• Mentor, ST partner on 32/20nm design solutions (19/03/10) [ EDA/IP ]
• LCD monitor shipments up by 3.8% (19/03/10) [ Optoelectronics/Displays ]
• AuthenTec takes over SafeNet (19/03/10) [ Embedded ]
• Lighting initiative aims for on-body healthcare apps (19/03/10) [ Optoelectronics/Displays ]
• Microchannels to cool down 3D IC architecture (19/03/10) [ Manufacturing/Packaging ]

• Si nanocomposites better Li-ion battery performance (19/03/10) [ Manufacturing/Packaging ]
• Microsemi, Brijot accelerate dev't of body scanners (19/03/10) [ Amplifiers/Converters ]
• Qualcomm to bid in India's broadband auction (19/03/10) [ RF/Microwave ]
• PCIe module offers 3x 3D graphics performance (19/03/10) [ Embedded ]
• STM32 family value line targets 16bit designs (19/03/10) [ Embedded ]

• Intel tailors affordable SSDs for netbooks, desktops (19/03/10) [ Memory/Storage ]
• 1000mA LED flash driver ups output by 25% (19/03/10) [ Power/Alternative Energy ]
• 3D PLDs pack 5.5MB RAM, 920 parallel I/Os, 44 PLLs (19/03/10) [ EDA/IP ]
• 3MHz, 2A DC/DC converter designed for portable apps (19/03/10) [ Power/Alternative Energy ]
• IMEC, Altos to set up library re-characterisation service (18/03/10) [ EDA/IP ]

• SunEdison to build largest solar plant of 72MW in Europe (18/03/10) [ Power/Alternative Energy ]
• Speciality foundries spread their wings (18/03/10) [ Manufacturing/Packaging ]
• Canon keeps mum on litho nanoimprint (18/03/10) [ Manufacturing/Packaging ]
• IBM, NID partner on mobile tech (18/03/10) [ Interface ]
• Industry joins forces for network test, automation (18/03/10) [ T&M ]

• RF front-ends reduce handset assembly costs (18/03/10) [ RF/Microwave ]
• Light sensors detect behind translucent materials (18/03/10) [ Embedded ]
• Processor enables creation of multi-format video (18/03/10) [ Embedded ]
• FPGA, adapter modules offer interface with test apps (18/03/10) [ Embedded ]
• Dual output DC/DC controller draws 60µA (18/03/10) [ Power/Alternative Energy ]

• Power conversion IC family allows 85mW No-Load (18/03/10) [ Power/Alternative Energy ]
• SunPower, K6 partner for 1MW solar plants in Italy (17/03/10) [ Power/Alternative Energy ]
• Process tech eases ASIC conversion (17/03/10) [ EDA/IP ]
• Opinion: High costs will harm Google Chrome (17/03/10) [ Embedded ]
• NTU, NI collaborate on wireless comms (17/03/10) [ RF/Microwave ]

• Huawei expands in Turkey with R&D centre (17/03/10) [ Embedded ]
• FormFactor opens wafer probe card facility (17/03/10) [ Manufacturing/Packaging ]
• Tessera, UTAC sign tech agreement settling lawsuit (17/03/10) [ T&M ]
• Wipro, Microsoft collaborate on enterprise cloud (17/03/10) [ Embedded ]
• Inductors offer current ratings from 205mA to 1384mA DC (17/03/10) [ Power/Alternative Energy ]

• Hi-integrated PFC controller cuts 54 external parts (17/03/10) [ Power/Alternative Energy ]
• Power amps ups WiMAx signal quality at low power (17/03/10) [ Amplifiers/Converters ]
• Touch controller designed for automotives (17/03/10) [ Embedded ]
• Microprocessors target embedded-control apps across segments (17/03/10) [ Embedded ]
• 12-channel sequencer integrates fan control (17/03/10) [ Power/Alternative Energy ]

• Touchcreen mobiles up by 96.8% from 2009 (16/03/10) [ Interface ]
• National's new CEO wants revenue growth (16/03/10) [ Manufacturing/Packaging ]
• 2010 predictions for Southeast Asia telecom market (16/03/10) [ Embedded ]
• HDMI 1.4a includes mandatory 3D formats (16/03/10) [ Interface ]
• Emerging markets surpass mature markets in CE (16/03/10) [ Embedded ]

• Microsoft India releases end-to-end cloud services (16/03/10) [ Embedded ]
• Variety of sensors, 32bit MCU packed in single IMU sol'n (16/03/10) [ Embedded ]
• Floating point unit ups MCU performance (16/03/10) [ Embedded ]
• Motherboards offer radiation cut up to 50% (16/03/10) [ Embedded ]
• LCD makers fight back e-paper (15/03/10) [ Optoelectronics/Displays ]

• Graphene enables cheaper, thinner OLEDs (15/03/10) [ Manufacturing/Packaging ]
• Opinion: Survival tips for mobile systems flood (15/03/10) [ Embedded ]
• Production volumes to drop LED backlight costs (15/03/10) [ Optoelectronics/Displays ]
• Magma, Chengdu ICC open joint IC design lab (15/03/10) [ EDA/IP ]
• Alchimer opens 3D TSV tech facility in South Korea (15/03/10) [ Manufacturing/Packaging ]

• T-Venture invests in Lantiq (15/03/10) [ Networks ]
• Moser Baer's PV modules achieve 7.3% efficiency (15/03/10) [ Manufacturing/Packaging ]
• RF VSGs, VSAs suit multi-channel MIMO wireless apps (15/03/10) [ T&M ]
• PWM controllers operate over MIL temp-55°C to 125°C (15/03/10) [ Embedded ]
• LED driver features high PWM dimming ratio (15/03/10) [ Power/Alternative Energy ]

• Current-sense switches prevent system damage (15/03/10) [ Networks ]
• USB 2.0 FPGA module enables instant reprogramming (15/03/10) [ Embedded ]
• SiGe passive mixer packs on-chip LO buffer (15/03/10) [ Embedded ]
• RFID market to post 14% CAGR by 2015 (12/03/10) [ RF/Microwave ]
• IMEC, Synopsys to research on 3D stacked ICs (12/03/10) [ Manufacturing/Packaging ]

• Yingli expands in Baoding to give 1GW by year end (12/03/10) [ Manufacturing/Packaging ]
• E-beam direct-write litho to be here only by 2015 (12/03/10) [ Manufacturing/Packaging ]
• Fuel-coated carbon nanotubes act as fuses (12/03/10) [ Manufacturing/Packaging ]
• Rumours: Gate-last tech for Samsung in 22nm (12/03/10) [ Manufacturing/Packaging ]
• SNRY Solar opens vocational solar school (12/03/10) [ Power/Alternative Energy ]

• Broadcom pushes Bluetooth for health devices (12/03/10) [ RF/Microwave ]
• RF range extender provides up to +149dB link budget (12/03/10) [ RF/Microwave ]
• Analogue radios go digital with mixed-signal receiver (12/03/10) [ Amplifiers/Converters ]
• ESD protection device suits high-speed interfaces (12/03/10) [ Embedded ]
• Core router handles 100Gbps streams with 3x throughput (12/03/10) [ RF/Microwave ]

• GaAs power amp lowers part count (12/03/10) [ Amplifiers/Converters ]
• 8-bit PIC MCUs deliver 50µA/MHz active current (12/03/10) [ Embedded ]
• iSuppli forsees LED shortage (11/03/10) [ Optoelectronics/Displays ]
• SunPower, Toshiba ink 32MW solar supply deal (11/03/10) [ Power/Alternative Energy ]
• Fairchild files against Power Integrations (11/03/10) [ Networks ]

• Taiwan liberalises restrictions on China investment (11/03/10) [ Optoelectronics/Displays ]
• Barclays highlights opportunities in mobile data (11/03/10) [ RF/Microwave ]
• Hunt for e-book display alternatives heats up (11/03/10) [ Optoelectronics/Displays ]
• Interlaken IOT ratifies Altera's Stratix IV FPGAs (11/03/10) [ RF/Microwave ]
• 4G ID bags UIDAI contract for devices (11/03/10) [ Embedded ]

• Supercap charger suits portable, data storage apps (11/03/10) [ Power/Alternative Energy ]
• Energy efficient Atom platform fits SOHO storage apps (11/03/10) [ Embedded ]
• Non-volatile SPI flash memory ups flexibility (11/03/10) [ Memory/Storage ]
• Transceiver packs block resistance to handle ISM band (11/03/10) [ RF/Microwave ]
• CCFL controllers feature inverter SYNC functionality (11/03/10) [ Embedded ]

• Dual-interface EEPROM allows RF access to electronic devices (11/03/10) [ RF/Microwave ]