• Laser sensor suits cordless mouse apps (01/10/09) [ Embedded ]
• 50-inch PDP enables 3D viewing (01/10/09) [ Optoelectronics/Displays ]
• Board support package pushes TI's OMAP 3 EVM (01/10/09) [ EDA/IP ]
• Tiny LDO regulators eliminate output capacitors (01/10/09) [ Power/Alternative Energy ]
• HDMI 1.4 IC packs fast switching tech (01/10/09) [ Interface ]

• ARM set to take sub-notebook market from Intel (01/10/09) [ Embedded ]
• Group to work on mobile HD interface standard (01/10/09) [ Interface ]
• DA NanoMaterials opens Taiwan tech centre (01/10/09) [ Manufacturing/Packaging ]
• ITRI's 3D consortium welcomes SUSS MicroTec (01/10/09) [ Manufacturing/Packaging ]
• Flat-panel TVs see strong growth in India (01/10/09) [ Optoelectronics/Displays ]

• Partnerships, VCs rev up French solar market (01/10/09) [ Power/Alternative Energy ]
• Low-cost PMIC is highly integrated (30/09/09) [ Power/Alternative Energy ]
• 40nm PHY tailored for HDD, SDD markets (30/09/09) [ Interface ]
• Thyristors provide minimal signal distortion (30/09/09) [ Power/Alternative Energy ]
• Audio converter/driver touts improved sound quality (30/09/09) [ Amplifiers/Converters ]

• Intel gears 45nm SoC for digital living room (30/09/09) [ Embedded ]
• Ascent Solar, ETI ink PV deal (30/09/09) [ Power/Alternative Energy ]
• IBM brings cloud computing to Dongying City (30/09/09) [ Embedded ]
• GM sets up China Science Lab (30/09/09) [ Manufacturing/Packaging ]
• Report: Nanocrystalline silicon set for steady growth (30/09/09) [ Manufacturing/Packaging ]

• India railway nets get TETRA boost (30/09/09) [ RF/Microwave ]
• Intel merges wired connections in PCs (30/09/09) [ Interface ]
• Axial resistors offer 50ppm load-life stability (29/09/09) [ Power/Alternative Energy ]
• Tiny oscillators handle -40°C to +85°C (29/09/09) [ Amplifiers/Converters ]
• 32bit MCU integrates IEEE 802.15.4 radio (29/09/09) [ Embedded ]

• PWM regulators trim total component cost (29/09/09) [ Power/Alternative Energy ]
• 32bit CMOS processor suits control-plane apps (29/09/09) [ Embedded ]
• MEMS mic shipments to hit 110 crore by 2013 (29/09/09) [ Embedded ]
• ArvinMeritor opens technical centre in India (29/09/09) [ Embedded ]
• Suntech records new PV cell efficiency (29/09/09) [ Power/Alternative Energy ]

• Atmel, Global Unichip co-develop SoCs (29/09/09) [ EDA/IP ]
• Intel will make TVs personal, social, optical (29/09/09) [ Embedded ]
• GlobalFoundries pushes 32nm SOI process to Q3 10 (29/09/09) [ Manufacturing/Packaging ]
• DC/DC converter delivers up to 800mA output current (28/09/09) [ Power/Alternative Energy ]
• Power devices cut out external current monitors (28/09/09) [ Power/Alternative Energy ]

• Intel chips bring Nehalem into mobile market (28/09/09) [ Embedded ]
• Low-power SDRAM saves space (28/09/09) [ Memory/Storage ]
• Transceiver radio handles 300MHz to 510MHz (28/09/09) [ RF/Microwave ]
• GM India, REVA co-develop electric vehicles (28/09/09) [ Embedded ]
• HSPA powers most enterprise mobile access (28/09/09) [ RF/Microwave ]

• Huawei bags Singapore broadband network deal (28/09/09) [ Networks ]
• ReneSola signs Dynamic Green purchase deal (28/09/09) [ Manufacturing/Packaging ]
• Firms pledge support to improve Kenya education (28/09/09) [ Embedded ]
• How to make your design really matter (28/09/09) [ EDA/IP ]
• LED driver offers temperature control (25/09/09) [ Power/Alternative Energy ]

• ESD devices free up 70% space in portable apps (25/09/09) [ Embedded ]
• Smart card interface supports ISO7816 standard (25/09/09) [ Embedded ]
• RTOS speeds up Atom-based system development (25/09/09) [ Embedded ]
• Amp-modulator suit DWDM networking apps (25/09/09) [ Amplifiers/Converters ]
• Wipro-NewLogic employees get political (25/09/09) [ Manufacturing/Packaging ]

• Mobile VoIP market to top Rs.156,539.04 crore by 2013 (25/09/09) [ RF/Microwave ]
• Altech, Seacom ally for cable bandwidth (25/09/09) [ Networks ]
• Sanyo, TomTom tie up for in-car navigation (25/09/09) [ Embedded ]
• Malaysia WiMAX operator deploys Fujitsu mux (25/09/09) [ RF/Microwave ]
• Samsung begins phase-change RAM production (25/09/09) [ Memory/Storage ]

• Designing networks with FPGAs gets easy (24/09/09) [ EDA/IP ]
• USB devices are auto-qualified (24/09/09) [ Interface ]
• Power management units halve board space (24/09/09) [ Power/Alternative Energy ]
• 4G RFICs pack multiple discrete functional blocks (24/09/09) [ RF/Microwave ]
• 'Thinnest' microSD card connector rolls (24/09/09) [ Networks ]

• Moser Baer holds 11% of India USB flash market (24/09/09) [ Memory/Storage ]
• NXP, Skymeter sort out road user charging (24/09/09) [ RF/Microwave ]
• 2.22 crore OLED cell phone displays to ship in '09 (24/09/09) [ Optoelectronics/Displays ]
• TriQuint, Huawei push optical systems (24/09/09) [ Networks ]
• IBM unveils eDRAM for fastest SOI chip (24/09/09) [ Memory/Storage ]

• Intel CEO: More SoCs than CPUs coming soon (24/09/09) [ Embedded ]
• Video filter packs ESD protection (23/09/09) [ Amplifiers/Converters ]
• Miniature LNA tailored for 575GHz frequency (23/09/09) [ RF/Microwave ]
• Superjunction MOSFETs suit PFC, PWM stages (23/09/09) [ Power/Alternative Energy ]
• Dev't board prototypes designs in a snap (23/09/09) [ Embedded ]

• Linear regulators drive low ESR capacitors (23/09/09) [ Power/Alternative Energy ]
• Cypress opens new PSoC lab at Bhubaneswar (23/09/09) [ Embedded ]
• Numonyx tops NOR flash memory in Q2 09 (23/09/09) [ Memory/Storage ]
• Cisco to put up Dalian training centre (23/09/09) [ Manufacturing/Packaging ]
• Rambus, Kingston team for multi-core computing (23/09/09) [ Memory/Storage ]

• Entropic, ViXS develop MoCA NAS ref design (23/09/09) [ Networks ]
• Soaring prices hinder Canon's litho dreams (23/09/09) [ Manufacturing/Packaging ]
• Comm modules offer dual, quad ports (22/09/09) [ Embedded ]
• OpenATE rolls open source PXI IC tester (22/09/09) [ T&M ]
• MOSFET driver tips 60V for LCD backlights (22/09/09) [ Power/Alternative Energy ]

• Quad-core processor cuts part counts, system costs (22/09/09) [ Embedded ]
• RF transceiver handles 1.9-2.7GHz band (22/09/09) [ RF/Microwave ]
• Aricent, Cavium team on LTE core solutions (22/09/09) [ Embedded ]
• Canadian Solar to use MWT tech from ECN (22/09/09) [ Power/Alternative Energy ]
• Intel remains on top of microprocessor market (22/09/09) [ Embedded ]

• BSNL, HCL bring broadband connectivity to rural India (22/09/09) [ RF/Microwave ]
• ARM fires up Intel battle with Atom-beater core (22/09/09) [ Embedded ]
• Execs tackle ASIC, FPGA design challenges (22/09/09) [ EDA/IP ]
• ST-Ericsson samples 'first' 65nm TD-HSPA modem chips (21/09/09) [ RF/Microwave ]
• Osprey A9 core plays match up with Atom (21/09/09) [ Embedded ]

• Step-down controller trims power dissipation (21/09/09) [ Power/Alternative Energy ]
• Wipro Infotech opens India tech innovation hub (21/09/09) [ Manufacturing/Packaging ]
• SuperSpeed USB plug in external storage devices (21/09/09) [ Interface ]
• Ethernet faces demand, cost pressures (21/09/09) [ RF/Microwave ]