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| 2012-02-09 | Optimising power electronics for HEV To achieve maximum power density, electric losses and thermal resistances must be kept to a minimum, and maximum component integration must be implemented. |
| 2009-08-27 | FPGAs tailored for wireless, wireline apps Lattice Semiconductor Corp. is sampling LatticeECP3(TM)-150 FPGA, the highest-density device in its high-value, low-power ECP3 mid-range FPGA family. |
| 2009-07-02 | Low-power FPGAs boast security features Altera Corp. has unveiled its new low-power Cyclone III LS FPGAs with security features. |
| 2009-03-26 | All-DSP dual 10GbE PHY devices move to 65nm All-DSP dual 10GbE PHY devices move to 65nm |
| 2008-02-01 | Car MCUs meet next-gen emission standards Infineon has launched what it claims is the industry's highest-performing MCU family for automotive powertrain and chassis apps that combines MCU functions with DSP and high-density flash memory. |
| 2006-12-11 | VLIW DSP targets high-density GSM VLIW DSP targets high-density GSM |
| 2006-06-23 | Vativ unveils three-input HDMI receiver for TV apps Vativ has announced the commercial availability of VTV2310, the latest addition to the company's family of HDMI receiver chips for digital TV applications. |
| 2005-06-15 | A novel approach for increasing voice channel density exploiting VLIW DSP A novel approach for increasing voice channel density exploiting VLIW DSP |
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