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| 2011-05-09 | Intel debuts 22nm 3D transistor Intel debuts 22nm 3D transistor |
| 2010-11-02 | Intel to split 22nm litho buy between Nikon, ASML Holding Intel to split 22nm litho buy between Nikon, ASML Holding |
| 2010-06-14 | EUV litho for 22nm unlikely to take-off EUV litho for 22nm unlikely to take-off |
| 2010-04-15 | TSMC moves from 28nm to 20nm half-node TSMC moves from 28nm to 20nm half-node |
| 2010-04-12 | IBM: Expect design rule explosion beyond 22nm IBM: Expect design rule explosion beyond 22nm |
| 2009-12-08 | ASML, ST speed sub-30nm development The silicon printing optimisation with lithography control and integrated design (SOLID) project seeks sub-30nm node solutions. |
| 2009-07-16 | Soitec, IBM push 22nm for 3D ICs Soitec, IBM push 22nm for 3D ICs |
| 2009-07-09 | Partnership pushes nanoimprint litho Dai Nippon Printing and Molecular Imprints aim to develop mask replication tech for the 22nm half-pitch node. |
| 2009-06-18 | GlobalFoundries reports high-k tech for 22nm GlobalFoundries reports high-k tech for 22nm |
| 2009-05-27 | T-RAM, Globalfoundries team up for Thyristor-RAM The partnership is targeted towards the application of T-RAM's Thyristor-RAM embedded memory to advanced technology nodes. |
| 2009-02-26 | AMD, IBM move forward with EUV despite tool delay AMD, IBM and others are pushing their efforts in EUV, developing a 22nm "test chip," with plans to do the same at the 15nm node. |
| 2008-12-19 | IEDM: IC scaling to slow down IEDM panelists warned Moore's Law could slow down after the 22nm node as device physics is nearing the wall. |
| 2007-06-25 | Intel plans inverse litho due to EUV delay With the possible delay of its extreme ultraviolet lithography, Intel disclosed that it is developing a DFM technology that could extend optical scanners to the 22nm node. |
| 2007-05-10 | TSMC, UMC, 3rd partner bag TI 45nm chips Under its fab scheme, TI has decided to stop internal development at the 45nm node and use foundry supplied processes at 32nm, 22nm and thereafter. |
| 2007-02-27 | IBM extends immersion lithography to 22nm IBM extends immersion lithography to 22nm |
| 2007-01-29 | TI exits digital logic process race Texas Instruments Inc. (TI) has decided to drop the costly business of digital logic process development and rely on foundry partners for its processes. According to reports, TI development has decided to stop internal development at the 45nm node and use foundry supplied processes at 32nm, 22nm and thereafter. |
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