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2010-11-18	Thermal protection device targets automotive electronics Tyco Electronics rolls out a surface-mount reflowable thermal protection (RTP) device that fulfils the most stringent AECQ-based specification requirements for automotive electronics protecting against thermal events damage.
2010-01-25	Intel, Carnegie Mellon work on chip packaging They have devised an RF heating technique for solder magnetic nanoparticle (MNP) composites that can sufficiently heat solders to cause reflow without placing computer chips in conventional ovens.
2009-09-24	Reflow and PCB assembly effects on Intersil FGA references Reflow and PCB assembly effects on Intersil FGA references
2009-07-16	Solder reflow for SMT packages Solder reflow for SMT packages
2009-06-11	Wave solder in SMT packages Read about the impact of wave soldering and wave solder simulation methods.
2009-06-01	Solder reflow attach method for RF devices Solder reflow attach method for RF devices
2009-03-23	Key info from the MSL Lab Here are the key insights into the behaviour of plastic encapsulated microcircuits during assembly.
2009-02-25	A walk-through of the reflow process A walk-through of the reflow process
2009-02-16	Reflow soldering of Pb-free packages Reflow soldering of Pb-free packages
2009-02-10	Solder, mount LGA sensor to PCB Here's a guideline for effectively soldering and mounting MEMS based sensors which are sensitive to PCB reflow process.
2009-01-13	Tantalum capacitors feature low profile package The PulseCap devices are RoHS compatible and capable of withstanding a soldering profile of 3x reflow at 260°C.
2008-09-24	Tessera expands biz to camera lenses Tessera's new Product Launch Services will provide early access to its OptiML wafer-level camera technology.
2008-09-01	Standard sets Pb, Pb-free moisture sensitivity criteria The new IPC/JEDEC J-STD-020D revised standard should make life simpler for component manufacturers, who use the soak and accelerated soak specs to make sure that a component adheres to a given moisture sensitivity level, and for board assemblers, who use the levels to avoid damage to the components.
2007-05-22	MEMS microphone features high heat resistance Matsushita has developed a slim MEMS microphone featuring a high heat resistance of 260°C, which is required by Pb-free automatic reflow solder for PCB surface mounting.
2007-03-12	FCI headers target PiP soldering processes FCI's Minitek 2mm headers are specifically designed for Pin-in-Paste (PiP) soldering processes, which allow through-mount components to be soldered using conventional reflow soldering processes. It can also eliminate a separate wave soldering operation.
2006-04-05	SMD LEDs serve as easy replacements for TLM LEDs Vishay Intertechnology Inc.'s high-intensity SMD LEDs are capable of undergoing Pb-free reflow soldering and can serve as direct replacements for devices in Vishay's TLM series.
2005-12-22	ERNI expands 2mm HM connector line Erni has expanded its ERmet family of 2mm HM connectors to include through-hole reflow versions of the type C connectors.
2001-06-04	Reflow soldering conditions for VCO and synthesizer products Reflow soldering conditions for VCO and synthesizer products
2000-12-11	Storage and handling of Drypacked surface mounted devices (SMD) This application note provides ON Semiconductor customers with the necessary storage and handling guidelines to preclude component package cracking during solder reflow procedures.
2001-05-01	Cleaning up the flip-chip production act Experiments carried out at Dexter Electronic Materials show that cleaning is beneficial even with no-clean flux and that compatibility of materials and cleaning agents is important.
2001-06-14	Surface mount soldering considerations This application note provides several guidelines to proper surface mount soldering techniques to achieve high reliability.
2001-07-16	Reworking CSPs, µBGAs and flip-chips Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.
2001-09-16	Speed up laser diode attachment with epoxy This technical article describes some of the techniques customers have to consider when attaching laser diodes, whether it be through the use of epoxy or gold/tin alloy.
2002-05-06	Using convection ovens for attaching Z-COMM VCOs This application note describes the suggested time-temperature reflow profile for properly attaching of Z-COMM VCOs to PCBs utilizing convection oven techniques.
2002-10-09	Switches and attenuators metal package mounting This application note describes the process of microstrip mounting for flat packs.
2002-10-24	PCB land pattern design and surface mount guidelines for leadless packages This application note describes the land pattern design and surface-mount guidelines for leadless packages.
2003-01-16	Solder paste process control for CSPs and 0201s This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s.
2005-11-01	MEMS mic enables thinner phone designs The many advantages of MEMS microphones will inevitably win them a place in new cellphone designs

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