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| 2012-05-21 | Amkor plans chip packaging facility in Korea Amkor plans chip packaging facility in Korea |
| 2012-05-10 | Fujitsu adopts Cadence Chip Planning System for MCU chips Fujitsu adopts Cadence Chip Planning System for MCU chips |
| 2012-05-07 | Employ modelling for power integrity simulation in 3D-IC design Employ modelling for power integrity simulation in 3D-IC design |
| 2012-04-11 | Intel, Xilinx invest in EDA startup Chip design provider Oasys will use the funding to expand its research and development team and worldwide support structure. |
| 2012-04-04 | TI enables bare die IC programme TI's bare die programme enables the design of end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs). |
| 2012-03-26 | Polaris buys IRIS Technologies' ASIC/SoC prototyping unit Polaris Design Systems will continue to sell the Altera Stratix family of ASIC/SoC prototyping solutions. |
| 2012-03-19 | Firms address silicon complexity challenges Cadence, TSMC and ARM executives stress on the need for stepping up collaborations to deal with silicon integration and complexity of technologies of semiconductor design. |
| 2012-03-13 | ...Hornet': A system that simulates 1000 core chip ...Hornet': A system that simulates 1000 core chip |
| 2012-03-13 | Single-chip gas, pH sensor AFEs simplify design Single-chip gas, pH sensor AFEs simplify design |
| 2012-02-28 | Cadence launches 'Design Contest 2012' in India Cadence launches 'Design Contest 2012' in India |
| 2012-01-27 | Apple biggest chip buyer in 2011 Apple biggest chip buyer in 2011 |
| 2012-01-20 | Picochip chooses Synopsys for 40nm femtocell Synopsys reports that Picochip achieved silicon success for 40nm PC3008 picoXcell femtocell chip using Synopsys' Lynx Design System and Galaxy Implementation Platform. |
| 2011-12-13 | Ref design saves power on Bluetooth-based HIDs Ref design saves power on Bluetooth-based HIDs |
| 2011-12-02 | Synopsys to buy rival Magma The Rs.2,273.54 crore acquisition would be the biggest acquisition in EDA in years. |
| 2011-11-18 | Design tool extends CAD navigation Design tool extends CAD navigation |
| 2011-11-14 | STB IC designed for high-definition PVR ST releases the STiH225 claimed as highly integrated chip for interactive high-definition PVR cable STBs that will decrease equipment design, cost and certification challenges for its customers. |
| 2011-11-09 | Using GreenPAK to design, program custom chip in minutes Using GreenPAK to design, program custom chip in minutes |
| 2011-10-25 | Semiconductor firms explore India, China Lip-Bu Tan, chief executive at Cadence Design Systems, says semiconductor industry leaders are exploring the Chinese and Indian markets which are set to see explosive growth in chip consumption. |
| 2011-10-21 | Soctronics touts India's first 28nm design Soctronics touts India's first 28nm design |
| 2011-10-03 | Atmel acquires ADD Semiconductor technology Atmel acquires Advanced Digital Design, S.A. ("ADD Semiconductor"), which specialises in system-on-chip solutions that allow for narrow-band data communication. |
| 2011-09-30 | GHz NoC offers simultaneous processing Sonics Inc. launches SonicsGN (SGN), a GHz network-on-chip (NoC) for advanced, concurrent applications processing and system-level design. |
| 2011-09-14 | RFaxis, Freescale team on 2.4GHz ZigBee sol'n RFaxis and Freescale team to develop a new ZigBee range extension reference design to provide high-performance ZigBee and ISM solutions for the 2.4GHz frequency band. |
| 2011-08-25 | Car networking sol'n activates selective ECUs NXP launches a stand-alone TJA1145 CAN transceiver and system basis chip UJA1168 with 5V/100mA MCU supply, giving design engineers precision control over a vehicle's bus communication network. |
| 2011-08-24 | Wireless power transmitter cuts power consumption TI launches the bq500210, claimed as a 50 per cent smaller transmitter chip that offers a complete Qi-compliant wireless power solution and reduces design costs. |
| 2011-08-10 | Digital-audio SoCs offer enhanced thermal performance STMicroelectronics unveils STA381BW and STA381BWS, two sound terminal digital-audio system-on-chip ICs enabling smaller product designs and offering best thermal performance for safe product design. |
| 2011-07-07 | Logicview adopts Xilinx FPGAs for SoC design platform Logicview adopts Xilinx FPGAs for SoC design platform |
| 2011-07-05 | Ansys to buy Apache Design for Rs.1,400 crore Ansys to buy Apache Design for Rs.1,400 crore |
| 2011-06-29 | Ad calls on investors for India fab setup The Empowered Committee has created an advertisement heralding India's strong chip design infrastructure in hopes of convincing investors and technology providers to build wafer fabs in the country. |
| 2011-06-22 | Tungsten CMP app targets advanced chip design Tungsten CMP app targets advanced chip design |
| 2011-06-07 | ST enables 20nm design with test chip tape-out ST enables 20nm design with test chip tape-out |
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