News & Trends (Sorted By Date)
- IBM designs India's largest data centre (09/02/12) [ Networks ]
- Nokia to shift phone assembly to Asia (09/02/12) [ Manufacturing/Packaging ]
- CPU-GPU collaboration boost performance by 20% (09/02/12) [ Processors/DSPs ]
- Wearable wireless sensors show 110% growth (09/02/12) [ RF/Microwave ]
- Pengutronix to demoµClinux for Cortex-M3 (08/02/12) [ Embedded ]
- 'Solve for X'; courtesy Google (08/02/12) [ Power/Alternative Energy ]
- Inside Secure selected by major smartphone firm (08/02/12) [ Embedded ]
- India wafer fab plans in the works (08/02/12) [ Manufacturing/Packaging ]
-
Panel: Collaboration on mixed-signal designs (08/02/12)
[ EDA/IP ]
- Rambus buys Unity Semiconductor (07/02/12) [ Memory/Storage ]
- Cadence, Samsung collaborate on DFM solution (07/02/12) [ Manufacturing/Packaging ]
-
Optical fibres with embedded electronics built (07/02/12)
[ Embedded ]
- ELCINA to set-up electronics cluster in India (07/02/12) [ Manufacturing/Packaging ]
- Tablet penetration booms in emerging markets (07/02/12) [ Optoelectronics/Displays ]
- AMD's roadmap reveals tablet plans, new products (06/02/12) [ Processors/DSPs ]
-
Anyone can produce electricity using grass (06/02/12)
[ Power/Alternative Energy ]
-
MIT: Photonic crystals to power smartphones (06/02/12)
[ Power/Alternative Energy ]
- Toshiba, Movidius to make 3D smartphone camera (06/02/12) [ Manufacturing/Packaging ]
- Indian mobile market shows 14.1% growth in 2011 (06/02/12) [ Manufacturing/Packaging ]
- Qualcomm, Ericsson showcase LTE-to-3G handover (06/02/12) [ RF/Microwave ]
- Highways to wirelessly charge electric cars? (03/02/12) [ RF/Microwave ]
- Samsung, Corning form OLED glass entity (03/02/12) [ Manufacturing/Packaging ]
-
NFC, wireless charging coming to Nokia phones (03/02/12)
[ RF/Microwave ]
- Sony names new CEO (03/02/12) [ EDA/IP ]
-
Global spending on LTE ramps up (03/02/12)
[ RF/Microwave ]
- Silicon photonics: The solution to crosstalk? (03/02/12) [ EDA/IP ]
- Tellabs plans restructuring, to shut India unit (02/02/12) [ Networks ]
- Telit opts Calixto as India competence centre (02/02/12) [ RF/Microwave ]
- Microsemi buys timing IC business from Maxim (02/02/12) [ Amplifiers/Converters ]
- Qualcomm gains E-reader share with Mirasol tech (02/02/12) [ Optoelectronics/Displays ]
-
AMOLED TV adoption stalled by high costs (02/02/12)
[ Optoelectronics/Displays ]
- Sensors to control spacecraft soon (01/02/12) [ Embedded ]
- IBM buys mobile software firm Worklight (01/02/12) [ Embedded ]
- MicroOLED debuts 5.4 megapixels OLED microdisplay (01/02/12) [ Optoelectronics/Displays ]
- Semiconductor to see sluggish growth in 2012 (01/02/12) [ Manufacturing/Packaging ]
- Apple becomes No.1 PC seller (01/02/12) [ Manufacturing/Packaging ]
-
EV battery to reach Rs.2.40 lakh crore in 2020 (31/01/12)
[ Power/Alternative Energy ]
- Holst, imec embark on joint OLED research (31/01/12) [ Optoelectronics/Displays ]
- Avago, TI showcase 100GE solutions (31/01/12) [ Interface ]
- Disposable Si photonics biosensor ICs developed (31/01/12) [ Manufacturing/Packaging ]
- Neul pushes for M2M radio innovation (31/01/12) [ RF/Microwave ]
- Smartphones to set wireless handset trends (30/01/12) [ RF/Microwave ]
- Music powers implantable MEMS pressure sensor (30/01/12) [ Power/Alternative Energy ]
- 2012 India IT spending seen to grow 10% (30/01/12) [ Manufacturing/Packaging ]
- Nvidia connecting GPU enthusiasts in India (30/01/12) [ Processors/DSPs ]
- Printed electronics primed for pilot production (30/01/12) [ Manufacturing/Packaging ]
- Apple biggest chip buyer in 2011 (27/01/12) [ Manufacturing/Packaging ]
- Stacked graphene sheets can insulate (27/01/12) [ Manufacturing/Packaging ]
- Wi-Fi sees upsurge in home video devices (27/01/12) [ RF/Microwave ]
- Intel, Samsung boost semiconductor capex (27/01/12) [ EDA/IP ]
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