• Battery charger ICs improve capabilities (01/03/08) [ Power/Alternative Energy ]
• Laird introduces MCPCB laminate for LED apps (29/02/08) [ Embedded ]
• Geensys touts AUTOSAR development kit (29/02/08) [ Embedded ]
• Agilent, Beceem collaborates for WiMAX test solution (29/02/08) [ T&M ]
• ASUS launches OC Version for NVIDIA GPU (29/02/08) [ Embedded ]

• 16bit MCU contains high-res dot matrix LCD driver (29/02/08) [ Embedded ]
• Intel offers 45nm processors (29/02/08) [ Embedded ]
• RF amp meets emerging GPON market demands (29/02/08) [ Amplifiers/Converters ]
• Microchip tips low-cost 8bit Flash PIC MCUs (29/02/08) [ Embedded ]
• TI unveils four OMAP35X processors (29/02/08) [ Embedded ]

• EU levels $1.4B antitrust fine against microsoft (29/02/08) [ Embedded ]
• Software encryption-based tech for MCUs debuts (29/02/08) [ Embedded ]
• ITC declines to review Qualcomm-Nokia case decision (29/02/08) [ RF/Microwave ]
• ETSI approves HCI spec for NFC on handsets (29/02/08) [ Embedded ]
• France buys out 2.85% stake in ST (29/02/08) [ Manufacturing/Packaging ]

• Sun, China govt ink Sparc IC design training deal (29/02/08) [ EDA/IP ]
• Group to build underwater broadband cable system (29/02/08) [ Networks ]
• Automotive electronics market stays in drive (28/02/08) [ Optoelectronics/Displays ]
• SandForce licenses Tensilica's RISC controller core (28/02/08) [ Embedded ]
• ADI launches lowest power voltage-feedback amp (28/02/08) [ Power/Alternative Energy ]

• ARM to support Texas technology & platform (28/02/08) [ Embedded ]
• Xilinx EDK includes no-fee peripheral IP cores (28/02/08) [ EDA/IP ]
• Rectification module increases power, space efficiency (28/02/08) [ Power/Alternative Energy ]
• Freescale, ST co-develop automotive MCUs (28/02/08) [ Embedded ]
• MOSFETs tout 30% increase in power density (28/02/08) [ Power/Alternative Energy ]

• S2C releases third-gen rapid SoC prototyping tool (28/02/08) [ EDA/IP ]
• CPRI-based functional interconnect chips debut (28/02/08) [ Networks ]
• Crypto IC provides plug-and-play host-side security (28/02/08) [ Embedded ]
• Fingerprint sensors gain headway into consumer markets (28/02/08) [ Amplifiers/Converters ]
• Nokia demo nanotech-based flexible handsets (28/02/08) [ RF/Microwave ]

• Analysis: Demise of India's big fab story (28/02/08) [ Manufacturing/Packaging ]
• HP, U.K. group develop GPS-based software devt platform (28/02/08) [ Interface ]
• Nvidia: Supercomputers will have GPUs by 2012 (28/02/08) [ Embedded ]
• iSupply: Texas tops in multimedia coprocessors in 2007 (27/02/08) [ RF/Microwave ]
• LDRA launches embedded verification solution (27/02/08) [ Embedded ]

• ADLINK unveils embedded computing platforms (27/02/08) [ Embedded ]
• Synopsys intros low power solution for chip devt (27/02/08) [ Embedded ]
• TI touts closed-loop, digital-input speaker amp (27/02/08) [ Embedded ]
• Digital power controller aims high-reliability systems (27/02/08) [ Embedded ]
• Programmable receiver features jam avoidance (27/02/08) [ RF/Microwave ]

• MCU targets portable, remote apps (27/02/08) [ Embedded ]
• NXP's small signal MOSFETs targets portable devices (27/02/08) [ Power/Alternative Energy ]
• Will Apple meet its targeted sales for iPhone? (27/02/08) [ Embedded ]
• Microsoft withdraws HD DVD from Xbox (27/02/08) [ Embedded ]
• Professor outlines gravity of problem in parallel prog (27/02/08) [ Embedded ]

• Nanoparticles to lower costs of hydrogen fuel cells (27/02/08) [ Manufacturing/Packaging ]
• Motorola acquires cable STB provider in China (27/02/08) [ Amplifiers/Converters ]
• Infrastructure remains a challenge for India (27/02/08) [ Embedded ]
• Intel gets approval for 65nm at China fab (27/02/08) [ Manufacturing/Packaging ]
• SkyTraq to showcase AGPS solutions at CeBIT 2008 (26/02/08) [ EDA/IP ]

• Kontron to acquire Thales Computers (26/02/08) [ Embedded ]
• Microsoft makes changes to expand interoperability (26/02/08) [ Embedded ]
• ASUS launches GPS PDA phone in India (26/02/08) [ RF/Microwave ]
• Infineon tips three-phase motor-control devt kit (26/02/08) [ Embedded ]
• LabVIEW 8.5 introduces new design features (26/02/08) [ Embedded ]

• ARM software enhances 3D graphics in mobiles (26/02/08) [ Embedded ]
• Intersil touts full-featured, AC-driven RTCs (26/02/08) [ T&M ]
• IBM x servers select LSI's ROC, MegaRAID tech (26/02/08) [ Embedded ]
• SEGGER's RTOS supports Atmel's AVR32 MCU (26/02/08) [ Embedded ]
• Infineon MCUs to control next BMW M engines (26/02/08) [ Embedded ]

• TATA net deploys Huawei All-IP CDMA solution (26/02/08) [ RF/Microwave ]
• India minister: Reliance Industries to set up fab (26/02/08) [ Manufacturing/Packaging ]
• Nanogenerators power clothing fabrics (26/02/08) [ Manufacturing/Packaging ]
• What is behind Microsoft's openness pledge? (26/02/08) [ Embedded ]
• Israel sees tech regression due to brain drain (26/02/08) [ EDA/IP ]

• Trango Hypervisor virtualises Atmel's microcontroller (25/02/08) [ Embedded ]
• Microsoft launches digital ad platform in India (25/02/08) [ Embedded ]
• Aeroflex wins contract to supply test solutions (25/02/08) [ T&M ]
• ST tips power MOSFETs for demanding DC/DC supplies (25/02/08) [ Power/Alternative Energy ]
• Hall-effect sensor touts programmable MCU, LIN 2.0 interface (25/02/08) [ Amplifiers/Converters ]

• PowerPC processor targets cost-sensitive apps (25/02/08) [ Embedded ]
• 16Bit, 105Msps ADC consumes half power (25/02/08) [ Amplifiers/Converters ]
• Adapter design for CCCV mobile chargers launched (25/02/08) [ Power/Alternative Energy ]
• Multilayer chip capacitors stabilise ESR values (25/02/08) [ Amplifiers/Converters ]
• Nokia, Qualcomm settle to speed up patent case (25/02/08) [ RF/Microwave ]

• Huawei-3Com tie-up faces another roadblock (25/02/08) [ RF/Microwave ]
• ABI: Handset accessories sale to hit $40B in 2008 (25/02/08) [ RF/Microwave ]
• Synopsys exe: India far ahead in design curve (25/02/08) [ EDA/IP ]
• ISA, SEMI to promote IC, PV manufacturing in India (25/02/08) [ Manufacturing/Packaging ]
• Freescale claims 45% of auto MCU market (25/02/08) [ Embedded ]

• DisplaySearch: TFT-LCD materials market to be flat in '08 (25/02/08) [ Manufacturing/Packaging ]
• ADLINK launches ultra-compact controller (22/02/08) [ Embedded ]
• RFMD intros location solutions for GPS (22/02/08) [ RF/Microwave ]
• Optical compensators target 3LCD panels (22/02/08) [ Optoelectronics/Displays ]
• Toshiba touts fastest circuit tech for embedded DRAM (22/02/08) [ Embedded ]

• Flash MCUs offer highest performance-to-power ratio (22/02/08) [ Embedded ]
• 'First' quad equaliser for 8Gbit/s PCIe apps debuts (22/02/08) [ Amplifiers/Converters ]
• Altera ships automotive-grade devices (22/02/08) [ EDA/IP ]
• Intel unveils dual socket Extreme desktop platform (22/02/08) [ Embedded ]
• Toshiba, Sony form high-performance IC JV (22/02/08) [ Embedded ]

• Phoenix, Seagate team to secure mobile PCs (22/02/08) [ Embedded ]
• Polysilicon supply to meet solar cell sector demand (22/02/08) [ Manufacturing/Packaging ]
• iSuppli warns on NAND flash slowdown (22/02/08) [ Memory/Storage ]
• Alliance to push PC as gaming platform (22/02/08) [ Embedded ]
• TES expands workforce in India (22/02/08) [ EDA/IP ]

• Survey: Will 450mm wafers ever happen? (22/02/08) [ Manufacturing/Packaging ]
• India has a long way to go before launching global brands (22/02/08) [ EDA/IP ]
• Hathway touts cable DVR service (21/02/08) [ Optoelectronics/Displays ]
• HP intros entry-level disk arrays (21/02/08) [ Embedded ]
• Portable spectrum analyser tests WLAN, WiMAX, W-CDMA (21/02/08) [ T&M ]

• Tensilica processors support Avnet's Virtex-4 dev kit (21/02/08) [ EDA/IP ]
• Ref design for 200W power adaptors debuts (21/02/08) [ Power/Alternative Energy ]
• GSM/GPRS transmit module aim emerging markets (21/02/08) [ RF/Microwave ]
• White multichip LEDs pledge superior colour balance (21/02/08) [ Power/Alternative Energy ]
• Report: Microsoft plans to oust Yahoo's board (21/02/08) [ Embedded ]

• Sun selects TSMC to fab its 45nm processors (21/02/08) [ Embedded ]
• India set to take on the role of tech leader (21/02/08) [ Embedded ]
• HD DVD collapses, Blu-ray claims crown (21/02/08) [ Embedded ]
• Samsung ink multiyear license for Tensilica audio DSP (21/02/08) [ Interface ]
• Microchip announces expanded Design Partner program (21/02/08) [ Manufacturing/Packaging ]

• IBM plans to set up a prototype fab in Kolkata (21/02/08) [ Manufacturing/Packaging ]
• Abu Dhabi pledges to invest $15B in cleantech (21/02/08) [ Manufacturing/Packaging ]