• NEC fault-tolerant server features two quad-core Xeon processors (31/07/07) [ Embedded ]
• Toshiba expands Transmemory USB flash memory devices (31/07/07) [ Memory/Storage ]
• Qualcomm unveils UMB reference design (31/07/07) [ RF/Microwave ]
• ON Semi unveils integrated power switching solution (31/07/07) [ EDA/IP ]
• AMD develops x86 core, eight-core CPU (31/07/07) [ Embedded ]

• Tektronix develops RFXpress for digital testing (31/07/07) [ T&M ]
• S&P: AMD's debt-rating could be lowered (31/07/07) [ Manufacturing/Packaging ]
• Wipro India joins IMS Forum (31/07/07) [ Networks ]
• BMW cars to feature hands-free phonekits (31/07/07) [ RF/Microwave ]
• RC car is fraught with design tradeoffs (30/07/07) [ Manufacturing/Packaging ]

• Agilent TDC features 6 independent stopwatches (30/07/07) [ T&M ]
• austria develops DC/DC converter for portable apps (30/07/07) [ Power/Alternative Energy ]
• Altera FPGA supports industrial Ethernet IP cores (30/07/07) [ RF/Microwave ]
• Adlink unveils 128-CH high-density DIO PCI card (30/07/07) [ EDA/IP ]
• picoPower AVR MCUs suit low power apps (30/07/07) [ Embedded ]

• Chip offers effective arc suppression (30/07/07) [ Amplifiers/Converters ]
• Matsushita, Renesas team to develop 32nm chip (30/07/07) [ Manufacturing/Packaging ]
• Infineon extends ARM license deal (30/07/07) [ Embedded ]
• Lenovo to open manufacturing facilities in Mexico, India (30/07/07) [ Manufacturing/Packaging ]
• IEEE groups evaluate VSIA?s QIP standard (30/07/07) [ EDA/IP ]

• EU accuses Intel of anticompetitive strategies (27/07/07) [ Embedded ]
• CE vendors question Simplay labs' test program (27/07/07) [ T&M ]
• AMD, IC makers to develop memory extender tech (27/07/07) [ Embedded ]
• Intel develops 40Gbps silicon optical modulator (27/07/07) [ Networks ]
• ARM, Intrinsity team extends Cortex-R4 performance (27/07/07) [ Embedded ]

• Faraday integrates UWB MAC into SoC designs (27/07/07) [ EDA/IP ]
• Fujitsu unveils biometric security tools (27/07/07) [ Embedded ]
• 'First' PCIe-based AWG board debuts (27/07/07) [ Amplifiers/Converters ]
• 10GbE chip delivers up to 8Gbps of iSCSI traffic (27/07/07) [ Embedded ]
• Intel ships fast quad-core server platform (27/07/07) [ Embedded ]

• AMD intensifies strategies to improve profits (27/07/07) [ Embedded ]
• Japanese chip makers plan next-gen chip alliance (27/07/07) [ Manufacturing/Packaging ]
• Qualcomm becomes no.1 mobile chips supplier: iSuppli (27/07/07) [ RF/Microwave ]
• Motorola-Microvision deal redefines mobile media (27/07/07) [ Optoelectronics/Displays ]
• Continental acquires Siemens car biz (27/07/07) [ Embedded ]

• Foreign players dominate Indian electronics space (27/07/07) [ Manufacturing/Packaging ]
• NXP promotes WUSB for mobile computing users (26/07/07) [ RF/Microwave ]
• Femtocells face tech, commercial hurdles (26/07/07) [ RF/Microwave ]
• Mentor collaborates with RV-VLSI for HEP (26/07/07) [ EDA/IP ]
• USB-IF certifies four wireless USB products (26/07/07) [ RF/Microwave ]

• Infineon unveils scalable MCU for car safety apps (26/07/07) [ Embedded ]
• DC-DC converter offers wide input voltage range (26/07/07) [ Power/Alternative Energy ]
• NI unveils low-cost 6.5-digit multimeter for PXI (26/07/07) [ T&M ]
• Dual digital transceiver integrates DDC, Interpolation (26/07/07) [ Embedded ]
• Xilinx touts Spartan-3A DSP low power device (26/07/07) [ Amplifiers/Converters ]

• Quad instrumentation amp features low offset voltage (26/07/07) [ Amplifiers/Converters ]
• Complications further delay India 3G rollout (26/07/07) [ RF/Microwave ]
• IBM, ST team on next-gen process tech (26/07/07) [ Manufacturing/Packaging ]
• Fujitsu blade server simplifies network set-up (25/07/07) [ Networks ]
• 16-port transceiver offers high integration (25/07/07) [ RF/Microwave ]

• Micrel unveils fast transient performance regulators (25/07/07) [ Power/Alternative Energy ]
• Intel 10GbE supports pre-std congestion mgmt (25/07/07) [ Interface ]
• Magnachip rolls LCD driver IC for high-resolution handsets (25/07/07) [ Optoelectronics/Displays ]
• Mentor Graphics unveils enhanced CHS product suite (25/07/07) [ EDA/IP ]
• Auto, CE needs to sustain MEMS sensor growth (25/07/07) [ Manufacturing/Packaging ]

• Presto acquires Cypress test facility (25/07/07) [ T&M ]
• Electronic firms enhance 'green' practices: Greenpeace (25/07/07) [ Manufacturing/Packaging ]
• OLPC approves mass production of XO laptops (25/07/07) [ Embedded ]
• Siemens to develop driver assistance system (25/07/07) [ Amplifiers/Converters ]
• IC tool makers reluctant to gear up for 450mm wafers (25/07/07) [ Manufacturing/Packaging ]

• 2.2GHz VME board synchronises multiple modules (24/07/07) [ Embedded ]
• TI unveils multi-channel, 24-bit industrial ADCs (24/07/07) [ Amplifiers/Converters ]
• GDA's PCI Express Gen 2 Controller IP available (24/07/07) [ EDA/IP ]
• Adlink touts 96-CH PCIe analogue input DAQ card (24/07/07) [ Amplifiers/Converters ]
• Qimonda samples 75nm low-power Mobile RAM (24/07/07) [ Memory/Storage ]

• Fiber-to-RS485/422/232 interface converter suits defence apps (24/07/07) [ Interface ]
• Sequence tool enhances Faraday low power design flow (24/07/07) [ EDA/IP ]
• Reliance awards Huawei $200M network expansion contract (24/07/07) [ RF/Microwave ]
• Acer responds to HP patent case (24/07/07) [ Embedded ]
• IEEE plans 40/100GbE specs draft (24/07/07) [ Networks ]

• Siemens negotiates for its auto biz sale (24/07/07) [ Manufacturing/Packaging ]
• Femtocell pioneer secures funding from Google (24/07/07) [ Embedded ]
• Broadcom-Verizon deal benefits Qualcomm (23/07/07) [ RF/Microwave ]
• Nokia handsets to have built-in A-GPS (23/07/07) [ Embedded ]
• EC approves Germany's aid for AMD fab (23/07/07) [ Manufacturing/Packaging ]

• PC giants enter smartphone business (23/07/07) [ Embedded ]
• Researcher: Future cars will have more visual intelligence (23/07/07) [ Embedded ]
• IBM signs license deal for Pb-free process (23/07/07) [ Manufacturing/Packaging ]
• Maxim debuts dual DPLL line-card timing chip (23/07/07) [ RF/Microwave ]
• EtherCAT tech targets Cyclone III FPGAs (23/07/07) [ EDA/IP ]

• Kiethley touts Linux-based parametric test systems (23/07/07) [ T&M ]
• Manufacturability-optimised reconfigurable logic for 65nm, 45nm nodes debuts (23/07/07) [ EDA/IP ]
• DSP processing card suits demanding apps (23/07/07) [ Embedded ]
• Atmel unveils low-cost half-bridge driver IC (23/07/07) [ Embedded ]