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ARM, Cadence tape out 14nm FinFET test chip

Posted: 24 Dec 2012  Print Version  Bookmark and Share

Keywords:14nm  Cortex-A7  RTL-to-signoff  FinFET 

ARM and Cadence Design Systems have announced the tape-out of the first 14nm test chip implementation of ARM Cortex-A7 processor.

Designed with a complete Cadence RTL-to-signoff flow, the energy-efficient chip is the first to target Samsung's 14nm FinFET process, "accelerating the continuing move to high-density, high-performance and ultra-low power SoCs for future smartphones, tablets and all other advanced mobile devices," the company said.

In addition to the ARM Cortex-A7 processor, the test chip includes ARM Artisan standard-cell libraries, next-generation memories, and general purpose IOs.

"This is an important milestone in our efforts to enable our silicon partners for continued low-power leadership in future generations of innovative, energy-efficient mobile products," said Dipesh Patel, vice president and general manager, Physical IP division, ARM. "Taping out ARM's most energy-efficient applications processor on Samsung's advanced low-power manufacturing process was achieved through the combination of leading-edge technology and R&D excellence, as well as a deep and early collaboration with Samsung and Cadence."

"Cadence's advanced node design flow, coupled with our collaboration with ARM and Samsung, is essential to semiconductor companies as they move to designing for a 14nm FinFET process," said Chi-Ping Hsu, senior vice president, research and development, Silicon Realisation Group, Cadence.





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