News & Trends (Sorted By Date)
- TSMC forays into LED lighting with R&D centre fab (01/04/10)
- Gartner rolls out 2009 chip vendor ranking (01/04/10)
- Smaller automotive suppliers grow biz in downturn (01/04/10)
- Bosch opens wafer fab at a cost of Rs.3,900 crore (31/03/10)
- Light capable of twisting nanoparticle ribbons (31/03/10)
- China transformer suppliers explore more options (30/03/10)
- Panasonic gears Li-ion battery factory for April production (30/03/10)
- Vendors to revive stalled NAND projects (30/03/10)
- Ultra low-power spintronics suits non-volatile circuitry (30/03/10)
- Price hikes, shortages dog IC market (29/03/10)
- China Sunergy in expansion mode (26/03/10)
- What ails analogue vendors? (26/03/10)
- Industrial/medical electronics to grow by 11% in 2010 (25/03/10)
- Was EUV the wrong bet for the industry? (25/03/10)
- Novellus, IBM partner on 3D TSV (24/03/10)
- Is fab tool biz slowing down? (24/03/10)
- IC forecasts: 10 reasons to cheer or fear (24/03/10)
- Ascent Solar, Kirloskar form alliance on PV modules (24/03/10)
- Flextronics aim for 1GW solar module in Malaysia (23/03/10)
- Analyst: ASML, Nikon to share 22nm litho biz (23/03/10)
- BEE, HSBC partner on energy efficiency finance (23/03/10)
- AUO submits app for G7.5 LCD fab in China (22/03/10)
- Microchannels to cool down 3D IC architecture (19/03/10)
- Si nanocomposites better Li-ion battery performance (19/03/10)
- Speciality foundries spread their wings (18/03/10)
- Canon keeps mum on litho nanoimprint (18/03/10)
- FormFactor opens wafer probe card facility (17/03/10)
- Tessera, UTAC sign tech agreement settling lawsuit (17/03/10)
- National's new CEO wants revenue growth (16/03/10)
- Graphene enables cheaper, thinner OLEDs (15/03/10)
- Alchimer opens 3D TSV tech facility in South Korea (15/03/10)
- Moser Baer's PV modules achieve 7.3% efficiency (15/03/10)
- IMEC, Synopsys to research on 3D stacked ICs (12/03/10)
- Yingli expands in Baoding to give 1GW by year end (12/03/10)
- E-beam direct-write litho to be here only by 2015 (12/03/10)
- Fuel-coated carbon nanotubes act as fuses (12/03/10)
- Rumours: Gate-last tech for Samsung in 22nm (12/03/10)
- NXP's fab-lite movement gathers momentum (10/03/10)
- ASML, Nikon lock horns on Intel 22nm litho biz (10/03/10)
- Kingdee opens hub in Singapore (09/03/10)
- Earthquake disrupts Taiwan LCD plants, foundries (09/03/10)
- Altera outlines challenges for IC industry (08/03/10)
- Will Samsung lead the pack in foundry biz? (08/03/10)
- Wipro brings eco-friendly desktops (08/03/10)
- TowerJazz to spur IC design for Korea academia (05/03/10)
- ICs back on the path of growth (05/03/10)
- Nanoimprint for HDDs still under wraps (04/03/10)
- NXP ponders on converting wafer fab to solar facility (04/03/10)
- Delays, double-patterning dominates SPIE Litho (03/03/10)
- Solar market competition set to intensify (02/03/10)
Resources
Android faces hurdles in low-cost arena
Android 4.0's step-up in memory and processor demands will make it less attractive in the low-cost smartphone market...
Showcasing the Rs.1,121.08 computer
A UK-based foundation claims the Raspberry Pi, a Rs.1,121.08 ($25) computer board...
Mobile processors boom
Strong growth of mobile devices up until 2016 will drive an exponential growth for mobile processors...
Google, Samsung team on Android 4.0
Samsung's Galaxy Nexus is the first smartphone launched with Google latest Android 4.0 OS...
Intel withdraws Smart TV chip business
Intel reveals plans to withdraw its Smart TV chip business.
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