• Hyperstone introduces 32-bit RISC/DSP MCU (01/07/09) [ Embedded ]
• SoCs handle ultra high performance ADC front ends (01/07/09) [ Amplifiers/Converters ]
• Portable programmer modifies frequencies (01/07/09) [ Amplifiers/Converters ]
• Protection IC enables smaller PoE apps (01/07/09) [ Power/Alternative Energy ]
• Power supplies tailored for medical apps (01/07/09) [ Power/Alternative Energy ]

• Partners bring broadband services across India (01/07/09) [ RF/Microwave ]
• LTE dev't lab rises in Japan (01/07/09) [ T&M ]
• Nokia Intel tie-up highlights convergence (01/07/09) [ Embedded ]
• Netherlands tests road user charging (01/07/09) [ RF/Microwave ]
• More players enter MEMS foundry market (01/07/09) [ Embedded ]

• NAND vendors begin scaling race (01/07/09) [ Memory/Storage ]
• RFID modules pack antenna filters, ESD protection (30/06/09) [ RF/Microwave ]
• Low-tolerance DCP can be used as variable resistor (30/06/09) [ Power/Alternative Energy ]
• Dev't kits target PFC motor control apps (30/06/09) [ EDA/IP ]
• TRIAC handles high temperatures (30/06/09) [ Amplifiers/Converters ]

• Low-cost converters deliver up to 50W (30/06/09) [ Power/Alternative Energy ]
• Analyst: SuperSpeed USB 10x faster (30/06/09) [ Interface ]
• Electronics future in conventional films (30/06/09) [ Manufacturing/Packaging ]
• Indonesia 2G/3G network reaches milestone (30/06/09) [ RF/Microwave ]
• Nokia Siemens, Juniper team on optical nets (30/06/09) [ Networks ]

• Will proprietary wireless HD stay in the game? (30/06/09) [ RF/Microwave ]
• India Designs: Freescale's Kirin3 connectivity microcontrollers (30/06/09) [ Embedded ]
• Solterra Saudi solar plan picks up (29/06/09) [ Manufacturing/Packaging ]
• Microformed chip shield suits portable apps (29/06/09) [ Manufacturing/Packaging ]
• DSP delivers 3D acoustics (29/06/09) [ Embedded ]

• LED flash driver packs ultrathin supercapacitor (29/06/09) [ Optoelectronics/Displays ]
• IR fields control IC for buck apps (29/06/09) [ Power/Alternative Energy ]
• MOSFETs target into automotive apps (29/06/09) [ Power/Alternative Energy ]
• Tata Docomo begins pan-India GSM rollout (29/06/09) [ RF/Microwave ]
• Intel pushes 65nm in China fab (29/06/09) [ Manufacturing/Packaging ]

• China gets more mobile in Q1 09 (29/06/09) [ RF/Microwave ]
• Laser scribing makes integrated OPVs (29/06/09) [ Power/Alternative Energy ]
• Smart Energy standard gives next-gen needs (29/06/09) [ Networks ]
• Lessons in time, cost savings from iPhone 3GS (29/06/09) [ EDA/IP ]
• Op amps boast high precision at low power (26/06/09) [ Amplifiers/Converters ]

• DSP tailored for audio systems (26/06/09) [ Embedded ]
• Power supply eliminates heat sinks, fans (26/06/09) [ Power/Alternative Energy ]
• Multicore chip operates up to 400 MIPS (26/06/09) [ Embedded ]
• NEC tips new MRAM technology (26/06/09) [ Memory/Storage ]
• India VCs shift investments on cleantech, biotech (26/06/09) [ Manufacturing/Packaging ]

• Analysis: What to expect from Intel-Nokia deal (26/06/09) [ Embedded ]
• Economic crunch hits nanotech market (26/06/09) [ Manufacturing/Packaging ]
• Q1 PC shipments take a plunge (26/06/09) [ Embedded ]
• Supercomputer touts chip-level water-cooling (26/06/09) [ Embedded ]
• Numonyx, Samsung create PCM specs (26/06/09) [ Memory/Storage ]

• NI simulation toolkit moves forward (25/06/09) [ T&M ]
• TI delivers DSP family for femtocells (25/06/09) [ Embedded ]
• Connectivity MCUs pack Ethernet, USB, CAN, I²S (25/06/09) [ Embedded ]
• MOSFET family comes in SuperSO8 package (25/06/09) [ Power/Alternative Energy ]
• 32bit MCU consumes only 0.48mW/MHz (25/06/09) [ Embedded ]

• MNTL gets Delhi 3G-connected (25/06/09) [ RF/Microwave ]
• Intel, Nokia ink mobile computing deal (25/06/09) [ Embedded ]
• SpringSoft, TSMC tie-up for multi-node (25/06/09) [ EDA/IP ]
• DisplaySearch says LCD TVs looking up (25/06/09) [ Optoelectronics/Displays ]
• Mobile research gets Rs.489.87 crore IBM infusion (25/06/09) [ RF/Microwave ]

• 3M, SUSS MicroTec team on 3D chips (25/06/09) [ Manufacturing/Packaging ]
• LED outdoor displays, backlights to flourish (24/06/09) [ Optoelectronics/Displays ]
• NI teams with MobileRobots (24/06/09) [ Embedded ]
• Samsung, Toshiba extend NAND patent deal (24/06/09) [ Embedded ]
• WiMAX alliance calls for patent pool (24/06/09) [ RF/Microwave ]

• Chip start-ups get the squeeze (24/06/09) [ Embedded ]
• April's semis growth strongest since 1996 (24/06/09) [ Embedded ]
• UPS products target mission-critical apps (24/06/09) [ Power/Alternative Energy ]
• NV RAM replaces serial EEPROM (24/06/09) [ Memory/Storage ]
• DSPs suit 3G, 4G SoC designs (24/06/09) [ Embedded ]

• 'First' India-developed 32-bit processor debuts (24/06/09) [ Embedded ]
• The safest investment (23/06/09) [ Manufacturing/Packaging ]
• Indian mobile services market to touch $30bn (23/06/09) [ RF/Microwave ]
• Indian govt doubles 3G base fee (23/06/09) [ RF/Microwave ]
• Solar PV capex to rise 74% in 2012 (23/06/09) [ Manufacturing/Packaging ]

• Nokia Siemens buys Nortel assets for $650mn (23/06/09) [ RF/Microwave ]
• Intel takes 193nm litho to 15nm (23/06/09) [ Manufacturing/Packaging ]
• Will WAPI get lucky this time? (23/06/09) [ RF/Microwave ]
• Tiny converters offer output voltage tracking (23/06/09) [ Power/Alternative Energy ]
• Upgraded EDA tool adds flow-routing option (23/06/09) [ EDA/IP ]

• Amps deliver up to 35GHz output power (23/06/09) [ RF/Microwave ]
• Start-up to demo asynchronous synthesis tool (23/06/09) [ EDA/IP ]
• India all set for LCD panel manufacturing (22/06/09) [ Manufacturing/Packaging ]
• Tata Elxsi to boost auto, aerospace activities (22/06/09) [ EDA/IP ]
• TV chip sales to boom after weak Q1 (22/06/09) [ Optoelectronics/Displays ]

• Amimon aims to unite WHDI with WiFi (22/06/09) [ RF/Microwave ]
• Chinese PV firm sees increase in demand (22/06/09) [ Manufacturing/Packaging ]
• IBM 28nm alliance welcomes NEC, Toshiba (22/06/09) [ Manufacturing/Packaging ]
• Multiplexers suit portable, battery-operated apps (22/06/09) [ Amplifiers/Converters ]
• Start-up supports HDMI 1.4 spec with new devices (22/06/09) [ Interface ]

• Load switches feature 'lowest' ON resistance (22/06/09) [ Power/Alternative Energy ]
• Multiprocessor tool suite gets upgrade (22/06/09) [ EDA/IP ]