• WiMAX developers target Wave 2 development (01/07/08) [ Embedded ]
• IETF aims to define IP specs (01/07/08) [ RF/Microwave ]
• Microcontrollers embrace USBs (01/07/08) [ Embedded ]
• Global PC shipments rose to 69.9 million units (01/07/08) [ Manufacturing/Packaging ]
• Guide to low-power wireless network apps (01/07/08) [ RF/Microwave ]

• Synopsys preps for 'techonomic' challenges (01/07/08) [ EDA/IP ]
• Who is the boss at Infineon, Kley or Bauer? (01/07/08) [ Manufacturing/Packaging ]
• Is Intel's Atom designed into future iPhone? (01/07/08) [ Embedded ]
• Resistor offers improved load-life stability (01/07/08) [ Power/Alternative Energy ]
• TI rolls free Zigbee-certified Z-Stack software (01/07/08) [ Embedded ]

• Handheld tester supports dual MoCA test interface (01/07/08) [ T&M ]
• Power amplifier targets linear 802.11b/g apps (01/07/08) [ RF/Microwave ]
• NEC boosts CPU peripheral line (01/07/08) [ Interface ]
• Quatech ships embedded radio modules (01/07/08) [ Embedded ]
• Dual operational amplifier suits home appliances (01/07/08) [ Power/Alternative Energy ]

• Thermal distribution in LSI "visualised" (01/07/08) [ Embedded ]
• Two groups focus on femtocells in mobile networks (30/06/08) [ RF/Microwave ]
• SuitSat pushes engineers' limits (30/06/08) [ EDA/IP ]
• Future of wireless set-top boxes still unclear (30/06/08) [ RF/Microwave ]
• Auto industry is reluctant to innovation, says study (30/06/08) [ T&M ]

• ST, NXP JV address mobile apps (30/06/08) [ RF/Microwave ]
• Researchers demo excitonic transistor (30/06/08) [ Embedded ]
• Idea, TMI to acquire Spice Group (30/06/08) [ Networks ]
• Bluetooth, Wi-Fi evolve in different directions (30/06/08) [ RF/Microwave ]
• FCRAM runs on low power (30/06/08) [ Power/Alternative Energy ]

• Active splitters for CATV STBs debut (30/06/08) [ RF/Microwave ]
• Mini GPS module enables fast time-to-market (30/06/08) [ RF/Microwave ]
• ARC offers multimedia codecs with licensing model (30/06/08) [ Embedded ]
• Gate driver ICs target motor drive apps (30/06/08) [ Embedded ]
• Thick film resistor saves board space (30/06/08) [ EDA/IP ]

• Module simplifies data storage requirements (30/06/08) [ Embedded ]
• Charger controller minimises power dissipation (30/06/08) [ Embedded ]
• Chip runs UWB over coax, Ethernet (27/06/08) [ RF/Microwave ]
• Agility rolls platform for image, signal processing (27/06/08) [ Embedded ]
• Lattice debuts new IP core products for wireless (27/06/08) [ Embedded ]

• 850nm IR emitters with viewing angles of ±10° and ±18° (27/06/08) [ Optoelectronics/Displays ]
• Start-up boosts video over WiFi (27/06/08) [ Embedded ]
• Modulator driver targets 10Gbps apps (27/06/08) [ Embedded ]
• PMIC backs up DDR battery (27/06/08) [ Power/Alternative Energy ]
• Multiphase DC/DC controller gives high power (27/06/08) [ Power/Alternative Energy ]

• Eco-friendly car arrives in Delhi (27/06/08) [ Power/Alternative Energy ]
• World TV IC market up 26% in Q1 08 (27/06/08) [ Optoelectronics/Displays ]
• ip.access connects homes with femtocells (27/06/08) [ RF/Microwave ]
• RFID devices interfere with medical equipment (27/06/08) [ RF/Microwave ]
• IBM, Zurich University put up joint nanotech lab (27/06/08) [ Embedded ]

• Seven things about the Nokia-Symbian deal (27/06/08) [ Embedded ]
• Spansion rolls DRAM replacement for data centres (27/06/08) [ Embedded ]
• India pushes clean technology (27/06/08) [ Power/Alternative Energy ]
• SBC eliminates need for external PC (26/06/08) [ Embedded ]
• GaAs FETs optimised for power efficiency (26/06/08) [ Power/Alternative Energy ]

• Silicon oscillator boasts chip-select control (26/06/08) [ Embedded ]
• Voice engine targets next-gen IP-enabled devices (26/06/08) [ Embedded ]
• Synapse re-hosts wireless mesh protocol (26/06/08) [ RF/Microwave ]
• Agilent expands VoIP testing (26/06/08) [ T&M ]
• Prototyping platform enables rapid algorithm dev't (26/06/08) [ Interface ]

• Software radio PMC module features 32 power meters (26/06/08) [ Embedded ]
• USB power manager maximises battery run time (26/06/08) [ Power/Alternative Energy ]
• Fujitsu rolls mobile WiMAX chipsets (26/06/08) [ Embedded ]
• Infineon opens R&D centre in Austria (26/06/08) [ Embedded ]
• iPhone carries $173 BOM, says iSuppli (26/06/08) [ RF/Microwave ]

• Mitsubishi partners with NVIDIA, Aspen for 3D (26/06/08) [ Embedded ]
• Group defines standards to manage boom of devices (26/06/08) [ Networks ]
• Nokia develops open mobile software platform (26/06/08) [ Embedded ]
• ST, Debiotech deliver insulin nanopump (26/06/08) [ Manufacturing/Packaging ]
• MIT, Bosch collaborate on energy research (26/06/08) [ Power/Alternative Energy ]

• IBM experiences layoff (26/06/08) [ Embedded ]
• Board Interchanger helps solve 3D design issues (26/06/08) [ Interface ]
• DuPont increases prices (26/06/08) [ Embedded ]
• Green engineering: Saving the ecosystem from hi-tech trash (25/06/08) [ EDA/IP ]
• Micropower oscillators extend battery life (25/06/08) [ RF/Microwave ]

• Atmel rolls 32-pin tinyAVR MCUs (25/06/08) [ Embedded ]
• Base band processor targets femtocell market (25/06/08) [ Embedded ]
• GPS receiver for next-gen GPS systems (25/06/08) [ RF/Microwave ]
• Controller chip enables energy harvesting (25/06/08) [ RF/Microwave ]
• Altera CPLDs travel to Shenzhen (25/06/08) [ Embedded ]

• Processor boosts networking bandwidth (25/06/08) [ Embedded ]
• Transmitter eliminates need for oscillators (25/06/08) [ RF/Microwave ]
• 32-bit ZigBee PRO wireless microcontroller debuts (25/06/08) [ Embedded ]
• ADC delivers highest signal-to-noise ratio (25/06/08) [ Embedded ]
• Software detects clock violations (25/06/08) [ EDA/IP ]

• SBC boots from NAND flash in 0.69 secs (25/06/08) [ Embedded ]
• CMO illuminates the green lighting industry (25/06/08) [ Optoelectronics/Displays ]
• Credence, LTX sign merger agreement (25/06/08) [ T&M ]
• Anwell form JV with Chinese partner (25/06/08) [ Manufacturing/Packaging ]
• Solar cell market to grow by 40 per cent (25/06/08) [ Manufacturing/Packaging ]

• Sterlite to enhance India's access networks (25/06/08) [ RF/Microwave ]
• Will Mentor fight the offer of Cadence? (25/06/08) [ EDA/IP ]
• Electron holography aims to optimise future PCs (25/06/08) [ T&M ]
• IP-enabled consumer devices to boom to 215M (25/06/08) [ Networks ]
• Tower co-develops with ON Semiconductor (25/06/08) [ Manufacturing/Packaging ]

• Group outlines LTE device interoperability testing (25/06/08) [ T&M ]
• OLLA project claims production of record-breaking OLEDs (25/06/08) [ Power/Alternative Energy ]
• Mobile WiMAX faces a range of challenges (25/06/08) [ RF/Microwave ]
• Bistable LCD maintains static images in daylight (24/06/08) [ Power/Alternative Energy ]
• Researchers demo CNT wafer-scale advances (24/06/08) [ Embedded ]

• Mobile manufacturers move to integrated RF modules (24/06/08) [ Embedded ]
• Commentary: The tough trade-offs of simplicity (24/06/08) [ EDA/IP ]
• DoCoMo eyeing more acquisitions in Asia (24/06/08) [ Networks ]
• NICE Systems select TI's DaVinci technology (24/06/08) [ Embedded ]
• Alcatel-Lucent, SpeedCast host mobile TV service in Asia (24/06/08) [ RF/Microwave ]

• NEC, Elpida form JV for display driver ICs (24/06/08) [ Embedded ]
• VLSI industry focused on 1-10 million-gate designs (24/06/08) [ Amplifiers/Converters ]
• Taiwan preps dual-core DSP, WiMAX chips (24/06/08) [ Embedded ]
• Cadence's CEO Fister: Driven by ambition (24/06/08) [ EDA/IP ]
• Hong Kong prepares for ABU Robocon (24/06/08) [ EDA/IP ]

• Temperature sensors boast measurement accuracy (24/06/08) [ Embedded ]
• Transceiver integrates power amp, LNA (24/06/08) [ RF/Microwave ]
• Boost controller aimed at battery-powered apps (24/06/08) [ Embedded ]
• RF switch delivers 'fastest' settling time (24/06/08) [ RF/Microwave ]
• Spectrum analyser show live RF view (24/06/08) [ T&M ]

• Converters feature output voltage tracking (24/06/08) [ Amplifiers/Converters ]
• High-voltage HBT devices reduce system costs (24/06/08) [ RF/Microwave ]
• Demodulator, amplifier target wireless apps (24/06/08) [ Amplifiers/Converters ]
• Designing multimedia devices made easy (24/06/08) [ EDA/IP ]
• LEDs provide low thermal resistance (24/06/08) [ Power/Alternative Energy ]

• Board level products provide FPGA support (24/06/08) [ Embedded ]
• Transceiver boasts 5km range (24/06/08) [ RF/Microwave ]
• Maxim rolls programmable analogue and digital VGA (23/06/08) [ Amplifiers/Converters ]
• ARM7-based MCU includes FPGA interface (23/06/08) [ Embedded ]
• Keithley upgrades RF development tool (23/06/08) [ Embedded ]

• Freescale reveals 'first' multi-standard accelerator (23/06/08) [ Embedded ]
• RF inductor series is QPL-qualified (23/06/08) [ RF/Microwave ]
• 'Smallest' crystal oscillator debuts (23/06/08) [ RF/Microwave ]
• Co-processor modules accelerate apps (23/06/08) [ Embedded ]
• Chip combines RF components, MCU (23/06/08) [ RF/Microwave ]

• Chip resistors offer low VCR, TCR (23/06/08) [ Power/Alternative Energy ]
• DECT/CAT-iq solution enters mass production (23/06/08) [ RF/Microwave ]
• Polar cuts capital outlay for probe tester (23/06/08) [ EDA/IP ]
• NXP is top supplier of contactless ICs, NFC apps (23/06/08) [ Embedded ]
• Nokia Siemens: Price erosion not easing (23/06/08) [ Networks ]

• PVCS to supply Intel spinoff (23/06/08) [ Manufacturing/Packaging ]
• Freescale CEO bets heavy on embedded (23/06/08) [ Embedded ]
• IC design boosts gate density for 45nm CMOS (23/06/08) [ EDA/IP ]
• Toppan, IBM to develop 32nm photomask process (23/06/08) [ Embedded ]
• IC Insights cuts IC growth forecast (23/06/08) [ Embedded ]

• Will Seagate buy Intel's stake in NAND JV? (23/06/08) [ Memory/Storage ]
• Defective DRAM parts shake market (23/06/08) [ Memory/Storage ]