ESC-India (July 21-23, 2010) will focus on the issues faced in the embedded software and hardware domain, showcase new technologies and provide answers to design challenges. You will find all exhibitor news and coverage from the show floor on this page.
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STMicro: MEMS drive new apps (27/10/10)
At the ESC-2010, STMicro's Vivek Sharma chatted with EE Times India's Vivek Nanda on his company's focus on MEMS and the healthcare sector.
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Kumaran: We still carry Wind River red (24/09/10)
Venkatesh Kumaran, country manager-India, Wind River Systems talks about Wind River's product strategies and market focus after the completion of one year with Intel and the Indian design market, among other things.
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India Design Houses: How to move up the value chain? (11/08/10)
At the recently held ESC-India 2010, Bangalore, experts from the industry came together on a panel discussion to discuss whether Indian design houses were ready to move up the value chain.
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TI adopts new packaging tech for 45nm devices (09/07/10)
Texas Instruments is adopting an emerging technology called fine-pitch copper pillar flip-chip for packaging devices at the 45nm/40nm nodes and below.
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ADCs offer 200MS/s, 65MHz bandwidth (08/07/10)
Texas Instruments' 11bit, 200MS/s ADC family delivers enhanced in-band SNR for multi-carrier and multi-mode communications systems requiring up to 65MHz bandwidth.
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Three-axis accelerometer consumes as low as 2µA (06/07/10)
STMicroelectronics introduces a three axis accelerometer with low power consumption, miniature footprint and enhanced functionality.
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Intel acquires Comsys to foray into handset chip biz (05/07/10)
Intel Corp. has bagged Comsys Mobile Communication and Signal Processing Ltd for Rs.138.53 crore ($30 million) in late May to foray into the cell phone chip business.
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1.6V comparator tailored for portable apps (05/07/10)
STMicroelectronics adds an ultra-low-power comparator, the TS331, that draws only 20a and operates from a supply voltage as low as 1.6V suitable to increase performance and functionality in portable applications.
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IBM "fab club" synchronises 28nm process (28/06/10)
IBM, Samsung, GlobalFoundries and ST are synchronising their IC manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance.
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IBM to produce Infineon secure ICs for e-passports (25/06/10)
Infineon Technologies AG has tapped IBM Corp. to manufacture its highly secure ICs for secure identification applications, including electronic passports.
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Panel pushes intelligent devices for smart grid (25/06/10)
A technology panel sees the smart grid beyond the distribution system and smart meters to include devices that drawing the power. That could spell new business opportunities for appliance manufactures.
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Xilinx 28nm FPGAs pack two million logic cells (23/06/10)
Xilinx has announced its 28nm series 7 FPGAS that will offer 50 per cent power reduction compared to the company's 40nm devices and up capacity to two million logic cells.
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Intel provides update on floating-body R&D (21/06/10)
For years, FBC has been touted as an alternative to conventional cache memory and Intel Corp. has revealed details of its ongoing research on floating-body cells for advanced cache designs in microprocessors at the 2010 Symposium on VLSI Circuits.
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Dassault, IBM extend their alliance to PLM cloud computing (18/06/10)
Dassault Systèmes and IBM have extended their product lifecycle management (PLM) alliance to include a joint competency centre, and work on a PLM cloud computing proof of concept.
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ST contemplates 300mm analogue facility (18/06/10)
STMicroelectronics CEO Carlo Bozotti revealed that they are pondering over making 300m wafers analogue ICs at its Crolles-2 wafer fab.
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Intel readies MIC architecture for high-end computing (17/06/10)
Intel readies Many Integrated Core (MIC) architecture for high-end computing which will help accelerate highly parallel applications and the first MIC chip out the chute will be Knight's Corner, a 50-core chip designed in a 22nm process,
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Wireless sensors rev up on energy harvester (17/06/10)
STMicroelectronics NV and Micropelt GmbH have jointly developed an autonomous wireless sensor evaluation kit where power management and charge monitoring circuitry connect to the included GUI software via a 2.4GHz wireless link.
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Virtex-6, Spartan-6 ref designs meet PCI-SIG standard (17/06/10)
Xilinx continues its momentum for PCIe support by achieving PCI-SIG compliance and interoperability testing for PCIe 1.1 single-lane configuration for its Spartan-6 and Virtex-6 FPGA connectivity targeted reference design.
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CANalyzer packs diagnostic console with editor (17/06/10)
Vector Informatik has rolled out a CANalyzer with basic diagnostics and control panels that offers additional ways to stimulate and analyse CAN, LIN, MOST and FlexRay networks or Electronic Control Units (ECUs).
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IBM 'fab club' delivers 32-/28nm process based on high-k (16/06/10)
IBM Corp. "fab club," has announced the delivery of 32-/28nm process and design platform, based on high-k and metal gates.
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Embedded transceivers target 868-, 915-, 950MHz networks (16/06/10)
Microchip debuts an embedded Wi-Fi transceiver module and an ultra low-power transceiver module for 868-, 915- and 950MHz networks that focusses on ease of use and a new TCP/IP stack, version 5.25.
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