• Consumer market pushes accelerometers growth (01/10/08) [ Amplifiers/Converters ]
• NEC joins LSTI (01/10/08) [ Networks ]
• NextIO, Virage Logic to advance process node (01/10/08) [ EDA/IP ]
• Handset makers tap rural India (01/10/08) [ RF/Microwave ]
• Report: Creditors plan to sell Hynix stake (01/10/08) [ Memory/Storage ]

• Firms drive mobile broadband awareness (01/10/08) [ RF/Microwave ]
• Collaboration to enable 32nm, 28nm SoCs (01/10/08) [ EDA/IP ]
• Fujifilm unveils 3D camera (01/10/08) [ Manufacturing/Packaging ]
• Design suite boasts user interface enhancements (01/10/08) [ EDA/IP ]
• PMC-Sierra to unify frequency bands (01/10/08) [ Amplifiers/Converters ]

• IC Compiler features faster runtimes (01/10/08) [ EDA/IP ]
• Toshiba boosts SSD line up (01/10/08) [ Memory/Storage ]
• Gate drive transformer touts low profile design (01/10/08) [ Power/Alternative Energy ]
• Eight-channel analogue front-end IC debuts (01/10/08) [ RF/Microwave ]
• PCIe XMC offers obsolescence-proof design (01/10/08) [ Interface ]

• Hot-plug controller targets power-limiting apps (01/10/08) [ Interface ]
• Samsung-SanDisk merger faces antitrust issues (30/09/08) [ Manufacturing/Packaging ]
• Firms team up on mobile WiMAX test solution (30/09/08) [ Embedded ]
• Toshiba employs GoldenGate for RFIC design (30/09/08) [ EDA/IP ]
• More on Atmel's restructuring plan (30/09/08) [ Embedded ]

• IBM, Intel explore block co-polymer lithography (30/09/08) [ Manufacturing/Packaging ]
• Micron plays waiting game (30/09/08) [ Memory/Storage ]
• Analysts keep their fingers crossed (30/09/08) [ Manufacturing/Packaging ]
• Sparring continues at semi IP industry (30/09/08) [ EDA/IP ]
• Teranetics rolls energy efficient 10GBASE-T (30/09/08) [ Networks ]

• FM receiver module offers fast data settling (30/09/08) [ RF/Microwave ]
• Temp sensor boasts ultra-thin UDFN package (30/09/08) [ T&M ]
• Solar inks could boost cell efficiency (30/09/08) [ Power/Alternative Energy ]
• HiveGo CSS target camera phones (30/09/08) [ Embedded ]
• Capacitors have increased voltage rating (30/09/08) [ Power/Alternative Energy ]

• Motion controller features off-board extensions (30/09/08) [ Embedded ]
• Development kit touts small size (30/09/08) [ EDA/IP ]
• Fastest auto-direction detection translator debuts (29/09/08) [ Interface ]
• Multiplexer delivers 'lowest' distortion (29/09/08) [ Embedded ]
• Freescale announces VaST virtual models (29/09/08) [ Embedded ]

• Compass IC features three-axis magnetic sensors (29/09/08) [ RF/Microwave ]
• Softjin rolls mask defect analysis software (29/09/08) [ EDA/IP ]
• Chip resistors offer .5% tolerance (29/09/08) [ Power/Alternative Energy ]
• LED controller uses true colour PWM dimming (29/09/08) [ Power/Alternative Energy ]
• Simulator handles large mixed-signal ICs (29/09/08) [ EDA/IP ]

• Buzz: Is AMD dropping 'Bobcat' project? (29/09/08) [ Embedded ]
• Court rules patents enforceable against Fairchild (29/09/08) [ Manufacturing/Packaging ]
• Hynix to sell stake in fab JV (29/09/08) [ Memory/Storage ]
• Freescale to sell mobile chip biz? (29/09/08) [ RF/Microwave ]
• Bright future ahead for OLED lighting (29/09/08) [ Optoelectronics/Displays ]

• PND shipments slow down as alternatives advance (29/09/08) [ RF/Microwave ]
• Curved UWB antenna touted as most compact (29/09/08) [ Amplifiers/Converters ]
• Analyst estimates August chip sales drop (29/09/08) [ Manufacturing/Packaging ]
• Continental rolls Li-ion batteries for hybrids (26/09/08) [ Manufacturing/Packaging ]
• IBM unveils cloud computing centre in India (26/09/08) [ Embedded ]

• Synopsys tools qualify on Windows HPC Server (26/09/08) [ EDA/IP ]
• U.S. court favours Broadcom over Qualcomm (26/09/08) [ Manufacturing/Packaging ]
• Dell turns to energy-efficient LED displays (26/09/08) [ Optoelectronics/Displays ]
• Chartered plans to develop 28-nm process (26/09/08) [ Manufacturing/Packaging ]
• Execs see challenges delivering Net content to TV (26/09/08) [ Networks ]

• Analysts question NXP's future (26/09/08) [ RF/Microwave ]
• 40-core processor runs 240 times faster (26/09/08) [ Embedded ]
• PWM controller suits offline power supplies (26/09/08) [ Embedded ]
• TI boosts PMIC portfolio for OMAP designs (26/09/08) [ Embedded ]
• MOSFET, Schottky diode boast low on-resistance (26/09/08) [ Power/Alternative Energy ]

• Single-FPGA solution optimised for 100GbE apps (26/09/08) [ Networks ]
• Power meters tout wide bandwidth (26/09/08) [ T&M ]
• AMC module features 32-bit FIFO per channel (26/09/08) [ Embedded ]
• Online sensor tool reduces design cost (26/09/08) [ EDA/IP ]
• LEDs provide 40k/W thermal resistance (25/09/08) [ Optoelectronics/Displays ]

• Processor inspects packets at 10Gbps (25/09/08) [ Embedded ]
• Tejas launches Carrier Ethernet platforms (25/09/08) [ RF/Microwave ]
• PoE midspan, splitter suit thin client terminals (25/09/08) [ RF/Microwave ]
• Intel vPro automates tune-ups, boosts security (25/09/08) [ EDA/IP ]
• TI unveils fastest 16bit ADC (25/09/08) [ Power/Alternative Energy ]

• 'Thinnest' MEMS oscillator debuts (25/09/08) [ Amplifiers/Converters ]
• Switching power supplies offer high density (25/09/08) [ Power/Alternative Energy ]
• Broadband fibre subscribers reach 3.76M (25/09/08) [ RF/Microwave ]
• Embedded multi-core enables greener networks (25/09/08) [ Embedded ]
• Tough times ahead for power converter biz (25/09/08) [ Manufacturing/Packaging ]

• India holds significant market opportunities (25/09/08) [ RF/Microwave ]
• Intel, Oracle team up for cloud computing (25/09/08) [ Embedded ]
• LED lighting breakthrough not before 2012 (25/09/08) [ Optoelectronics/Displays ]
• Peek inside IBM's 300-mm fab (25/09/08) [ Manufacturing/Packaging ]
• NAND, DRAM prices continue to struggle (25/09/08) [ Memory/Storage ]

• Hitachi GST goes green (24/09/08) [ Power/Alternative Energy ]
• ARC transfers engineering jobs to India, Russia (24/09/08) [ Manufacturing/Packaging ]
• ST engineers detail domino logic (24/09/08) [ EDA/IP ]
• Group creates SSD initiative (24/09/08) [ Memory/Storage ]
• Euro bank in talks with Indian clean tech cos (24/09/08) [ Power/Alternative Energy ]

• 3rd-gen e-ink handheld to replace paper (24/09/08) [ Optoelectronics/Displays ]
• Organisation makes big push in cleantech (24/09/08) [ Manufacturing/Packaging ]
• Qimonda-Micron deal appears likely (24/09/08) [ Manufacturing/Packaging ]
• Tessera expands biz to camera lenses (24/09/08) [ Optoelectronics/Displays ]
• MosChip debuts digital content management processor (24/09/08) [ Embedded ]

• Motion controllers suit robotic apps (24/09/08) [ Embedded ]
• 32-bit MCU integrates protection mechanisms (24/09/08) [ Embedded ]
• SoC targets WiMAX femtocells (24/09/08) [ RF/Microwave ]
• Equaliser optimised for 8.5G fibre channel (24/09/08) [ Networks ]
• Battery monitor touts stackable structure (24/09/08) [ Power/Alternative Energy ]

• Bluetooth module features apt-X audio codec (24/09/08) [ Embedded ]
• IP cores support Tensilica users (24/09/08) [ Embedded ]
• Synopsys offers unified mixed-signal solution for custom design (24/09/08) [ EDA/IP ]
• US OEMS top industrial, medical electronics market (23/09/08) [ Embedded ]
• CAD tool integrates project management software (23/09/08) [ EDA/IP ]

• Brushless motor eases programmability (23/09/08) [ Embedded ]
• MicroTCA chassis tout modified front panel (23/09/08) [ Manufacturing/Packaging ]
• In-system programmer supports PSoC devices (23/09/08) [ Embedded ]
• TI, Ittiam provide IP video phone solution (23/09/08) [ Embedded ]
• MCU targets M2M wireless communication apps (23/09/08) [ Embedded ]

• Power supplies offer 12Vdc payload output (23/09/08) [ Power/Alternative Energy ]
• PCI-E board features Virtex 5 (23/09/08) [ Interface ]
• GSMA backs renewable energy in mobile industry (23/09/08) [ RF/Microwave ]
• Android smartphone launches soon (23/09/08) [ Embedded ]
• LG, Conergy partner for solar module production (23/09/08) [ Manufacturing/Packaging ]

• Applied, Sunpower unveil solar power systems (23/09/08) [ Manufacturing/Packaging ]
• RFID tech targets supply chain security (23/09/08) [ RF/Microwave ]
• Albany NanoTech primes 300-mm R&D fab (23/09/08) [ Manufacturing/Packaging ]
• Is China's semiconductor business slowing down? (23/09/08) [ Manufacturing/Packaging ]
• Medical ICs outpace computer, CE markets (22/09/08) [ Manufacturing/Packaging ]

• Spire to supply PV assembly line in India (22/09/08) [ Power/Alternative Energy ]
• Is it time to panic? (22/09/08) [ Embedded ]
• Nvidia to slash 360 jobs (22/09/08) [ Embedded ]
• India's LCD TV market doubling every year (22/09/08) [ Optoelectronics/Displays ]
• Start-up gains high profile backing (22/09/08) [ EDA/IP ]

• IC Insights cuts chip revenue forecast (22/09/08) [ Manufacturing/Packaging ]
• Buzz: IBM to enter solar cell arena (22/09/08) [ Manufacturing/Packaging ]
• Stereo 3-D not yet ready for TV role? (22/09/08) [ Optoelectronics/Displays ]
• Buck controllers maximise power efficiency (22/09/08) [ Power/Alternative Energy ]
• USB multi-monitor systems consumes less power (22/09/08) [ Power/Alternative Energy ]

• Firms team up for interoperability demo (22/09/08) [ RF/Microwave ]
• Packaging solution allows enhanced miniaturisation (22/09/08) [ Embedded ]
• ST boosts power MOSFETs (22/09/08) [ Power/Alternative Energy ]
• Circuit protectors tout small form factor (22/09/08) [ Power/Alternative Energy ]
• ROM-based Bluetooth features DSP (22/09/08) [ Embedded ]

• LCD module boasts ultra-wide viewing angle (22/09/08) [ Optoelectronics/Displays ]