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| 2012-05-09 | Samsung, Qualcomm form wireless charging alliance Samsung, Qualcomm form wireless charging alliance |
| 2012-04-16 | OpenET Alliance releases updated interface spec OpenET Alliance releases updated interface spec |
| 2012-03-26 | MIPI M-PHY testing sol'n automates 700 tests Tektronix's Opt. M-PHYTX for its DPO/DSA/MSO70000 series oscilloscopes is an automated solution for MIPI M-PHY testing that boosts test engineering setup time and consistency. |
| 2012-03-06 | Digital controller IP implements MIPI LLI spec Arteris' FlexLLI digital controller IP implements the MIPI Alliance Low Latency Interface (LLI) 1.0 interchip communication specification. |
| 2012-01-20 | MIPI adopts RF standards for mobile devices The MIPI Alliance has announced the DigRF v4 is for the digital modem and the RFFE v1.10 other for the front-end radio. |
| 2012-01-17 | 802.11ac gears up for wide adoption in 2012 IMS Research reports that the 802.11ac standard is expected to be approved by the Wi-Fi Alliance in mid-2012, and over 40 crore devices are expected to be shipped in 2016. |
| 2012-01-13 | IEEE starts Power 2.0 standard development The IEEE formed the Power Matters Alliance to define a digital layer above today's wireless charging technologies to let software and services interact intelligently with power. |
| 2011-11-18 | Xilinx adds Premier Design Services membership Xilinx Alliance Program's new membership tier, Premier Design Services, will help FPGA users accelerate R&D. |
| 2011-11-15 | SIG speeds connected vehicles development NXP creates the OPEN Alliance Special Interest Group (SIG) together with Broadcom, Freescale and Harman to push Ethernet technology for in-vehicle networking. |
| 2011-10-05 | Sonics, Lantiq team up for the digital home Sonics and Lantiq forms alliance for the development of next-generation networks and end-to-end SoCs for the digital home. |
| 2011-10-05 | Hitachi, Hi-Rel join hands on power electronics Hitachi announces formation of alliance with Hi-Rel Electronics and expands power electronics business in India. |
| 2011-09-30 | Optical media converters are MIPI compliant Silicon Line GmbH unveils the SL82027 and SL82017 optical media converter (OMC) ICs targeted at mobile and smart phones using the latest MIPI Alliance based M-PHYSM standard. |
| 2011-08-09 | Zigbee solutions support Smart Energy 1.1 TI achieves certification of ZigBee Alliance's Smart Energy 1.1 profile implementation and announces the availability of Z-Stack 2.5.0 that will aid the design of a wider range of HAN products. |
| 2011-08-05 | SEP 2 group focuses on interoperability HomePlug Alliance, WiFi Alliance, HomeGrid Forum, ZigBee Alliance and others have formed a new group for SEP 2 Interoperability to fast-track certification and interoperability testing for SEP 2 devices. |
| 2011-08-01 | Zigbee Gateway network device standard launched ZigBee Alliance launches the ZigBee Gateway standard for network devices that defines a low-cost ZigBee Pro device that lets service providers, businesses and consumers link to the Internet. |
| 2011-07-29 | FEICs target mid-band, high-band MoCA apps M/A-COM Tech introduces the XZ1003-QT and XZ1004-QT FEICs designed for mid-band and high-band MoCA applications that are compatible with entropic communications chipsets. |
| 2011-06-27 | Nimbula backs Open Virtualisation Alliance Nimbula backs Open Virtualisation Alliance |
| 2011-06-16 | Smart meter spec gets consensus on protocols The Zigbee Alliance reaches an agreement on protocol handling for the smart meter spec, the Smart Energy Version 2 that is seen as a foundation for home networks that carry data about electric power use. |
| 2011-06-06 | TI joins EVA, boosts vision tech commitment Texas Instruments boosts its long-standing commitment to vision technology by enrolling in the Embedded Vision Alliance (EVA). |
| 2011-06-02 | Embedded Vision Alliance gains more support Embedded Vision Alliance gains more support |
| 2011-05-30 | Zigbee group plans version 2 profile for home networks Zigbee Alliance will develop the Smart Energy Profile 2.0 (SEP 2) to add a second software stack to the standard for home area networks. |
| 2011-05-06 | USB3-based chip link spec in the works A joint spec that marries the M-PHY spec, a low-power PHY technology defined by the MIPI Alliance, with the media access controller and higher layer software of the USB 3.0 spec is scheduled for early 2012 release. |
| 2011-05-05 | Intel wants bite of Apple Analyst reports indicate that Intel is also vying for Apple's foundry business to give it the logic volume it needs to stay ahead in manufacturing. |
| 2011-04-25 | Embedded Vision Alliance pushes mobile vision apps Embedded Vision Alliance pushes mobile vision apps |
| 2011-04-19 | 500MHz–8GHz oscilloscopes extend MIPI support Tektronix's 500MHz–8GHz performance oscilloscope families ranging claim faster troubleshooting while offering serial decode solutions for MIPI Alliance's CSI-2 and DSI specifications. |
| 2011-04-05 | NIST seeks convergence of smart grid interface spec NIST leads efforts to drive standards for smart grids by seeking convergence on separate efforts by EPRI and the USNAP Alliance on a modular interface spec for linking consumer devices to a smart grid. |
| 2011-03-16 | Apple A5 analysis reveals Samsung make UBM TechInsights' teardown analysis of the A5 chip inside Apple iPad 2 reveals that Samsung has made the A5 chip contrary to recent reports about Apple's foundry alliance with TSMC for the A5. |
| 2011-03-15 | Analysis: TSMC, Apple alliance Analysis: TSMC, Apple alliance |
| 2011-01-24 | RTL-to-GDSII reference flow optimised for 32/28nm Magma Design Automation says its hierarchical RTL-to-GDSII reference flow is now available for the Common Platform alliance's 32/28nm low-power process technology. |
| 2011-01-20 | Test chip primed for 32/28nm HKMG IC manufacture Mentor Graphics reports its collaboration with Common Platform Alliance members to design a test chip using its netlist-to-GDSII solution for CPA 32/28nm high-k metal gate IC manufacturing. |
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