• Intel invests in solar materials manufacturer (31/07/08) [ Manufacturing/Packaging ]
• HP, Intel and Yahoo! create cloud computing test bed (31/07/08) [ Embedded ]
• Semiconductor process enables 3D circuit (31/07/08) [ EDA/IP ]
• Numonyx fires dozens of contractor employees (31/07/08) [ Manufacturing/Packaging ]
• Western Digital acquires ST's HDD controller team (31/07/08) [ Embedded ]

• Researchers demo plasmonic collimator (31/07/08) [ Optoelectronics/Displays ]
• India targets $100 laptop for students (31/07/08) [ Embedded ]
• Freescale launches training programme in India (31/07/08) [ Embedded ]
• 1GHz bandwidth PXI digitiser debuts (31/07/08) [ T&M ]
• Power management ICs qualify AEC-Q100 (31/07/08) [ Power/Alternative Energy ]

• RF connector has two dielectric materials (31/07/08) [ RF/Microwave ]
• Radio-ready enclosure includes 24Vdc power supply (31/07/08) [ Embedded ]
• Controller provides Internet connectivity (31/07/08) [ Embedded ]
• Software radio modules boast speed, accuracy (31/07/08) [ RF/Microwave ]
• Converters designed for military, avionic apps (31/07/08) [ Power/Alternative Energy ]

• Caltech unveils optofluidic microscope (31/07/08) [ Embedded ]
• Handset holds surprises (30/07/08) [ RF/Microwave ]
• ST-NXP Wireless is all set to start operations (30/07/08) [ RF/Microwave ]
• Quantum3D aids Ford in virtual engineering, safety (30/07/08) [ Embedded ]
• National picks Synopsys as key EDA partner (30/07/08) [ EDA/IP ]

• Opinion: A high price for lack of alertness (30/07/08) [ Manufacturing/Packaging ]
• Indian IT firms report sharp declines in growth (30/07/08) [ Manufacturing/Packaging ]
• Intel, ARM race to power consumer computing devices (30/07/08) [ Embedded ]
• WLANs, xDSL and DSPs dominate home networking (30/07/08) [ Networks ]
• AMD to soon reveal 'asset-smart' plans? (30/07/08) [ Manufacturing/Packaging ]

• Boost converters deliver over 70mA output current (30/07/08) [ Power/Alternative Energy ]
• Frame grabber has 16 video inputs (30/07/08) [ Interface ]
• Rotary potentiometer targets heavy-duty equipment (30/07/08) [ Power/Alternative Energy ]
• Development kit features XS1-G4 target device (30/07/08) [ EDA/IP ]
• Comparators increase design flexibility (30/07/08) [ Power/Alternative Energy ]

• Processors deliver laptop-like performance (30/07/08) [ Embedded ]
• Tundra unveils RapidIO evaluation platform (30/07/08) [ Interface ]
• EXFO launches multi-service modules (30/07/08) [ T&M ]
• Can DisplayPort beat HDMI as consumers' top HD interface choice? (29/07/08) [ Interface ]
• Vishay, Yosun ink distribution deal (29/07/08) [ Manufacturing/Packaging ]

• TI refuses to back mini-tender offer (29/07/08) [ Embedded ]
• Lauterbach debuggers now support ARM Cortex-A9 (29/07/08) [ EDA/IP ]
• ST negotiates Phoenix fab sale (29/07/08) [ Manufacturing/Packaging ]
• Nokia, Qualcomm prevent 'Mobile World War' (29/07/08) [ Embedded ]
• Market drop pushes Infineon to cut 3000 jobs (29/07/08) [ Embedded ]

• Signal relay gives 7.5A maximum switching current (29/07/08) [ Power/Alternative Energy ]
• PDUs offer real-time power load monitoring (29/07/08) [ Power/Alternative Energy ]
• SPDT switch comes in mini package (29/07/08) [ RF/Microwave ]
• Ethernet controller touts higher throughput (29/07/08) [ Embedded ]
• Power meter software debuts (29/07/08) [ T&M ]

• Fujitsu launches new microcontroller driver (28/07/08) [ Embedded ]
• ProSource 8.0 features improved ray generation (28/07/08) [ Embedded ]
• Clock-distribution ICs save power, size and cost (28/07/08) [ EDA/IP ]
• Dual core single board computer debuts (28/07/08) [ Embedded ]
• Temperature sensor provides ±0.5°C accuracy (28/07/08) [ Embedded ]

• LNA increases battery lifetime (28/07/08) [ RF/Microwave ]
• Hot Swap controller suits optical networking (28/07/08) [ RF/Microwave ]
• Laser driver delivers 100mA bias current (28/07/08) [ Networks ]
• Mobile M2M market to reach $57 billion (28/07/08) [ RF/Microwave ]
• LabVIEW checks structural health of Olympic venues (28/07/08) [ EDA/IP ]

• Fujitsu addresses environmental issues (28/07/08) [ Manufacturing/Packaging ]
• ST CEO sees weaknesses in automotive, wireless (28/07/08) [ Embedded ]
• SanDisk unveils metric for SSDs (28/07/08) [ Memory/Storage ]
• European returned electronics cost $11.5 billion (28/07/08) [ Manufacturing/Packaging ]
• Intel enters SoC market (28/07/08) [ Embedded ]

• Firms turn to internal training for IT expertise (28/07/08) [ Manufacturing/Packaging ]
• Osram lab sets new record for white LEDs (25/07/08) [ Optoelectronics/Displays ]
• Funding accelerates shift from lab to fab (25/07/08) [ Embedded ]
• Nokia, Qualcomm sign new deal (25/07/08) [ RF/Microwave ]
• Who can match Jobs as Apple CEO? (25/07/08) [ Manufacturing/Packaging ]

• Is Cadence's efforts to buy Mentor driven by greed? (25/07/08) [ EDA/IP ]
• Handsets on track for growth despite ASP decline (25/07/08) [ Embedded ]
• CEA to set 3DTV standard (25/07/08) [ Embedded ]
• Five consumer giants rally around Wi-Fi variant (25/07/08) [ RF/Microwave ]
• ASUS unveils India's first netbook (25/07/08) [ Embedded ]

• GreenChip PC achieves 80 PLUS Gold certification (25/07/08) [ Power/Alternative Energy ]
• Multiphase controller features PSI mode (25/07/08) [ Embedded ]
• Flexible multiplexer has wide operating bandwidth (25/07/08) [ Interface ]
• Compact potentiometer switch saves panel space (25/07/08) [ EDA/IP ]
• Security processor consumes 0.3W power (25/07/08) [ Embedded ]

• ERNI redesigns female DIN connectors (25/07/08) [ Interface ]
• Low-power embedded microprocessor cores debut (25/07/08) [ EDA/IP ]
• HDD industry continues to thrive (24/07/08) [ Memory/Storage ]
• McObject, Waveaxis target India's software market (24/07/08) [ Embedded ]
• Three firms test femtocell reference design (24/07/08) [ Amplifiers/Converters ]

• Expect 10% chip market growth, says Penn (24/07/08) [ Embedded ]
• MIT: Optical lithography to extend to 12nm (24/07/08) [ Manufacturing/Packaging ]
• Project Galaxy to spend €6M on GALS research (24/07/08) [ RF/Microwave ]
• Low-cost cars to gain market share (24/07/08) [ Manufacturing/Packaging ]
• India targets 800 new board designs (24/07/08) [ EDA/IP ]

• TI introduces low-power processors (24/07/08) [ Embedded ]
• DC/DC converters achieve 90% efficiency (24/07/08) [ Power/Alternative Energy ]
• Samtec rolls out rugged interconnects (24/07/08) [ Interface ]
• Smallest SAW duplexers, filters debut (24/07/08) [ RF/Microwave ]
• Memory module provides high-performance to notebooks (24/07/08) [ Power/Alternative Energy ]

• Controllers target home storage systems (24/07/08) [ Embedded ]
• "Green" PC includes 50GB of free cloud storage (24/07/08) [ Embedded ]
• Entropic develops chips with EchoStar (24/07/08) [ RF/Microwave ]
• Agilent rolls 5.7Mbps HSUPA data analysis (23/07/08) [ T&M ]
• Accelerometers target automotive, industrial markets (23/07/08) [ Amplifiers/Converters ]

• PoE controller eases system design (23/07/08) [ Networks ]
• Fully-isolated transceiver debuts (23/07/08) [ Interface ]
• NEC, Skyley upgrade Zigbee platform (23/07/08) [ RF/Microwave ]
• SBC features Freescale processors (23/07/08) [ Embedded ]
• Development tool adds runtime analysis features (23/07/08) [ Embedded ]

• Power amplifier delivers high stability (23/07/08) [ RF/Microwave ]
• Which company is next in the ATE shakeout? (23/07/08) [ T&M ]
• Brocade acquires Foundry Networks (23/07/08) [ Networks ]
• Infineon powers Chinese hybrid cars (23/07/08) [ Power/Alternative Energy ]
• Energy applications for nanotech draw interest (23/07/08) [ Manufacturing/Packaging ]

• Hollywood preps for 3D TV (23/07/08) [ Embedded ]
• Commentary: What price entrepreneurship? (23/07/08) [ Manufacturing/Packaging ]
• SATS market to beat semiconductor growth (23/07/08) [ Manufacturing/Packaging ]
• Global chip market up 9.2% (23/07/08) [ Manufacturing/Packaging ]
• Schottky diodes offer low reverse leakage (22/07/08) [ Power/Alternative Energy ]

• Synopsys expands DesignWare SATA solution (22/07/08) [ EDA/IP ]
• Programmer allows quick writing of data (22/07/08) [ Embedded ]
• Laptop adapters go green (22/07/08) [ Power/Alternative Energy ]
• Lowest-cost digital media processor debuts (22/07/08) [ Embedded ]
• eInfochips launch two IP cores (22/07/08) [ EDA/IP ]

• Algotronix adds thermal signalling to IP core (22/07/08) [ EDA/IP ]
• DC/DC converters offer ultrawide input ranges (22/07/08) [ Power/Alternative Energy ]
• TFT LCD manufacturing equipment sales up 58% (22/07/08) [ Manufacturing/Packaging ]
• Samsung, Sun partners to boost flash drives (22/07/08) [ Memory/Storage ]
• Commentary: AMD's Ruiz finds his calling (22/07/08) [ Embedded ]

• Nokia Siemens to focus on DSL, NGOA tech (22/07/08) [ Networks ]
• Chipmakers gear up for double-patterning (22/07/08) [ Manufacturing/Packaging ]
• NXP loses battle against researchers (22/07/08) [ Embedded ]
• PCIe goes everywhere (22/07/08) [ Embedded ]
• GaAs device growth outperforms silicon (22/07/08) [ RF/Microwave ]

• MOSFET provides 3A peak source/sink current (21/07/08) [ Embedded ]
• Battery charger targets portable devices (21/07/08) [ Power/Alternative Energy ]
• MOSFET minimises energy conversion losses (21/07/08) [ Power/Alternative Energy ]
• Software tool shortens testing process (21/07/08) [ Embedded ]
• Tiny Ethernet chips offer secure solution (21/07/08) [ Embedded ]

• Field-replaceable SMAs extend usable frequency range (21/07/08) [ RF/Microwave ]
• DPAC enables direct remote data acquisition (21/07/08) [ EDA/IP ]
• Smallest I²C DAC family debuts (21/07/08) [ Power/Alternative Energy ]
• Future of consumer telematics remains bright (21/07/08) [ Interface ]
• Intel receives more complaints from EC (21/07/08) [ Embedded ]

• Gainspan partners with S M Electronics (21/07/08) [ Networks ]
• 450mm debate rages on (21/07/08) [ Manufacturing/Packaging ]
• IC makers face 'More than Moore' era (21/07/08) [ EDA/IP ]
• White OLEDs shine brighter than light bulbs (21/07/08) [ Optoelectronics/Displays ]
• Few changes seen as Meyer named CEO at AMD (21/07/08) [ Embedded ]