• E/H resistors deliver lower resistance values (20/11/09) [ Power Design ]
• Dual-interface MCUs tailored for secure smart cards (20/11/09) [ Embedded Design ]
• Integrated SiGe mixer saves board space (20/11/09) [ Signals ]
• Test solution is HDMI 1.4-compliant (20/11/09) [ Test & Measurement ]
• Serial RapidIO 2.1 IP core tips 20 GBaud (20/11/09) [ EDA ]

• Infotainment SoCs pack symmetric multiprocessing (20/11/09) [ Embedded Design ]
• India pushes coastal ID project (20/11/09) [ RF/Wireless Design ]
• Solar panel industry set to regain growth (20/11/09) [ Power Design ]
• Intel, NEC push envelope on supercomputers (20/11/09) [ Embedded Design ]
• European HEVs tap Sanyo batteries (20/11/09) [ Power Design ]

• 3D Web development critical to HPC growth (20/11/09) [ Embedded Design ]
• Amimon shifts product focus to notebook PCs (20/11/09) [ Interface Design ]
• Security module packs 128KB EEPROM memory (19/11/09) [ Embedded Design ]
• Turnkey solution to aid in counterfeit protection (19/11/09) [ Embedded Design ]
• DC/DC converter powers upgraded CE chips (19/11/09) [ Power Design ]

• GPUs cut cost, power use compared to CPUs (19/11/09) [ Embedded Design ]
• Low-power serial flash tailored for portable apps (19/11/09) [ Buffer/Storage ]
• Ethernet switch fits rugged industrial environment (19/11/09) [ Interface Design ]
• NXP, Avni light up India streets with LEDs (19/11/09) [ Power Design ]
• Digital home gives rise to new class of devices (19/11/09) [ Embedded Design ]

• NXP, ST partner on contactless MIFARE tech (19/11/09) [ RF/Wireless Design ]
• NEC realigns to be more cost-effective (19/11/09) [ Manufacturing/Packaging ]
• EUV photoresist developed for 20nm (19/11/09) [ Manufacturing/Packaging ]
• Analyst says IC industry close to sold out (19/11/09) [ Manufacturing/Packaging ]
• Core module enables wired, Wi-Fi networking (18/11/09) [ RF/Wireless Design ]

• N-channel MOSFETs suit rugged VoIP apps (18/11/09) [ Power Design ]
• Op amps handle apps with high source resistance (18/11/09) [ Signals ]
• Ultra-compact power modules last 350,000 hours (18/11/09) [ Power Design ]
• Scopes deliver 350MHz bandwidth on four channels (18/11/09) [ Test & Measurement ]
• MCUs with RF transceiver target remote controls (18/11/09) [ Embedded Design ]

• SimTech boosts India wireless tech education (18/11/09) [ RF/Wireless Design ]
• Analyst sees half of solar players out in 2010 (18/11/09) [ Power Design ]
• Cavium buys MontaVista Software for Rs.244.08 crore (18/11/09) [ Embedded Design ]
• HP's 3Com buyout pushes data centre convergence (18/11/09) [ Embedded Design ]
• IC inventory levels remain low, analyst warns (18/11/09) [ Manufacturing/Packaging ]

• New material improves Li-ion battery safety (18/11/09) [ Manufacturing/Packaging ]
• Global conference series makes a pit stop at India (17/11/09) [ EDA ]
• NAND controllers support ONFI 2.2 (17/11/09) [ Interface Design ]
• Modems deliver HSPA, 3G capabilities to mobile apps (17/11/09) [ RF/Wireless Design ]
• Triple-axis MEMS gyro offers 360° freedom (17/11/09) [ Embedded Design ]

• Better thermal performance from IR's car IGBT (17/11/09) [ Power Design ]
• PaLFI device powers implantable medical apps (17/11/09) [ Interface Design ]
• Optical transceivers enable flexible system design (17/11/09) [ Interface Design ]
• ABI slashes femtocell shipment forecast (17/11/09) [ Network Design ]
• Casio, Toppan forays into OLED displays (17/11/09) [ Optoelectronics & Displays ]

• MediaFLO achieves major milestone in Japan (17/11/09) [ RF/Wireless Design ]
• Dow, Caltech ally on PV materials innovation (17/11/09) [ Power Design ]
• Analysts review handset OEMs' latest offerings (17/11/09) [ RF/Wireless Design ]
• Saankhya Labs debuts SDR TV demodulator IC (16/11/09) [ RF/Wireless Design ]
• Antennas enable simultaneous Wi-Fi, Bluetooth ops (16/11/09) [ RF/Wireless Design ]

• Tiny TVS boast 6.7-42.4V breakdown voltage (16/11/09) [ Power Design ]
• Contactless chips integrate large memory (16/11/09) [ RF/Wireless Design ]
• Quad-SVS pack programmable delay, watchdog timer (16/11/09) [ Power Design ]
• Processor fits automotive, industrial, consumer apps (16/11/09) [ Embedded Design ]
• Survey of India, MapmyIndia team on digital maps (16/11/09) [ RF/Wireless Design ]

• Contactless payments on the rise (16/11/09) [ RF/Wireless Design ]
• TI, Fullpower boost motion sensing in portable apps (16/11/09) [ Embedded Design ]
• Elpida signs on Winbond to make DRAMs (16/11/09) [ Manufacturing/Packaging ]
• German photovoltaic market sees red (16/11/09) [ Power Design ]
• Intel to pay AMD Rs.6101.93 crore settlement (16/11/09) [ Embedded Design ]

• 3W RGB LED saves cost, space (13/11/09) [ Optoelectronics & Displays ]
• Codecs deliver high-quality audio at low cost (13/11/09) [ Signals ]
• System basis chips improve in-vehicle networks (13/11/09) [ Interface Design ]
• Step-down controller suits high current apps (13/11/09) [ Power Design ]
• ADCs includes internal voltage reference (13/11/09) [ Signals ]

• AMD x86 cores come with integrated graphics (13/11/09) [ Embedded Design ]
• India prof tips fastest prime number detection algorithm (13/11/09) [ Test & Measurement ]
• Automakers wary about electric vehicles (13/11/09) [ Power Design ]
• Tech groups unite to spur Malaysia 4G network (13/11/09) [ RF/Wireless Design ]
• Wolfson expands in Japan with new R&D centre (13/11/09) [ Signals ]

• TSMC forays into solid-state lighting (13/11/09) [ Manufacturing/Packaging ]
• IC recovery piggybacks on consumer electronics (13/11/09) [ Embedded Design ]
• RF tester packs vector signal analyser, generator (12/11/09) [ Test & Measurement ]
• Dual LDO tips 200mA continuous load per output (12/11/09) [ Power Design ]
• MCU boosts smart card security (12/11/09) [ Embedded Design ]

• Compact front-end module integrates FBAR filter, LNA (12/11/09) [ RF/Wireless Design ]
• IC lets mini-USB connect all accessories (12/11/09) [ Interface Design ]
• IO-Link solutions offer choice of memory variants (12/11/09) [ Interface Design ]
• Moser Baer injects Rs.24, 407.71 crore in India PV facilties (12/11/09) [ Power Design ]
• SCI, Citizen Electronics boost LED market in India (12/11/09) [ Optoelectronics & Displays ]

• Broadcom leads home CE embedded processor market (12/11/09) [ Embedded Design ]
• DVN offloads STB business to Cisco (12/11/09) [ Embedded Design ]
• Cree embarks on China manufacturing (12/11/09) [ Manufacturing/Packaging ]
• Analysis: What's next for SMIC? (12/11/09) [ EDA ]
• D-Link managed switches get IPv6 stamp (11/11/09) [ Network Design ]

• Op amps deliver high precision to portable medical apps (11/11/09) [ Signals ]
• Smart card connectors ease integration (11/11/09) [ Network Design ]
• Processor boosts M2M cell connection performance (11/11/09) [ Embedded Design ]
• FPGA-based card suits wireless baseband apps (11/11/09) [ Interface Design ]
• Processor brings Blu-ray quality to low-power apps (11/11/09) [ Embedded Design ]

• Posiflex stakes Rs.48.22 crore in India distributor (11/11/09) [ Embedded Design ]
• Automotive market opens opportunities for electric motors (11/11/09) [ Embedded Design ]
• Suntech, Huadian bring solar power to Jiangsu (11/11/09) [ Power Design ]
• Elpida, ProMOS partner on DRAM foundry services (11/11/09) [ Manufacturing/Packaging ]
• German power electronics centre gets green light (11/11/09) [ Power Design ]

• PLDs surprisingly thrive in downturn (11/11/09) [ Embedded Design ]