• Bluetooth corners 55% of short-range wireless IC shipments (03/03/10) [ RF/Microwave ]
• Trio explores new model to improve healthcare delivery (03/03/10) [ Embedded ]
• Solar panels achieve conversion efficiency of 8.58% (03/03/10) [ Power/Alternative Energy ]
• TI: Mobile phones split architecture will rise (03/03/10) [ Embedded ]
• Delays, double-patterning dominates SPIE Litho (03/03/10) [ Manufacturing/Packaging ]

• Analysis: Why Atom-based SoCs are not hot? (03/03/10) [ EDA/IP ]
• Hathway, Datacom offer internet cable access at 100Mbps (03/03/10) [ Networks ]
• PLD architecture trades off time with circuit density (03/03/10) [ EDA/IP ]
• DrMOS targets high-power CPU based systems (03/03/10) [ Power/Alternative Energy ]
• 96KB RAM MCU eases software design (03/03/10) [ Embedded ]

• FPGA debug tool cuts design time by 50% (03/03/10) [ EDA/IP ]
• Open-air current resistors target high-temp setups (03/03/10) [ Power/Alternative Energy ]
• Power amp targets TD-SCDMA handsets (03/03/10) [ Amplifiers/Converters ]
• 2G transmit modules targets high end handsets (03/03/10) [ RF/Microwave ]
• Blood glucose meter teardown reveals simple electronics (03/03/10) [ Processors/DSPs ]

• MOSFETs enable device consolidation (02/03/10) [ Power/Alternative Energy ]
• Integrated buck driver eases design (02/03/10) [ Power/Alternative Energy ]
• Low-current 4bit MCUs target mobile devices (02/03/10) [ Embedded ]
• Tiny PIR sensor offers surface mount (02/03/10) [ Embedded ]
• 40nm process 4Gbit DDR3 ups server memory (02/03/10) [ Memory/Storage ]

• LXI high voltage matrix withstands up to 1KV voltage (02/03/10) [ Interface ]
• PMP shipments to reach 24.16 crore by 2015 (02/03/10) [ Embedded ]
• Solar market competition set to intensify (02/03/10) [ Manufacturing/Packaging ]
• CamSemi strengthens presence in Korea (02/03/10) [ Manufacturing/Packaging ]
• HP Labs starts cloud platform research lab in Singapore (02/03/10) [ Embedded ]

• Nikon outlines litho plan (02/03/10) [ Manufacturing/Packaging ]
• Intel, TSMC Atom partnership hits a roadblock (02/03/10) [ Embedded ]
• TSMC addresses issues (02/03/10) [ Manufacturing/Packaging ]
• Lukewarm budget for semicon industry (02/03/10) [ EDA/IP ]
• LED driver enables 90% efficiency (01/03/10) [ Power/Alternative Energy ]

• Optoisolator delivers AC/DC isolation up to 16KV (01/03/10) [ Amplifiers/Converters ]
• Power amp enables low battery current for 3G (01/03/10) [ Amplifiers/Converters ]
• Automotive flash MCUs offers nine timer channels (01/03/10) [ Embedded ]
• Real-time bandwidth oscilloscopes suit IQ-modulated signals (01/03/10) [ T&M ]
• All-in-one home router packs 3.2-inch LCD screen (01/03/10) [ RF/Microwave ]

• eBeam initiative signs up six more members (01/03/10) [ Manufacturing/Packaging ]
• LCD TV growth in 2009 exceeds forecast (01/03/10) [ Optoelectronics/Displays ]
• Mavrix gets MIPS tech for Android based mobile devices (01/03/10) [ Embedded ]
• Dialog, TSMC work on BCD based PMICs for portable apps (01/03/10) [ Manufacturing/Packaging ]
• Smarter feature handsets on the cards (01/03/10) [ Embedded ]

• EUV delay makes alternatives a reality (01/03/10) [ Manufacturing/Packaging ]
• Defence offers opportunities to Indian electronics (01/03/10) [ Embedded ]
• Essar Telecom sells in all cash deal of Rs.2,000 crores (01/03/10) [ RF/Microwave ]
• Bridge ICs target mobile phones (26/02/10) [ Interface ]
• Silicon surge protectors offers mandatory protection (26/02/10) [ Power/Alternative Energy ]

• MOSFETs feature low thermal resistance <0.5&#176;C/W (26/02/10) [ Power/Alternative Energy ]
• RF switch pack CMOS control logic (26/02/10) [ RF/Microwave ]
• 40nm process tech PCIe 3.0 switches to be sampled (26/02/10) [ Interface ]
• Smartphone HSPA&#43; sol'n measures < 600mm² (26/02/10) [ RF/Microwave ]
• Asia Pacific leads global WiMAX coverage (26/02/10) [ RF/Microwave ]

• Toshiba, Fujitsu form JV in China (26/02/10) [ Manufacturing/Packaging ]
• Infineon sues Elpida (26/02/10) [ Manufacturing/Packaging ]
• EC sets up task force for nanoscale memory project (26/02/10) [ Memory/Storage ]
• Junctionless transistor lowers power usage (26/02/10) [ Manufacturing/Packaging ]
• EDA execs demur on growth forecasts (26/02/10) [ EDA/IP ]

• Nanofibres enable energy efficient lighting (26/02/10) [ Power/Alternative Energy ]
• Cypress sets up one more PSoC Lab for education (26/02/10) [ Embedded ]
• NEC, Telefonica promote cloud computing in Latin America (25/02/10) [ Embedded ]
• Altair, ZTE team on LTE (25/02/10) [ T&M ]
• Mephisto tools IMEC's green radios program (25/02/10) [ EDA/IP ]

• Mobile ICs set a hard pace of change for market (25/02/10) [ RF/Microwave ]
• Intel delays EUV litho (25/02/10) [ Manufacturing/Packaging ]
• CMOS or GaAs for 3G handset PAs? (25/02/10) [ Amplifiers/Converters ]
• Electric vehicles concept set to rise in India (25/02/10) [ Power/Alternative Energy ]
• Semicon industry's wishlist to the union gov't (25/02/10) [ EDA/IP ]

• LED driver packs programmable on time limiter (25/02/10) [ Power/Alternative Energy ]
• Audio sub-systems packs analogue bypass switch (25/02/10) [ Amplifiers/Converters ]
• Atom-powered SBC packs 2GB RAM (25/02/10) [ Embedded ]
• Hall sensors can replace classic potentiometers (25/02/10) [ Embedded ]
• Cortex-M4 extends to mathematical computation apps (25/02/10) [ Embedded ]

• PWM controller packs MOSFET control outputs (25/02/10) [ Power/Alternative Energy ]
• DRAM revenues set to grow by 40.4% this year (24/02/10) [ Memory/Storage ]
• Toshiba, AIST team to up accuracy of optical litho (24/02/10) [ Manufacturing/Packaging ]
• TI, S3 Group's healthcare USB platform eases design (24/02/10) [ Embedded ]
• Barclays: Platform fragmentation on the cards (24/02/10) [ Embedded ]

• Plastic wires grow solar cells (24/02/10) [ Manufacturing/Packaging ]
• Samsung wants EUV litho by 2012 (24/02/10) [ Manufacturing/Packaging ]
• embWiSe offers SDIOWorx support on Windows CE OS (24/02/10) [ Embedded ]
• Citrix, Novell for better managing of virtual data centres (24/02/10) [ Networks ]
• GPS receiver offers PCB footprint of 30mm&#178; (24/02/10) [ RF/Microwave ]

• Reconfigurable compact test sytem suits any DUT (24/02/10) [ T&M ]
• Buck-boost converter voltage range suits all PC card slots (24/02/10) [ Power/Alternative Energy ]
• Deserialiser bridge IC targets HD panels (24/02/10) [ Interface ]
• DLP chips equip handsets with nHD pico projectors (24/02/10) [ Embedded ]
• Mesh wireless network offers TCP/IP compatibility (24/02/10) [ RF/Microwave ]

• Silicon Hive, Intel focus on smartphones, embedded apps (23/02/10) [ Embedded ]
• Sub-1GHz Zigbee certification widens OEM offerings (23/02/10) [ RF/Microwave ]
• Open-Silicon, Virage team on low-power silicon (23/02/10) [ EDA/IP ]
• Car makers discuss HEV design, battery options (23/02/10) [ Embedded ]
• Mitsubishi sets two records for PV efficiency (23/02/10) [ Power/Alternative Energy ]

• GaAs best suits 3G handset PAs (23/02/10) [ Amplifiers/Converters ]
• Kopin, Mistral deliver Golden-i platform for mobiles (23/02/10) [ RF/Microwave ]
• Shedding new light on solar power (23/02/10) [ Manufacturing/Packaging ]
• MCUs operate at 120MHz (23/02/10) [ Embedded ]
• Three-axis gyro controlled by single sensing structure (23/02/10) [ Embedded ]

• Memory architecture enables high-bandwidth mobiles (23/02/10) [ Memory/Storage ]
• Tiny connectors suit mobile devices, tight packaging apps (23/02/10) [ Networks ]
• Industrial server doubles up as supercomputer (23/02/10) [ Embedded ]
• Dual 3A regulator delivers up to 96% efficiencies (23/02/10) [ Power/Alternative Energy ]
• Fibre broadband to post 20% CAGR from '08-'14 (22/02/10) [ RF/Microwave ]

• Audi cars get 3G-connected via Qualcomm (22/02/10) [ RF/Microwave ]
• Alcatel-Lucent, Sequans team on LTE solutions (22/02/10) [ RF/Microwave ]
• Intel explores Li-ion battery alternatives (22/02/10) [ Manufacturing/Packaging ]
• Barclays sees PC processor, server growth this year (22/02/10) [ Embedded ]
• Verification: Key to automotive apps success (22/02/10) [ EDA/IP ]

• Aircel, NSN team to roll out GSM services in north India (22/02/10) [ RF/Microwave ]
• Soitec mass produces SOI substrates for cell phones (22/02/10) [ RF/Microwave ]
• Multi-mode, multi-band PAs target smart phones, data cards (22/02/10) [ Amplifiers/Converters ]
• Resonant converter offers capacitive mode protection (22/02/10) [ Power/Alternative Energy ]
• 1U metal frame power supplies operate over -25&#176;C to &#43;60&#176;C (22/02/10) [ Power/Alternative Energy ]

• Plug-and-play LED driver offers wide input voltage (22/02/10) [ Power/Alternative Energy ]
• Faster FPGAs roll for mobile devices (22/02/10) [ EDA/IP ]
• Sub-1&#181;A shunt IC charger protects Li-ion cells (22/02/10) [ Power/Alternative Energy ]