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EE Times-India > Advanced Search > Microsoft Windows Embedded CE 6.0 R3

Microsoft Windows Embedded CE 6.0 R3 Search results

 
 
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2010-08-30 BSPs extend support to application processors, MPUs
TI offers free Microsoft Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x application processors, Sitara ARM9 microprocessor units (MPUs) and associated evaluation modules (EVMs).
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