• N+1 redundancy AC/DC power supply includes hot-docking (10/03/10) [ Power/Alternative Energy ]
• Foolproof Zigbee module eases app dev't (10/03/10) [ RF/Microwave ]
• 1Mpixel sensor delivers 720p HD video at 30fps (10/03/10) [ Optoelectronics/Displays ]
• 32bit MCU family targets inverter control apps (10/03/10) [ Embedded ]
• Multi-mode LTE modem core enables global usage (10/03/10) [ Embedded ]

• Wireless comm integrated SoC to network industrial apps (10/03/10) [ RF/Microwave ]
• Barriers restrict China PV market growth (10/03/10) [ Power/Alternative Energy ]
• MergeOptics assets complements FCI (10/03/10) [ Networks ]
• Molex's Beijing set up targets mobile design (10/03/10) [ EDA/IP ]
• Qualcomm enables a high-tech health survey for Korea (10/03/10) [ RF/Microwave ]

• NXP's fab-lite movement gathers momentum (10/03/10) [ Amplifiers/Converters ]
• ASML, Nikon lock horns on Intel 22nm litho biz (10/03/10) [ Manufacturing/Packaging ]
• Researchers develop speedy cell phone test (10/03/10) [ Amplifiers/Converters ]
• Analyst examines wireless tech for fitness apps (10/03/10) [ RF/Microwave ]
• CompactPCI blade series packs onboard 2GB SDRAM (09/03/10) [ Embedded ]

• LTE antenna sol'n offers 2.5x faster 4G data rates (09/03/10) [ RF/Microwave ]
• SSDs offer read/write speeds up to 250Mbps/170Mbps (09/03/10) [ Memory/Storage ]
• Processor offers 1.7DMIPS/MHz performance (09/03/10) [ Embedded ]
• USB tipped Wi-Fi tester ready to go in 3s (09/03/10) [ T&M ]
• Low cost 8bit MCU line offers 10x performance (09/03/10) [ Embedded ]

• 3D TV shipments to post CAGR of 80% by 2015 (09/03/10) [ Optoelectronics/Displays ]
• IBM takes a step closer to on-chip optical comms (09/03/10) [ Amplifiers/Converters ]
• Toshiba eyes 10% of Japan's PV market by 2012 (09/03/10) [ Power/Alternative Energy ]
• Kingdee opens hub in Singapore (09/03/10) [ Embedded ]
• Innovation in tech to address three R's (09/03/10) [ Power/Alternative Energy ]

• Earthquake disrupts Taiwan LCD plants, foundries (09/03/10) [ Manufacturing/Packaging ]
• mBit runs contest to test, debug its mobile P2P app (09/03/10) [ Embedded ]
• Cisco offers borderless security (09/03/10) [ Networks ]
• iPDK open standard released (08/03/10) [ EDA/IP ]
• Altera outlines challenges for IC industry (08/03/10) [ EDA/IP ]

• Chip design cost to shoot up (08/03/10) [ EDA/IP ]
• Will Samsung lead the pack in foundry biz? (08/03/10) [ Manufacturing/Packaging ]
• Apple-HTC big fight leads to smart phone patent war (08/03/10) [ EDA/IP ]
• Mobile data usage drives mobile, wireless market growth (08/03/10) [ RF/Microwave ]
• Wipro brings eco-friendly desktops (08/03/10) [ Manufacturing/Packaging ]

• Mitsubishi completes PV cell plant at Iida (08/03/10) [ Power/Alternative Energy ]
• Cost optimised FPGAs support multiple automotive platforms (08/03/10) [ EDA/IP ]
• 96% efficient regulator boosts battery life (08/03/10) [ Power/Alternative Energy ]
• Single-feed MTM antenna integrates multiple bands (08/03/10) [ RF/Microwave ]
• Dual USB2.0 host/slave controller is programmable (08/03/10) [ Embedded ]

• 64GB iNAND EFD tailored for smartphone (08/03/10) [ Memory/Storage ]
• Model-based design program targets industrial systems (08/03/10) [ EDA/IP ]
• LTE deployment will be gradual, protracted (05/03/10) [ RF/Microwave ]
• TI: Smart phone features will enable lower end handsets (05/03/10) [ Embedded ]
• TowerJazz to spur IC design for Korea academia (05/03/10) [ EDA/IP ]

• SanDisk, Toshiba eyes the top spot for NAND process lead (05/03/10) [ Memory/Storage ]
• ICs back on the path of growth (05/03/10) [ Embedded ]
• 3D TV rise leads to funding for health research (05/03/10) [ Optoelectronics/Displays ]
• TI challenges embedded engineers with Stellaris MCU (05/03/10) [ EDA/IP ]
• CSA, Novell deliver standards for cloud adoption (05/03/10) [ Networks ]

• Low part count power modules ups reliability (05/03/10) [ Power/Alternative Energy ]
• Wireless MCUs designed for smart home apps (05/03/10) [ Embedded ]
• Slide switches structured for better tactile feedback (05/03/10) [ Networks ]
• MCU sub-system tipped flash-based FPGAs eases design (05/03/10) [ Embedded ]
• MCUs use 900nA in deep sleep, 20nA in shut off mode (05/03/10) [ Embedded ]

• Versatile 890GX chipset ups 3D graphics, HD experience (05/03/10) [ Embedded ]
• The science and art of pulse-CO oximeter (04/03/10) [ Embedded ]
• NOR flash market on the road to recovery (04/03/10) [ Memory/Storage ]
• RFMD, SELEX deepen their GaAs MMIC relation (04/03/10) [ RF/Microwave ]
• Bluetooth finds foothold in smart grid market (04/03/10) [ RF/Microwave ]

• 3D TV launch flags health concerns (04/03/10) [ Optoelectronics/Displays ]
• Nanoimprint for HDDs still under wraps (04/03/10) [ Manufacturing/Packaging ]
• NXP ponders on converting wafer fab to solar facility (04/03/10) [ Manufacturing/Packaging ]
• Peratech to develop tactile robotic skin for MIT (04/03/10) [ Embedded ]
• Sybase, Wipro partner for handset SAP apps (04/03/10) [ Embedded ]

• Tiny LEDs target automotive, industrial apps (04/03/10) [ Optoelectronics/Displays ]
• Dual LDO offers ±150mA output per channel (04/03/10) [ Power/Alternative Energy ]
• Six-axis sensor has current consumption of 6.1mA (04/03/10) [ Embedded ]
• Apps processor targets next-gen e-reader (04/03/10) [ Embedded ]
• 40nm FPGAs target 3Gbps transceiver apps (04/03/10) [ EDA/IP ]

• Fixed frequency controller targets AC/DC adaptor apps (04/03/10) [ Power/Alternative Energy ]
• Bluetooth corners 55% of short-range wireless IC shipments (03/03/10) [ RF/Microwave ]
• Trio explores new model to improve healthcare delivery (03/03/10) [ Embedded ]
• Solar panels achieve conversion efficiency of 8.58% (03/03/10) [ Power/Alternative Energy ]
• TI: Mobile phones split architecture will rise (03/03/10) [ Embedded ]

• Delays, double-patterning dominates SPIE Litho (03/03/10) [ Manufacturing/Packaging ]
• Analysis: Why Atom-based SoCs are not hot? (03/03/10) [ EDA/IP ]
• Hathway, Datacom offer internet cable access at 100Mbps (03/03/10) [ Networks ]
• PLD architecture trades off time with circuit density (03/03/10) [ EDA/IP ]
• DrMOS targets high-power CPU based systems (03/03/10) [ Power/Alternative Energy ]

• 96KB RAM MCU eases software design (03/03/10) [ Embedded ]
• FPGA debug tool cuts design time by 50% (03/03/10) [ EDA/IP ]
• Open-air current resistors target high-temp setups (03/03/10) [ Power/Alternative Energy ]
• Power amp targets TD-SCDMA handsets (03/03/10) [ Amplifiers/Converters ]
• 2G transmit modules targets high end handsets (03/03/10) [ RF/Microwave ]

• Blood glucose meter teardown reveals simple electronics (03/03/10) [ Processors/DSPs ]
• MOSFETs enable device consolidation (02/03/10) [ Power/Alternative Energy ]
• Integrated buck driver eases design (02/03/10) [ Power/Alternative Energy ]
• Low-current 4bit MCUs target mobile devices (02/03/10) [ Embedded ]
• Tiny PIR sensor offers surface mount (02/03/10) [ Embedded ]

• 40nm process 4Gbit DDR3 ups server memory (02/03/10) [ Memory/Storage ]
• LXI high voltage matrix withstands up to 1KV voltage (02/03/10) [ Interface ]
• PMP shipments to reach 24.16 crore by 2015 (02/03/10) [ Embedded ]
• Solar market competition set to intensify (02/03/10) [ Manufacturing/Packaging ]
• CamSemi strengthens presence in Korea (02/03/10) [ Manufacturing/Packaging ]

• HP Labs starts cloud platform research lab in Singapore (02/03/10) [ Embedded ]
• Nikon outlines litho plan (02/03/10) [ Manufacturing/Packaging ]
• Intel, TSMC Atom partnership hits a roadblock (02/03/10) [ Embedded ]
• TSMC addresses issues (02/03/10) [ Manufacturing/Packaging ]
• Lukewarm budget for semicon industry (02/03/10) [ EDA/IP ]

• LED driver enables 90% efficiency (01/03/10) [ Power/Alternative Energy ]
• Optoisolator delivers AC/DC isolation up to 16KV (01/03/10) [ Amplifiers/Converters ]
• Power amp enables low battery current for 3G (01/03/10) [ Amplifiers/Converters ]
• Automotive flash MCUs offers nine timer channels (01/03/10) [ Embedded ]
• Real-time bandwidth oscilloscopes suit IQ-modulated signals (01/03/10) [ T&M ]

• All-in-one home router packs 3.2-inch LCD screen (01/03/10) [ RF/Microwave ]
• eBeam initiative signs up six more members (01/03/10) [ Manufacturing/Packaging ]
• LCD TV growth in 2009 exceeds forecast (01/03/10) [ Optoelectronics/Displays ]
• Mavrix gets MIPS tech for Android based mobile devices (01/03/10) [ Embedded ]
• Dialog, TSMC work on BCD based PMICs for portable apps (01/03/10) [ Manufacturing/Packaging ]

• Smarter feature handsets on the cards (01/03/10) [ Embedded ]
• EUV delay makes alternatives a reality (01/03/10) [ Manufacturing/Packaging ]
• Defence offers opportunities to Indian electronics (01/03/10) [ Embedded ]
• Essar Telecom sells in all cash deal of Rs.2,000 crores (01/03/10) [ RF/Microwave ]