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| 2012-03-05 | Flextronics to sell camera module biz to Tessera Flextronics to sell camera module biz to Tessera |
| 2011-03-21 | Samsung, Tessera ink imaging solution licence Samsung, Tessera ink imaging solution licence |
| 2010-10-07 | Tessera drags Sony, Renesas to court Tessera drags Sony, Renesas to court |
| 2010-05-10 | Tessera plans to expand image enhancement portfolio Tessera plans to expand image enhancement portfolio |
| 2010-03-17 | Tessera, UTAC sign tech agreement settling lawsuit Tessera, UTAC sign tech agreement settling lawsuit |
| 2009-10-13 | Analysis: Tessera banks on imaging, optics biz Analysis: Tessera banks on imaging, optics biz |
| 2009-08-13 | ITC import ban impact still unclear The U.S. import ban of chips using fine-pitch BGA packages potentially has far reaching impact. |
| 2009-07-06 | OEMs feel chip ban sting Systems makers may be beginning to feel the bite of a limited exclusion order banning the import of chips from six companies found to infringe two packaging patents of Tessera Technologies Inc. |
| 2008-09-24 | Tessera expands biz to camera lenses Tessera expands biz to camera lenses |
| 2008-05-28 | Tessera settles with respondent in DRAM suit Tessera settles with respondent in DRAM suit |
| 2008-01-08 | ITC to investigate four IC complaints The U.S. ITC has announced that it will institute an investigation of certain products based on complains filed by IBM, Knowles Electronics, Tessera and Seoul Semiconductor. |
| 2007-03-16 | Advanced package-stacking fits more functions The primary benefit in multiple-die packaging is the dramatic increase in component density. The size and weight of the product is likely to be reduced and functionality enhanced. The functional enhancement is achieved through the integration of several device types. |
| 2006-12-13 | Tessera claims thinnest WLCSP for camera modules Tessera claims thinnest WLCSP for camera modules |
| 2006-09-12 | Tessera, Flextronics sign wafer-level assembly agreement Tessera, Flextronics sign wafer-level assembly agreement |
| 2006-08-03 | Infineon, Qimonda ink licensing agreement with Tessera Infineon, Qimonda ink licensing agreement with Tessera |
| 2006-07-26 | Tessera, Micron sign license agreement for TCC tech Tessera, Micron sign license agreement for TCC tech |
| 2006-02-14 | Tessera sues ChipMOS subsidiary over patent infringement Tessera sues ChipMOS subsidiary over patent infringement |
| 2001-06-07 | Lead-free soldering for the attachment of µBGA packages This application note will focus on review of alternative solder alloy compositions, furnish recommendations for solder process development, and review environmental testing requirements, comparing eutectic solder to lead-free solder on a 46 I/O µBGA package. |
| 2001-07-16 | Implementing ball attach for CSPs Drawing from the experiences of the actual implementation of a ball-attach line, the authors brief readers on the vital issues of ball attachment. |
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