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| 2011-05-24 | Metrology solution targets advanced packaging apps Rudolf reveals the Wafer Scanner 3880 System, a comprehensive inspection and measurement solution targeting bump, RDL and TSV nail processes in advanced packaging applications. |
| 2011-04-28 | PCB, IC packaging tech offers advanced co-design PCB, IC packaging tech offers advanced co-design |
| 2010-08-12 | Examining packaging options for RF power ICs More robust packaging technology has helped RF power IC makers support the higher frequencies and bandwidths today's designers require. |
| 2010-06-25 | Chengdu takes on hi-tech challenges Chengdu City is fast becoming the next major biotechnology, chip, LED and renewable energy hub in China, making enormous strides to find its niche in IT and software. |
| 2010-06-25 | EC funds green cloud services The EuroCloud project, funded by the European Commission for an initial three years, aims to validate constructing data centre platforms using of low-power processing and 3D chip packaging. |
| 2010-06-04 | Intel to boost Chengdu facility headcount Intel Corp. plans to add 500 headcount at its IC-packaging facility in Chengdu to reach a total staff strength of 3,000. |
| 2009-10-23 | TI exec calls to address IC packaging challenges TI exec calls to address IC packaging challenges |
| 2009-07-21 | EVG, Applied partner on 3D wafer bonding EV Group (EVG) and Applied Materials Inc. are collaborating to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications. |
| 2009-06-08 | Cadence claims leadership in analogue/mixed signal Cadence CEO: We want to become even stronger and make our product even more stable. |
| 2009-02-16 | IC packaging houses see red ink IC packaging houses see red ink |
| 2009-01-22 | ChipMOS issues termination notice to Spansion Spansion currently has an outstanding account receivable with ChipMOS of approximately Rs.285.21 crore ($57 million). |
| 2008-08-22 | IC packaging industry to grow further IC packaging industry to grow further |
| 2008-07-04 | Nvidia blames TSMC for bad chip problem Nvidia plans to take a charge to cover costs from weak packaging material in select devices. |
| 2008-05-13 | ASE closes ASE Test buyout soon ASE expects to complete its acquisition of ASE Test by May 30. |
| 2008-04-30 | TSMC pushes OIP for more of IC pie TSMC causes a stir with a new strategy aimed at getting more market share. |
| 2007-11-12 | Common Platform ups IC packaging investment Common Platform ups IC packaging investment |
| 2007-10-18 | Program addresses novel IC packaging issues Program addresses novel IC packaging issues |
| 2007-10-11 | Thermal tech addresses power mgmt issues in IC packaging Thermal tech addresses power mgmt issues in IC packaging |
| 2007-07-20 | Intel, AMD explore aspects for industry's survival Intel and AMD explored contrasting aspects needed to survive in the semiconductor industry with the former emphasising on innovation for tomorrow while latter calling for cooperation to maximise efficiency. |
| 2007-04-19 | Equity firm drops ASE acquisition plans Investor consortium refuses to acquire Taiwan's Advanced Semiconductor Engineering Inc. |
| 2006-10-19 | Amkor begins operations in wafer bump facility in Singapore Amkor Technology has begun operations of its 300mm wafer bump factory in Singapore this month. |
| 2000-12-11 | Storage and handling of Drypacked surface mounted devices (SMD) This application note provides ON Semiconductor customers with the necessary storage and handling guidelines to preclude component package cracking during solder reflow procedures. |
| 2000-12-13 | Mounting considerations for power semiconductors This application note discusses the general terms in mounting procedures for several generic classes of packages including stud mount, flange mount, pressfit, plastic body mount tab mount and surface mount types. |
| 2001-06-08 | 3D design tools for package flexibility With IC packaging continue to grow in functionality and complexity, a new generation of 3D design tools are needed to speed up the design and development process. |
| 2001-08-16 | Conductive elastomers deliver sockets for GHz CSPs The author discusses the conductive elastomer technology as applied to sockets, detailing tests for electrical and mechanical characterization. |
| 2002-11-18 | VRM: Using a virtual sample to diagnose defects This technical article details how an advanced acoustic technique makes it possible to create a "virtual package" that preserves the full 3D detail of an IC package as a matrix file. |
| 2003-10-03 | Surface Mount Assembly and Handling of ANADIGICS LPCC Packages This application note outlines the steps necessary for the handling and assembly of ANADIGICS power amplifiers in LPCC packages. |
| 2003-10-03 | Tape and Reel Specifications This application note describes the tape and reel packaging specifications of ANADIGICS |
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