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| 2011-10-10 | PCB layout of DAC348x in mr-QFN package PCB layout of DAC348x in mr-QFN package |
| 2010-11-22 | 72Mbit SRAM delivers speeds of 550MHz GSI Technology Inc. rolls out its 72Mbit product line, the GS8662 family, which includes Type II and Type II+ SigmaQuad interfaces that delivers speeds of up to 550MHz in a 165-bump, 13x15mm BGA package. |
| 2010-04-13 | 32bit MCU in 6mm x 6mm BGA packs 91 I/O pins 32bit MCU in 6mm x 6mm BGA packs 91 I/O pins |
| 2009-07-09 | PCB layout for BGA packages PCB layout for BGA packages |
| 2009-04-16 | Spot solder joint faults in operating FPGAs Read about a tool for direct, in-situ measurement of prognostic indicators of faults in operating solder joint networks. |
| 2008-03-05 | Stellaris MCUs provides cost efficient entries Luminary Micro extends the capability and reach of the entire Stellaris family by announcing a small BGA package option with a space-saving footprint and an extended temperature option. |
| 2007-05-11 | Resistor net package eliminates parasitics Resistor net package eliminates parasitics |
| 2007-04-27 | Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package |
| 2007-03-16 | Advanced package-stacking fits more functions Advanced package-stacking fits more functions |
| 2007-02-16 | Frontier Silicon DVB-H receiver enables smaller mobile TVs Frontier Silicon's new DVB-H receiver is housed in a single-chip BGA package, enabling manufacturers to build DVB-H-enabled handsets and other products in a very small form factor. |
| 2005-08-25 | 10GHz socket from Ironwood requires little board space Ironwood introduced a new high-performance, epoxy-mount 10GHz bandwidth sockets that accommodate 0.75mm pitch, 7.286-by-10.85mm ICs, including the Intel StrataFlash memory VF BGA package with a 0.75mm pitch and 6 x 8 array. |
| 2000-11-30 | BGA (Ball Grid Array BGA (Ball Grid Array |
| 2001-01-01 | Developing a dam and fill process during BGA package assembly Developing a dam and fill process during BGA package assembly |
| 2001-05-11 | High-density design with MicroStar BGAs This application note describes a mounting technique that can increase a board's chip density while decreasing the routing complexity associated with fine-pitch BGA packages. |
| 2001-06-07 | Lead-free soldering for the attachment of µBGA packages Lead-free soldering for the attachment of µBGA packages |
| 2001-08-16 | The ramifications of component selection Need to know what is the most important electrical specification for a connector or IC package? This article looks at what is generally the hardest problem in component selection. |
| 2001-12-01 | TDR for characterization and modeling, Part 1 This article is the first of two parts. Here, the author discusses the time domain reflectometry modeling. This modeling technique allows designers to obtain both lumped as well as distributed SPICE and IBIS models for package interconnect that will correlate to the physical layout of the package. |
| 2002-06-20 | Automatic PD monitoring for after-laying test of long-distance 500kV XLPE cable line null |
| 2002-06-20 | Punching technique of TAB tape carrier for matrix via hole pattern This application note describes the use of a row division punching method to reduce the cost of manufacturing CSP of the BGA structure. |
| 2002-06-20 | TAB tape carrier with micro plating bumps for burn-in testing socket This application note describes the use of a new contact substrate for the burn-in testing socket for 0.5mm-pitch BGA package. |
| 2003-06-27 | Recommended design, Integration and Rework Guidelines for International Rectifier's iPOWIR BGA packages Recommended design, Integration and Rework Guidelines for International Rectifier's iPOWIR BGA packages |
| 2005-06-09 | MicroPak soldering information This app note presets a recommended solder land pattern for mounting the MicroPak package. |
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