims highest efficiency charge pump (12/02/07) [ Embedded ]
• Coaxial design tool offers 2D electromagnetic simulation (12/02/07) [ T&M ]
• ADI claims smallest multi-channel DACs (12/02/07) [ Amplifiers/Converters ]
• Memory-based security rolled out for handsets (12/02/07) [ Amplifiers/Converters ]

• 90nm read channel halves power consumption for CE apps (12/02/07) [ Power/Alternative Energy ]
• Power inductors feature tight tolerances, low DC resistance (12/02/07) [ Power/Alternative Energy ]
• Pushbutton switches target industrial, CE apps (12/02/07) [ Networks ]
• Optimisation tool supports spatial modelling (12/02/07) [ EDA/IP ]
• NSC revises revenue forecast (12/02/07) [ Embedded ]

• Omron, RS Components sign distribution agreement (12/02/07) [ Embedded ]
• LCD TV sector to grow by 23.4% (12/02/07) [ Manufacturing/Packaging ]
• India should resist wafer fab subsidies (12/02/07) [ Manufacturing/Packaging ]
• PAM, TSMC to develop BCD tech (12/02/07) [ Power/Alternative Energy ]
• Corning expands Gen 8 capacity in Japan (12/02/07) [ Manufacturing/Packaging ]

• Six firms collaborate to develop 3G handset platform (12/02/07) [ RF/Microwave ]
• CSR announces joining Bluetooth, FM bandwagon (12/02/07) [ RF/Microwave ]