• More opportunities open for India electronics design (30/12/09) [ EDA/IP ]
• Chartered plans expansion amid ATIC takeover (30/12/09) [ Manufacturing/Packaging ]
• Nanovacuum tubes could enhance batteries, memories (30/12/09) [ Manufacturing/Packaging ]
• SunEdison, Xcel Energy boost New Mexico solar power (30/12/09) [ Power/Alternative Energy ]
• More cars get Internet-connected by 2016 (30/12/09) [ Embedded ]

• Improved electrode materials boost Li-ion battery capacity (30/12/09) [ Power/Alternative Energy ]
• VCSEL driver targets SFP+ Ethernet, fibre channel apps (30/12/09) [ Interface ]
• Step-up converter doubles up as power manager (30/12/09) [ Power/Alternative Energy ]
• OTDR tester handles PON-based FTTx networks (30/12/09) [ T&M ]
• 2010 signals recovery of new product designs (29/12/09) [ EDA/IP ]

• China is key to PV-making equipment growth (29/12/09) [ Power/Alternative Energy ]
• Pioneer, Honeywell agree on patent usage (29/12/09) [ RF/Microwave ]
• Bluetooth 4.0 delivers low-energy modes (29/12/09) [ RF/Microwave ]
• WD, NEC promote SuperSpeed USB standard (29/12/09) [ Interface ]
• Wafer-sized solar cells give way to micron-sized ones (29/12/09) [ Power/Alternative Energy ]

• Intel, Micron race to reclaim NAND process lead (29/12/09) [ Memory/Storage ]
• Rad taps GOIP as India distribution partner (29/12/09) [ Networks ]
• Cisco drives NOW Van into Mumbai (29/12/09) [ Networks ]
• Integrated amp audio IC delivers HD sound quality (29/12/09) [ Amplifiers/Converters ]
• Simultaneous-sampling ADC targets smart grid (29/12/09) [ Amplifiers/Converters ]

• Low-energy test sol'n complies with Bluetooth 4.0 (29/12/09) [ T&M ]
• RRE-equipped base stations handle W-CDMA, LTE (29/12/09) [ RF/Microwave ]
• Compact NTC thermistors designed for automotives (29/12/09) [ Power/Alternative Energy ]
• Multi-point wireless HD audio IC enables up to 10 devices (29/12/09) [ RF/Microwave ]
• 4A SiP regulator draws 10µA in shutdown (29/12/09) [ Power/Alternative Energy ]

• Mobile WiMAX software suite ups test time to 300% (29/12/09) [ RF/Microwave ]
• VLSI conference tackles 2010 design challenges (28/12/09) [ EDA/IP ]
• Combo IC integrates digital accelerometer, analogue gyro (28/12/09) [ Embedded ]
• Bi-polar op amps lower signal conditioning error (28/12/09) [ Amplifiers/Converters ]
• Integrated switch eases sub-system load management (28/12/09) [ Power/Alternative Energy ]

• Flash MCUs pack PWM timer, solenoid actuators (28/12/09) [ Embedded ]
• Tranceiver ICs tailored for in-car network apps (28/12/09) [ Interface ]
• PoE management software now SNMPv3-compatible (28/12/09) [ Embedded ]
• Converter dev't kit tests FPGA-DAC interface (28/12/09) [ T&M ]
• Q3 OLED shipments hit record high with Rs.1168.55 crore (28/12/09) [ Optoelectronics/Displays ]

• Atmel, H&D Wireless team for embedded Wi-Fi (28/12/09) [ Embedded ]
• Biometric tech now scans palm veins for security (28/12/09) [ Optoelectronics/Displays ]
• 2009: Tumultuous year for foundries (28/12/09) [ Manufacturing/Packaging ]
• Mixed forecast for 2010 electronics biz (28/12/09) [ Embedded ]
• Sharp taps Cypress TruTouch sol'n for its mobile phones (28/12/09) [ Embedded ]

• Havells forays into LED market (28/12/09) [ Optoelectronics/Displays ]
• NASA taps Wind River for next-gen vehicles (28/12/09) [ Embedded ]
• Sensor bolsters smart phone's imaging quality (24/12/09) [ Embedded ]
• Global nav system shipments to hit 50 crore in 2010 (24/12/09) [ RF/Microwave ]
• Intel to humanise tech platforms (24/12/09) [ Embedded ]

• First Solar, EDF establish PV plant in Blanquefort (24/12/09) [ Power/Alternative Energy ]
• Multimode device achieves LTE, HSPA interoperability (24/12/09) [ RF/Microwave ]
• Sony boosts India mobile content platform developers (24/12/09) [ Embedded ]
• Compact ESD protection device offers lower clamping voltage (24/12/09) [ Power/Alternative Energy ]
• MOSFET integrated DC/DC converter ups efficiency (24/12/09) [ Power/Alternative Energy ]

• Universal contact handles angular alignments (24/12/09) [ Networks ]
• In-line rectifiers boast 1500V dielectric strength (24/12/09) [ Power/Alternative Energy ]
• Toshiba tops NAND flash market in Q3 (23/12/09) [ Memory/Storage ]
• Zigbee remote promises flexible control (23/12/09) [ RF/Microwave ]
• RoodMicrotec, X-Fab ink network partnership (23/12/09) [ Manufacturing/Packaging ]

• LCD to detect hand gesture via photodiode (23/12/09) [ Optoelectronics/Displays ]
• Analyst: CES 2010 will be a battle of innovative apps (23/12/09) [ Embedded ]
• Cosmic Circuits taps Cadence Virtuoso 6.1 (23/12/09) [ Amplifiers/Converters ]
• mTouche-VASSoft.net JV to offer P2P mobile content in India (23/12/09) [ Networks ]
• Tanla opens Hyderabad mobile apps centre (23/12/09) [ Embedded ]

• RF spiral inductors handle 1-100nH range (23/12/09) [ Power/Alternative Energy ]
• BiCMOS LDOs offer 81mV dropout at 2A (23/12/09) [ Power/Alternative Energy ]
• 8bit MCUs integrate dual I²C/SPI interfaces (23/12/09) [ Embedded ]
• On-chip DAQ offers power, space, cost savings (23/12/09) [ Amplifiers/Converters ]
• Atom processor packs graphics for netbooks (23/12/09) [ Embedded ]

• Step-down regulator operates at 3.6V to 37V (23/12/09) [ Power/Alternative Energy ]
• Optical switch sensor powers solar trash cans (23/12/09) [ Optoelectronics/Displays ]
• IC manufacturing rides high on touchscreens (22/12/09) [ Interface ]
• Duo works on faster counter-failure tech for IP network (22/12/09) [ RF/Microwave ]
• First Solar rolls out 2010 expansion plans (22/12/09) [ Manufacturing/Packaging ]

• South Korea gov't to inject funds in IC manufacturing (22/12/09) [ Manufacturing/Packaging ]
• Broadcom 40nm chip enables HD handsets (22/12/09) [ Embedded ]
• Endesa Spain taps ECD for rooftop solar project (22/12/09) [ Networks ]
• MIPS, Tensilica team on Android platform-based SoC (22/12/09) [ Embedded ]
• Euro-India partnership to boost India ICT (22/12/09) [ Networks ]

• Full HD H.264/MPEG SoCs enable new DTV services (22/12/09) [ Embedded ]
• 12V input LED driver can drive eight channels (22/12/09) [ Power/Alternative Energy ]
• Clock generator with -57dBc PSNR lowers jitter degradation (22/12/09) [ Interface ]
• Bluetooth 2.1+ EDR combo IC improves Wi-Fi co-existence (22/12/09) [ RF/Microwave ]
• Wireless audio module packs 2.4GHz ISM band (22/12/09) [ RF/Microwave ]

• Low-power 32bit microprocessor runs at 532MHz (22/12/09) [ Embedded ]
• Dual core 6Gbps SAS ROC is PCIe 3.0-compliant (22/12/09) [ Embedded ]
• DC/DC converters drive up to 1000µF ceramic capacitors (21/12/09) [ Power/Alternative Energy ]
• Line driver supports 8-/17MHz VDSL2 profiles (21/12/09) [ Embedded ]
• Ethernet controllers, PHYs are EEE draft-compliant (21/12/09) [ RF/Microwave ]

• 3DTV processor enables local backlight dimming (21/12/09) [ Embedded ]
• Processor achieves 2GHz at low power (21/12/09) [ Embedded ]
• RF-to-digital converter eases car infotainment (21/12/09) [ Amplifiers/Converters ]
• LDO offers low output impedance at high frequency (21/12/09) [ Power/Alternative Energy ]
• LED lighting adds the glitter to the holidays (21/12/09) [ Optoelectronics/Displays ]

• Uni Land picks LDK to build PV plants in Italy (21/12/09) [ Power/Alternative Energy ]
• TowerJazz to deliver 4G RF front-end IC for VT Silicon (21/12/09) [ RF/Microwave ]
• Gartner rolls out winners, losers in 2009 IC ranking (21/12/09) [ Manufacturing/Packaging ]
• NEC-Renesas merger slides to 2010 (21/12/09) [ Embedded ]
• Ubicom taps Denali verification IP (21/12/09) [ EDA/IP ]

• First Solar achieves annual 1GW PV shipments (21/12/09) [ Power/Alternative Energy ]
• India gov't gives incentives for wind energy projects (21/12/09) [ Power/Alternative Energy ]