• LCD TV market to stage comeback in 2010 (10/02/10) [ Optoelectronics/Displays ]
• Trina Solar to sell PV modules to AE photonics (10/02/10) [ Power/Alternative Energy ]
• Emcore forms JV with China investment firm (10/02/10) [ Networks ]
• Microchip takes over SST (10/02/10) [ Memory/Storage ]
• Micron eyes Numonyx for NOR flash entry (10/02/10) [ Memory/Storage ]

• IBM RF graphene transistor beats GaAs IC speed (10/02/10) [ Manufacturing/Packaging ]
• Trio forms JV for lead-acid storage batteries in India (10/02/10) [ Power/Alternative Energy ]
• Pacnet acquires long distance licenses in India (10/02/10) [ RF/Microwave ]
• MOSFET driver operates from 38V voltage supply (10/02/10) [ Power/Alternative Energy ]
• Analogue MCUs pack 126Kb flash memory (10/02/10) [ Embedded ]

• DIMMs extend scalability from 8 to 48 ports (10/02/10) [ Power/Alternative Energy ]
• Isolated sensor metering IC lowers BOM by 25% (10/02/10) [ T&M ]
• SoC enables full-HD video in handsets (10/02/10) [ Optoelectronics/Displays ]
• AirLive rolls 5.8GHz wireless solutions for India market (10/02/10) [ RF/Microwave ]
• Convergence, green tech take centre stage in 2010 (09/02/10) [ EDA/IP ]

• RFMD, Nujira team up for 4G broadband PA (09/02/10) [ Amplifiers/Converters ]
• Black Sand buys CMOS power amp patents (09/02/10) [ Amplifiers/Converters ]
• Broadcom buys EPON supplier (09/02/10) [ Networks ]
• Intel seeks to be numero uno in SSD market (09/02/10) [ Memory/Storage ]
• Panel discusses outsourcing options (09/02/10) [ EDA/IP ]

• DRAM to dominate 2010 IC market (09/02/10) [ Manufacturing/Packaging ]
• Scientists use carbon nanotubes to explore phase transitions (09/02/10) [ T&M ]
• India's SDS opens global office in U.S. (09/02/10) [ Embedded ]
• HD multimedia graphics card lowers cost (09/02/10) [ Embedded ]
• Power amp tailored for WiMAX mobile apps (09/02/10) [ RF/Microwave ]

• Snap-in connectors offered in over-moulded design (09/02/10) [ Networks ]
• Low-power I/O expanders overcome CPU limitations (09/02/10) [ Interface ]
• 900MHz RF SoC packs 96KB SRAM (09/02/10) [ RF/Microwave ]
• LTE UE cuts time-to-market for terminal devices (09/02/10) [ RF/Microwave ]
• Media tablets shipments to rise to 5.7crore by 2015 (08/02/10) [ Embedded ]

• SMIC, SHHIC offer contactless smart card ICs (08/02/10) [ RF/Microwave ]
• TowerJazz, Soitec work on BSI sensors solutions (08/02/10) [ Manufacturing/Packaging ]
• Irish wireless tech groups form WirelessLAB (08/02/10) [ RF/Microwave ]
• IPG buys IR laser developer (08/02/10) [ Optoelectronics/Displays ]
• NSN, LG achieve max speed for Class 3 LTE (08/02/10) [ RF/Microwave ]

• Cypress, NIT to set up PSoC lab in Calicut (08/02/10) [ Embedded ]
• LSI, Seagate join forces on PCIe storage solutions (08/02/10) [ Networks ]
• JEDEC-compatible memory buffer ups data centre performance (08/02/10) [ Interface ]
• Transmitter enables handsets with HDMI 1.4 (08/02/10) [ Interface ]
• Rugged COM tailored for tough environments (08/02/10) [ Embedded ]

• 30nm DRAM delivers up to 30% power savings (08/02/10) [ Memory/Storage ]
• Compact 2.5A optocoupler targets HEVs (08/02/10) [ Optoelectronics/Displays ]
• Triaxial accelerometer detects specific motion patterns (08/02/10) [ Embedded ]
• 8A/channel power regulator offers design flexibility (08/02/10) [ Power/Alternative Energy ]
• PV Outlook: Growing demand plus lower costs equal higher margins (05/02/10) [ Power/Alternative Energy ]

• Huawei, Qualcomm demo 42Mbps HSPA+ downlink (05/02/10) [ RF/Microwave ]
• Synopsys bags VaST Systems (05/02/10) [ EDA/IP ]
• Renesas completes MCU production facility (05/02/10) [ Manufacturing/Packaging ]
• Optimism marks 2010 EDA forecasts (05/02/10) [ EDA/IP ]
• Applied execs accused of stealing Samsung process (05/02/10) [ Manufacturing/Packaging ]

• SkyCross, Altair collaborate on LTE sol'n (05/02/10) [ RF/Microwave ]
• Spectrum analyser packs touchscreen for ease of use (05/02/10) [ T&M ]
• Automotive MOSFETs boast 0.7mΩ RDS(on) (05/02/10) [ Power/Alternative Energy ]
• Audio amp delivers louder output without audible pop (05/02/10) [ Amplifiers/Converters ]
• HPCE connector offers touch-proof safety features (05/02/10) [ Networks ]

• Cable transceiver trims power, PCB space (05/02/10) [ Interface ]
• TRIM-supported SSD packs up to 512GB memory (05/02/10) [ Memory/Storage ]
• Future research avenues in EDA (04/02/10) [ EDA/IP ]
• LED to corner large-area LCD backlights market (04/02/10) [ Optoelectronics/Displays ]
• Cypress joins Open Handset Alliance (04/02/10) [ Embedded ]

• Micron remains upbeat despite downturn (04/02/10) [ Memory/Storage ]
• Roadblocks ahead for smart grid adoption (04/02/10) [ RF/Microwave ]
• Simulation tool boosts performance up to 100x (04/02/10) [ EDA/IP ]
• Karnataka unveils semicon policy at ISA Vision Summit (04/02/10) [ EDA/IP ]
• Two-string HB LED driver targets automotive apps (04/02/10) [ Power/Alternative Energy ]

• LDO packs internal protection circuitry (04/02/10) [ Power/Alternative Energy ]
• Tiny load switches offer 4kV ESD protection (04/02/10) [ Power/Alternative Energy ]
• Low-power DSP core targets portable apps (04/02/10) [ Embedded ]
• ARM gears three more cores for 2010 (04/02/10) [ Embedded ]
• PHR-ST capacitors come in large case sizes (04/02/10) [ Power/Alternative Energy ]

• Power module reduces product delay risks (03/02/10) [ Power/Alternative Energy ]
• HSPA+ RF transceiver boasts 28.8Mbps downlink rate (03/02/10) [ RF/Microwave ]
• High-speed DDR2 SDRAM suits automotive, net apps (03/02/10) [ Memory/Storage ]
• App processor comes with graphic draw engine (03/02/10) [ Embedded ]
• Schottky rectifier delivers 0.7µA reverse leakage current (03/02/10) [ Power/Alternative Energy ]

• PTC thermistors handle up to 280°C (03/02/10) [ Power/Alternative Energy ]
• IMS: Electric cars propel IC demand (03/02/10) [ Embedded ]
• MEMC, Conergy amend solar wafer deal (03/02/10) [ Power/Alternative Energy ]
• Semprius, Siemens team on solar energy (03/02/10) [ T&M ]
• Atmel to put smart card operations on sale (03/02/10) [ Embedded ]

• Coming soon: Graphene chips (03/02/10) [ Manufacturing/Packaging ]
• Qualcomm makes peace with South Korea (03/02/10) [ RF/Microwave ]
• Infineon exec addresses IDM challenges in wireless sector (02/02/10) [ Embedded ]
• Clock drivers pack 2:1 mux, 1:6 fanout buffer (02/02/10) [ Interface ]
• Power modules cut need for external inductor (02/02/10) [ Power/Alternative Energy ]

• Integrated 8bit MCU comes in 3mm x 3mm DFN (02/02/10) [ Embedded ]
• UV LEDs offer 385/405/415nm wavelengths (02/02/10) [ Optoelectronics/Displays ]
• Zigbee module achieves 40km at 315mW (02/02/10) [ RF/Microwave ]
• Sealed, cleanable connectors suit military, medical apps (02/02/10) [ Networks ]
• Premier Farnell, On Semi expand distribution ties (02/02/10) [ EDA/IP ]

• ABI: Wi-Fi chips up 28% in 2009 (02/02/10) [ RF/Microwave ]
• ROHM licenses MoSys 1T-SRAM tech (02/02/10) [ Memory/Storage ]
• DirectTV tests Wi-Fi, G.hn on STBs (02/02/10) [ RF/Microwave ]
• ST owns iPad trademark (02/02/10) [ Embedded ]
• IM Flash takes NAND lead with 25nm ICs (02/02/10) [ Memory/Storage ]

• ISA focuses summit vision on growth (02/02/10) [ EDA/IP ]
• Slight recovery on the cards for CE market in 2010 (01/02/10) [ Embedded ]
• Industry calls for smart card security standard (01/02/10) [ Embedded ]
• Microsemi, MagnaChip collaborate on BCD process (01/02/10) [ Manufacturing/Packaging ]
• Bouquets and brickbats for the iPad (01/02/10) [ Embedded ]

• Analyst finds flaws in fab-lite biz model (01/02/10) [ Manufacturing/Packaging ]
• Cisco, NetApp, VMware push secure virtual data centres (01/02/10) [ Networks ]
• Sub-$100 AMD processors target desktops (01/02/10) [ Embedded ]
• Snap-acting switches offer >100,000 cycles (01/02/10) [ Networks ]
• Digital audio-grade IC enables 32kHz sampling rate (01/02/10) [ Amplifiers/Converters ]

• Hard-metric connectors offer 10GΩ insulation resistance (01/02/10) [ Networks ]
• Ultra low-power audio DAC targets portable apps (01/02/10) [ Amplifiers/Converters ]
• Step-down regulator packs programmable watchdog timer (01/02/10) [ Power/Alternative Energy ]
• Recession seeds innovation in chip market (01/02/10) [ EDA/IP ]