What is a 3D memristor?
| Memristor is touted to be the fourth fundamental circuit element in electrical engineering. In November 2008, HP Labs unveiled what it claims to be the first 3D memristor chip, which had memristor crossbar memory cells stacked on top of a CMOS logic chip. (Souce: EE Times Asia) |
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| 2012-05-23 | GPS-MEMS combo to enhance next-gen positioning and navigation Know the next exciting stage in GPS evolution that solves the problems of non-availability of GPS location information. |
| 2012-05-15 | Fundamentals of 3D authoring (Part 2 Fundamentals of 3D authoring (Part 2 |
| 2012-05-07 | Employ modelling for power integrity simulation in 3D-IC design Employ modelling for power integrity simulation in 3D-IC design |
| 2012-05-03 | Xilinx launches Vivado Design Suite Vivado is a new IP and system-centric design tool that can accelerate programmable systems integration and implementation by up to 4X. |
| 2012-04-30 | GlobalFoundries announces 3D chip stacking at 20nm GlobalFoundries announces 3D chip stacking at 20nm |
| 2012-04-26 | Intel debuts 22nm quad-core processors Intel debuts the first processors developed on 22nm manufacturing process using innovative 3D tri-gate transistor technology and a new graphics architecture |
| 2012-05-08 | Vishay's IR receivers designed for universal 3D TV glasses Vishay's IR receivers designed for universal 3D TV glasses |
| 2012-04-11 | Fundamentals of 3D authoring (Part 1 Fundamentals of 3D authoring (Part 1 |
| 2012-04-09 | Flat panel TV makers prepare for sales dip Shipments of flat panel TVs, such as LCD TVs, plasma TVs and rear-projection TVs peaked last year, but are forecasted to weaken for the next three years until at least 2015. |
| 2012-03-30 | 3D IC test vehicle ensures performance, yield 3D IC test vehicle ensures performance, yield |
| 2012-03-29 | Transparent 3D memory chips to replace flash drives Transparent 3D memory chips to replace flash drives |
| 2012-03-28 | 3D solar panels can generate 20x more power: MIT 3D solar panels can generate 20x more power: MIT |
| 2012-03-26 | A 3D camera that sees "around corners A 3D camera that sees "around corners |
| 2012-03-26 | 3D printing, printed electronics merged 3D printing, printed electronics merged |
| 2012-03-23 | Altera, TSMC develop 3D IC test vehicle Altera, TSMC develop 3D IC test vehicle |
| 2012-03-20 | Hybrid CMOS image sensor sol'n ups resolution TowerJazz's TS11IS CMOS image sensor solution allows the development of higher resolution high-end sensors with smaller pixels and enhanced performance. |
| 2012-03-19 | Firms address silicon complexity challenges Cadence, TSMC and ARM executives stress on the need for stepping up collaborations to deal with silicon integration and complexity of technologies of semiconductor design. |
| 2012-03-09 | Applied Materials, IME open 3D chip packaging lab Applied Materials, IME open 3D chip packaging lab |
| 2012-03-02 | MIT designs 3D MEMS MIT designs 3D MEMS |
| 2012-02-24 | LED drivers optimise backlight TV control Atmel's MSL2164 and MSL2166 LED drivers claim to boost LCD TV picture quality by eliminating 3D ghosting and flickering effects. |
| 2012-02-06 | Toshiba, Movidius to make 3D smartphone camera Toshiba, Movidius to make 3D smartphone camera |
| 2012-02-02 | Tool eases verification of MEMS devices The CoventorWare 2012 software release increases 3D simulation capacity and accuracy to make the verification of complex integrated MEMS devices more efficient and more accurate. |
| 2012-02-09 | Is gesture recognition leading the way to 3D UIs Is gesture recognition leading the way to 3D UIs |
| 2012-01-25 | Smaller MEMS roll on CMOS line Baolab Microsystems is making available evaluation kits for its 3D 3-axis CMOS MEMS NanoCompass sensors which are produced within the standard metal structure of a high volume manufactured CMOS wafer. |
| 2012-01-17 | 3D LSI circuits produced at room temperature 3D LSI circuits produced at room temperature |
| 2012-01-12 | 28nm platforms to accelerate India's transformation India’s engineering talent and Xilinx’s 28nm technologies have the potential to accelerate the country’s transformation into a global R&D hub, says Xilinx CEO Moshe Gavrielov. |
| 2012-01-09 | Ref designs speed 3D, 4K2K display development Ref designs speed 3D, 4K2K display development |
| 2012-01-09 | Kinect concept coming to smartphones? MIT researchers develop a 3-D camera that provides more-accurate depth information than the Kinect. |
| 2012-01-06 | New optoelectronic LDPD speeds CMOS imaging The newly patented lateral drift field photodetector from the Fraunhofer IMS accelerates image processing for astronomy, spectroscopy, X-ray photography and 3D imaging. |
| 2011-12-29 | Now, 3D without glasses Now, 3D without glasses |
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