What is flip chip?
| A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry. |
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| 2011-05-30 | Prevent crack formation in flip-chips Learn about finite element analysis and how it is being used in the development and improvement of chip design. |
| 2011-05-23 | Design flip-chip packages with integrated USB 3.0 Design flip-chip packages with integrated USB 3.0 |
| 2011-04-20 | Flip-chip tech gains renewed interest Flip-chip tech gains renewed interest |
| 2010-07-09 | TI adopts new packaging tech for 45nm devices Texas Instruments is adopting an emerging technology called fine-pitch copper pillar flip-chip for packaging devices at the 45nm/40nm nodes and below. |
| 2010-04-09 | IPAD 500µm Flip Chip: package description and recommendations for use IPAD 500µm Flip Chip: package description and recommendations for use |
| 2009-07-14 | Intro to Flip-Chip CSP Intro to Flip-Chip CSP |
| 2008-07-04 | ST combines handset filtering and ESD protection The EMIF06-AUD01F2 from ST implements the complete EMI filtering and ESD protection in a flip-chip package |
| 2008-05-16 | Voltage divider works with high precision Vishay Intertechnology Inc. rolls an ultra-high-precision surface-mount flip-chip voltage divider. |
| 2008-04-30 | Inventor develops flip chip-assembly method Inventor develops flip chip-assembly method |
| 2007-11-06 | Flip-chip memory card transceiver targets handsets Flip-chip memory card transceiver targets handsets |
| 2007-10-18 | Program addresses novel IC packaging issues Two research centres have teamed up to establish an industrial affiliation program that targets novel packaging approaches designed to reduce the mechanical stress on the IC after packaging and assembly. |
| 2007-05-18 | Magma, Rio collaborate to enhance flip chip design Magma, Rio collaborate to enhance flip chip design |
| 2007-03-16 | Address SI issues in high-speed board design This article discusses some of the SI challenges and the factors associated with high-speed interface designs that are enabled with key features of a RapidIO switch. |
| 2007-01-02 | NCP encapsulant suits flip-chip image sensor apps NCP encapsulant suits flip-chip image sensor apps |
| 2006-08-01 | AC process cuts cycle time in Pb-free flip-chip assembly AC process cuts cycle time in Pb-free flip-chip assembly |
| 2006-02-14 | FlipChip starts constructing bumping facility FlipChip International LLC has announced that it started construction of an advanced bumping facility for a joint venture in China with Millennium Microtech (Shanghai) Co. Ltd. |
| 2006-01-25 | Amkor packaging aids wirebond-to-flip chip transition Amkor packaging aids wirebond-to-flip chip transition |
| 2005-09-21 | IDT offers network engines in RoHS-compliant flip-chip packaging IDT offers network engines in RoHS-compliant flip-chip packaging |
| 2005-08-16 | Water-filled wafers streamline chip cooling Researchers develop a chip-cooling process that hopes to replace bulky, bolt-on metal towers used in microprocessors. |
| 2005-09-02 | Singapore packager to expand flip-chip capacity Singapore packager to expand flip-chip capacity |
| 2005-09-23 | Synopsys unveils its latest floorplanning, analysis solution Synopsys extended its floorplanning solution with the introduction of JupiterIO—an enabling technology for concurrent die and package floorplanning and analysis that targets flip chip design flows. |
| 2005-09-29 | IDT's flip-chip packaged monolithic NSEs now RoHS-compliant IDT's flip-chip packaged monolithic NSEs now RoHS-compliant |
| 2005-11-01 | Die, package design get closer Targeting designs headed for flip-chip packages, Synopsys' floor-planning and analysis tool enables concurrent die and package design flows. |
| 2001-01-01 | Contract manufacturing and flip-chip interconnect design Contract manufacturing and flip-chip interconnect design |
| 2001-02-01 | Testing dimensional limits of high I/O flip-chip design Testing dimensional limits of high I/O flip-chip design |
| 2001-04-01 | Back-end copper metallization for flip chip Back-end copper metallization for flip chip |
| 2001-04-15 | SERA tin evaluation for surface finish Technical, economic, and environmental factors are providing the impetus to find hot air solder level (HASL) alternatives for solder finishes. SERA tin evaluation provides insights into the performance of these finishes. |
| 2001-04-15 | Solder flux jetting technology Advances in jetting technology improve film thicknesses and provide excellent edge definition in selective flux applications. |
| 2001-04-19 | Epoxy die attachment for GaAs flip-chip devices Epoxy die attachment for GaAs flip-chip devices |
| 2001-05-01 | Cleaning up the flip-chip production act Cleaning up the flip-chip production act |
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