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| 2012-04-16 | AICTE deploys Microsoft's cloud technology for education Microsoft's Live@edu solution will be deployed over the next three months to more than 10,000 technical colleges and institutes throughout India. |
| 2012-02-21 | Indian languages needed to promote manufacturing.. Gravity 2.0 Round Table discussed on leveraging 'Telugu' for technical skill development for promoting manufacturing activity. |
| 2011-12-05 | Building threat simulator for multi-port radar and warfare systems Here's a look at the process of developing a test platform to evaluate the performance of a four-port unit under test. The results provide significant benefits from technical and operational perspectives. |
| 2011-11-16 | Choosing the right silicon TV tuner IC Learn about the technical issues involved in the selection of TV tuner. |
| 2011-08-23 | Android, iPhone app provides system sol'ns TI unveils a mobile app for iPhone and android users offering both a mobile app and a mobile-optimised website for designers to explore product information and technical documents. |
| 2011-08-08 | TMS320C6472 fixed-point DSP Here is technical brief that details the features of Texas Instruments' TMS320C6472 fixed-point digital signal processor. |
| 2011-07-29 | IEEE boosts telemedicine adoption IEEE aims to boost telemedicine adoption by bringing the technical experts in telemedicine together with the clinicians who must use it effectively to ensure real-world success of telemedicine applications. |
| 2011-07-13 | Is Thunderbolt a challenge to USB? In spite of the huge jump in its bandwidth, Thunderbolt faces technical and economic drawbacks when compared to USB. |
| 2011-07-04 | Android, iOS lacking in cyber-attack protection A technical evaluation of Apple and Google mobile platforms by Symantec reveals that the Android and iOS security is still lacking in cyber-attack protection. |
| 2011-06-14 | Diode evaluation using Agilent B2900A Series Here's a technical overview of the Agilent B2900A Series of Precision Source/Measure Units. |
| 2011-03-07 | AUTOSAR architecture expands safety and security apps Learn more about the Automotive Open System Architecture further release of its specifications that includes technical and functional improvements. |
| 2011-03-01 | IEEE SIG involves India in global standards IEEE SIG for India aims to enhance India's role in the global standards process and provide a platform for increased involvement of the local technical community in global standards development. |
| 2011-02-25 | Intel reveals Sandy Bridge design techniques Intel Corp. shared technical details of its 32nm Sandy Bridge processor at the International Solid-State Circuits Conference (ISSCC). |
| 2010-12-02 | IEEE promotes holistic engineering education IEEE members are promoting a holistic engineering education that focuses beyond technical skills to incorporate experience and relevance into university courses. |
| 2010-11-22 | AMD jumps on the MeeGo project bandwagon AMD joins the Linux Foundation's MeeGo open source Linux project to offer engineering expertise, projected to assist in establishing the technical foundations for next-generation mobile platforms and embedded devices. |
| 2010-11-04 | Wi-Fi, HomePlug alliances focus on smart electric grids The Wi-Fi Alliance and the HomePlug Powerline Alliance will collaborate in joint technical reviews of Wi-Fi and HomePlug specifications and standards to ensure interoperability in smart grid applications. |
| 2010-09-03 | NAND flash 101: An introduction to NAND flash This technical note discusses the basics of NAND flash and demonstrates its power, density and cost advantages for embedded systems. |
| 2010-09-01 | Tektronix unveils products-on-loan scheme Tektronix Inc., has enhanced its current support offerings with Gold Care Plans to address downtime due to failure of products with equivalent products on loan and priority access to technical support resources. |
| 2010-08-12 | Wind River to showcase multi-core, A&D sol'n at FTF 2010 Wind River will be the Global Diamond Sponsor for the Freescale Technology Forum India and will also lead a number of technical sessions and showcase technology innovations. |
| 2010-08-03 | Design and use considerations for NAND flash memory This technical note presents effective design and use practices to help avoid potential problems in NAND flash memory design. |
| 2010-08-02 | Thermal applications This technical note defines a general method and the criteria for measuring and ensuring that Micron memory components and modules do not exceed the maximum allowable temperature. |
| 2010-08-02 | Long-term mobile SDRAM support: Replacements for mobile SDRAM 128Mbit devices This technical note explains some of the similarities and differences between the discontinued and replacement SDRAM devices. |
| 2010-07-30 | EDA Tech Forum coming to two Indian venues The one day conferences offer technical and networking resource for the electronics engineering community and will be held in Bangalore and New Delhi. |
| 2010-06-24 | Understanding impedance-topology conversion This technical article shows you how to do a quick conversion of parallel-to-series complex impedances. |
| 2010-07-01 | Understanding temperature specifications: an introduction Power is required to operate ICs. This power is provided to the IC in the form of voltage and current via power supply pins. This technical note is intended to give the reader a basic understanding of the temperature specifications found in Cypress' product data sheets. |
| 2010-06-14 | EUV litho for 22nm unlikely to take-off EUV comes closer to the technical specifications that would allow high volume manufacturing but its arrival time is unlikely to benefit the mass production of the 22nm node. |
| 2010-06-09 | WHDI 2.0 spec address 3D, mobile app integration Amimon-led WHDI LLC has revealed the technical features for the upcoming Wireless Home Digital Interface (WHDI) 2.0 specification—scheduled for release in Q2 11. |
| 2010-05-13 | Test plan for Agilent HDMI 1.4 Profiled in this technical paper are the high-speed source equipment, cable and the equipment's electrical tests, the protocol, audio and video tests, and subsequently the details of Ethernet and audio return channel tests (for these are all the additional functions). |
| 2010-05-05 | Detailing the Agilent HDMI 1.4 testing Profiled in this technical paper are the high-speed source equipment, cable and the equipment's electrical tests, the protocol, audio and video tests, and subsequently the details of Ethernet and audio return channel tests (for these are all the additional functions). |
| 2010-04-28 | Using OVM configuration classes This technical paper is a testimony to the fact that configuration classes, when used properly, greatly improve the configurability and adaptability of a verification environment. |
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