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| 2012-01-17 | 3D LSI circuits produced at room temperature Mitsubishi Heavy Industries' Bond Meister MWB-12-ST fully automated 300mm wafer bonding machine can manufacture 3D integrated LSI circuits at room temperature. |
| 2011-12-29 | Rapid acoustic inspection for 300MM wafer generation Rapid acoustic inspection for 300MM wafer generation |
| 2011-04-12 | GSA: Wafer prices up in 4Q 2010 GSA: Wafer prices up in 4Q 2010 |
| 2011-02-23 | Intel invests in new 300mm fab Intel invests in new 300mm fab |
| 2010-11-18 | Intel's Israel fab expansion runs into a hurdle Intel's expansion plans for it wafer fab in Kiryat Gat runs into a hurdle as the Israeli government is not incline to meet Intel's demand of a government subsidy of Rs.1,786.81 crore ($400 million). |
| 2010-09-02 | Micron deploys Applied sol'n to up efficiency Micron expects Applied Materials E3 to improve efficiency, product quality at 300mm wafer facilities |
| 2010-06-18 | ST contemplates 300mm analogue facility ST contemplates 300mm analogue facility |
| 2010-05-03 | TI to expand Richardson analogue fab Texas Instruments Inc. is expanding its 300mm analogue fab in Richardson amid an upturn in the market. |
| 2010-03-15 | Alchimer opens 3D TSV tech facility in South Korea Alchimer S.A. has opened a new applications and development facility in Seoul, South Korea, for demonstration of its 3D TSV processes on 300mm wafers. |
| 2009-05-15 | Duo to develop tech for CMOS image sensors ST and Soitec have announced an agreement that will lead to the development of 300mm wafer-level BSI technology. |
| 2009-04-20 | Analyst: 450mm will be a disaster Chip gear vendors were the losers in the transition to 300mm and would likely not benefit from the next move to larger wafers. |
| 2008-09-04 | SIA: 300mm wafers start dominating capacity SIA: 300mm wafers start dominating capacity |
| 2008-06-18 | Toshiba plans to cease NAND production Toshiba plans to cease NAND production at FlashVision Ltd and will instead focus on its 300mm fabs. |
| 2008-05-19 | SEMI sees minor growth in wafer shipments SEMI sees minor growth in wafer shipments |
| 2008-01-31 | SMIC, Shenzhen govt to set up 200mm, 300mm fabs SMIC, Shenzhen govt to set up 200mm, 300mm fabs |
| 2008-01-30 | Chartered secures loan to support 300mm fab Chartered secures loan to support 300mm fab |
| 2008-01-14 | Cascade launches 300mm wafer probe stations Cascade launches 300mm wafer probe stations |
| 2007-12-28 | SMIC licenses IBM's 45nm bulk CMOS tech SMIC has licensed IBM's 45nm bulk CMOS tech that will be used for SMIC's 300mm wafer foundry service, fabricating devices in mobile, graphics and consumer apps. |
| 2007-10-26 | AMD attempts to delay 450mm fab transition While Intel is attempting to push the industry towards 450mm fabs in the 2012 time frame or beyond, AMD wants to delay the 450mm fab transition. |
| 2007-10-15 | Survey: Wafer shipments to show robust growth till 2010 Survey: Wafer shipments to show robust growth till 2010 |
| 2007-08-09 | SanDisk, Hynix to build 300mm fab for NAND SanDisk, Hynix to build 300mm fab for NAND |
| 2007-06-06 | TSMC negotiates for 200mm Hynix fab TSMC is under discussion with Hynix Semiconductor to purchase a 200mm wafer fab with a capacity of 129,000 wafers per moth for almost Rs.4226.98 crore ($1 billion). |
| 2007-04-12 | Fujitsu's new 300mm fab starts operation Fujitsu's new 300mm fab starts operation |
| 2007-03-28 | SMIC searching for private equity partners, says report Semiconductor Manufacturing International Corp. is on the hunt for a strategic investor willing to ante up as much as Rs.2,206 crore for a 20 per cent stake. |
| 2007-03-27 | Intel to build 300mm wafer fab in China Intel to build 300mm wafer fab in China |
| 2007-02-06 | SMIC considers spinning off 300mm wafer operations in Beijing SMIC considers spinning off 300mm wafer operations in Beijing |
| 2007-01-23 | Singapore JV to begin 300mm wafer Singapore JV to begin 300mm wafer |
| 2007-01-10 | UMC to open Taiwan 300mm fab in '08 UMC to open Taiwan 300mm fab in '08 |
| 2006-11-10 | Intel's new fab to create jobs for Japanese companies Several Japanese semiconductor manufacturing equipment companies are already supplying services for Intel's 300mm Fab 28 wafer fab in Kiryat Gat, Israel. The new fab is expected to create 500 jobs in Israel for those companies. |
| 2006-11-09 | TSMC to invest $1.1B in 90-, 65nm Taiwan Semiconductor Manufacturing Co. approved a plan to spend $1.1 billion to expand 65- and 90nm process capacity at its 300mm wafer fabs. |
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