• China vendors lead broadband cell modem market in '09 (01/07/10) [ RF/Microwave ]
• GE Lighting licenses Rambus ref designs (01/07/10) [ Optoelectronics/Displays ]
• Cisco to lend ICT expertise for connected Abu Dhabi (01/07/10) [ Embedded ]
• Atmel does away with smart card biz (01/07/10) [ Embedded ]
• Why is Intel not driving WiDi as an open standard? (01/07/10) [ Interface ]

• IEEE supports smart grid with two standards (01/07/10) [ Networks ]
• Passive MEMS, actuators to automate car safety (01/07/10) [ Embedded ]
• Ethernet switch offers 28 GbE ports for IPv4/v6 networking (01/07/10) [ Interface ]
• MCUs feature improved PIR based motion detection capabilities (01/07/10) [ Embedded ]
• Highly sensitive THz detector employs GaN transistor (01/07/10) [ Power/Alternative Energy ]

• Microstep drivers offer selectable excitation modes (01/07/10) [ Embedded ]
• SiP packs on-chip firmware, MEMS sensors (01/07/10) [ Embedded ]
• USB 3.0 controller delivers 5Gbit/s interface (01/07/10) [ Interface ]
• Open source software competition heats up (30/06/10) [ Embedded ]
• DC/DC controller achieves high efficiency at light load (30/06/10) [ Power/Alternative Energy ]

• USB 3.0 transceiver transfers data at 5Gbit/s (30/06/10) [ Interface ]
• Oscilloscopes handle 500MHz to 2GHz (30/06/10) [ T&M ]
• Isolators replace optocouplers in harsh environment (30/06/10) [ Interface ]
• Wi-Fi healthcare deployment grows by 60% (30/06/10) [ Embedded ]
• MontaVista, Bosch partner on Linux in car (30/06/10) [ Embedded ]

• Analysts expect smart devices to flood consumer market (30/06/10) [ Embedded ]
• MCU ensures USB security for token apps (29/06/10) [ Embedded ]
• MOSFETs utilise copper clip technology (29/06/10) [ Power/Alternative Energy ]
• USB-to-GPIB adapter packs 32bit dynamic link libraries (29/06/10) [ Interface ]
• NXP packs 600W TVS diodes in SOD128 (29/06/10) [ Power/Alternative Energy ]

• Computer-on-module integrates 128KB FRAM (29/06/10) [ Embedded ]
• Serial RapidIO Gen2 devices switch at 20Gbit/s (29/06/10) [ Interface ]
• MindTree adopts Mentor's verification platform (29/06/10) [ EDA/IP ]
• Organic ICs close performance gap with silicon (29/06/10) [ Manufacturing/Packaging ]
• IEEE ratifies 40-, 100Gbit/s Ethernet standard (29/06/10) [ RF/Microwave ]

• iSuppli sees automotive MEMS rebound (29/06/10) [ Embedded ]
• Chinese gov't drives investment in IC industry (29/06/10) [ RF/Microwave ]
• iPhone 4 design exhibits high reuse (29/06/10) [ Embedded ]
• DC/DC converter tailored for 18V-75V input range (28/06/10) [ Power/Alternative Energy ]
• Fairchild video filters support SD, 1080i HD (28/06/10) [ Amplifiers/Converters ]

• ISM band amp integrates low-pass filter, power detector (28/06/10) [ RF/Microwave ]
• AMD accelerators boost computing to 2.64TFLOPS (28/06/10) [ Embedded ]
• Equipment addresses EV-DO, LTE-eHRPD testing (28/06/10) [ T&M ]
• FCI USB 2.0 connector offers increased reliability, durability (28/06/10) [ Interface ]
• Government support boosts PV market (28/06/10) [ Power/Alternative Energy ]

• Microsemi, Cisco enter PoE licensing (28/06/10) [ Networks ]
• DRAM vendors in the dock for price-fixing (28/06/10) [ Memory/Storage ]
• Stanford dean provides CMOS, education outlook (28/06/10) [ EDA/IP ]
• Samsung, TSMC charged with patent infringement (28/06/10) [ Manufacturing/Packaging ]
• IBM "fab club" synchronises 28nm process (28/06/10) [ Manufacturing/Packaging ]

• Zigbee modules pack SPI for high-speed throughput (25/06/10) [ RF/Microwave ]
• Multimedia demodulator simplifies DTV, STB designs (25/06/10) [ RF/Microwave ]
• LED lamps comply with EN 12966-1 standard (25/06/10) [ Optoelectronics/Displays ]
• Buck regulators integrate high-, low-side MOSFETs (25/06/10) [ Power/Alternative Energy ]
• FPGA ref design ups flexibility for HD surveillance cams (25/06/10) [ Embedded ]

• Software-defined modems cut LTE handset dev't time (25/06/10) [ Embedded ]
• 512-core server comes in 2U chassis (25/06/10) [ Embedded ]
• ST, Tsinghua University expand R&D partnership (25/06/10) [ EDA/IP ]
• Chengdu takes on hi-tech challenges (25/06/10) [ Embedded ]
• Universal charging to hit power adapter market (25/06/10) [ Power/Alternative Energy ]

• IBM to produce Infineon secure ICs for e-passports (25/06/10) [ Embedded ]
• EC funds green cloud services (25/06/10) [ Embedded ]
• Nikon plans to revive fab tool business (25/06/10) [ Manufacturing/Packaging ]
• Panel pushes intelligent devices for smart grid (25/06/10) [ Networks ]
• PCIe 3.0 compliance testing postponed to 2011 (25/06/10) [ Interface ]

• AMD uses Apache power noise, sign-off tools (24/06/10) [ EDA/IP ]
• TV tuner boasts 3.8dB noise figure at 210mW (24/06/10) [ Amplifiers/Converters ]
• Linear offers military-grade flyback controllers (24/06/10) [ Power/Alternative Energy ]
• Freescale runs multicore processors at 2.5GHz (24/06/10) [ Embedded ]
• VGA sensor captures video at 60fps (24/06/10) [ Optoelectronics/Displays ]

• 128GB NAND flash supports emmC ver.4.4 spec (24/06/10) [ Memory/Storage ]
• WiFi PAN IC delivers at 24Mbit/s (24/06/10) [ RF/Microwave ]
• Controller offers USB-to-Ethernet connection in 64-pin LQFP (24/06/10) [ Interface ]
• Analyst projects $8.5B in 2010 image sensor sales (24/06/10) [ Optoelectronics/Displays ]
• National acquires GTronix for analogue audio (24/06/10) [ Amplifiers/Converters ]

• Analysis: Will Spansion pull off a comeback? (24/06/10) [ Memory/Storage ]
• Viewpoint: Reducing your debug efforts (24/06/10) [ EDA/IP ]
• Motorola details Droid design challenges (24/06/10) [ EDA/IP ]
• Vishay offers 4-channel analogue mux (23/06/10) [ Interface ]
• Micrel regulator supplies 350mA to HDTV tuners (23/06/10) [ Power/Alternative Energy ]

• Motorola RAN solution adds LTE to WiMAX networks (23/06/10) [ RF/Microwave ]
• Software aids IC product lifecycle management (23/06/10) [ Embedded ]
• PLL synthesiser drives VCOs to cut out active loop filters (23/06/10) [ Interface ]
• DSP packs 24 cores to deliver 36GMACs at <55mW (23/06/10) [ Embedded ]
• Xilinx 28nm FPGAs pack two million logic cells (23/06/10) [ Embedded ]

• Elpida, PTI, UMC push 3D IC integration for 28nm (23/06/10) [ Manufacturing/Packaging ]
• ABI sees bright future for mobile TV (23/06/10) [ RF/Microwave ]
• Intel details resilient memories for low-power CPUs (23/06/10) [ Embedded ]
• DAC panel debates 3D TSV future (23/06/10) [ EDA/IP ]
• India's LED lighting to grow by 41.5% CAGR (23/06/10) [ Optoelectronics/Displays ]

• Arduino-compatible MCU sol'n offers ease of use (22/06/10) [ Embedded ]
• GlobalFoundries rolls validated library for 28nm (22/06/10) [ EDA/IP ]
• IC offers ESD protection, 5 data lines (22/06/10) [ Amplifiers/Converters ]
• WiFi module aids dual-band app development (22/06/10) [ RF/Microwave ]
• Layout visualisation tool integrates route trace (22/06/10) [ EDA/IP ]

• PC/104-compatible modules support 48-line digital I/O (22/06/10) [ Embedded ]
• Surface-mount bipolars handle 20V, high current (22/06/10) [ Power/Alternative Energy ]
• Scope handles 50Mbit/s to 40Gbit/s signals (22/06/10) [ T&M ]
• LTE to boost RF test equipment sales (22/06/10) [ T&M ]
• Broadcom sets eyes on Innovision to enter NFC (22/06/10) [ RF/Microwave ]

• TSMC takes 21% stake in solar PV company (22/06/10) [ Power/Alternative Energy ]
• MCA rallies group to set multi-core tool standards (22/06/10) [ EDA/IP ]
• DAC: EDA poised to enter the cloud (22/06/10) [ EDA/IP ]
• Taiwan vendor recovers in Q1 DRAM rankings (22/06/10) [ Memory/Storage ]
• Agilent tailors engineering solutions for educators (22/06/10) [ Embedded ]

• Asia adds 53% broadband lines in Q1 10 (21/06/10) [ RF/Microwave ]
• IMEC fabricates new process for GE-based TPV cell (21/06/10) [ Manufacturing/Packaging ]
• Fujitsu, Toshiba partner on cell phone biz (21/06/10) [ RF/Microwave ]
• Singapore, South Korea to boost infocomm tech (21/06/10) [ Embedded ]
• Intel provides update on floating-body R&D (21/06/10) [ Embedded ]

• GlobalFoundries CEO calls for concerted effort in EDA (21/06/10) [ EDA/IP ]
• Cypress adds BITS-Pilani Hyderabad to PSoC lab network (21/06/10) [ EDA/IP ]
• Ultrasmall FEM for GPRS handsets cuts time-to-market (21/06/10) [ RF/Microwave ]
• DC/DC converter allows programming via single resistor (21/06/10) [ Power/Alternative Energy ]
• Serdes chipset improves driver safety (21/06/10) [ Interface ]

• Atom-based SBC packs 64GB SSD storage (21/06/10) [ Embedded ]
• 512GB SSD uses toggle-mode DDR NAND (21/06/10) [ Memory/Storage ]
• ZigBee modules offer SMT, SPI (21/06/10) [ RF/Microwave ]
• Engineering employability gap: Academia speaks out (21/06/10) [ EDA/IP ]