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2012-05-10 Fujitsu adopts Cadence Chip Planning System for MCU chips
Fujitsu adopts Cadence Chip Planning System for MCU chips
2010-08-06 Analysing early chip planning's benefits (Part 2
Analysing early chip planning's benefits (Part 2
2010-08-05 Analysing early chip planning's benefits (Part 1
Analysing early chip planning's benefits (Part 1
2010-06-15 The benefits of early chip planning (Part 2
The benefits of early chip planning (Part 2
2010-06-08 The benefits of early chip planning (Part 1
The benefits of early chip planning (Part 1
2008-10-07 Avoid design issues with package-aware I/O planning
Avoid design issues with package-aware I/O planning
2008-10-01 Report: Creditors plan to sell Hynix stake
KEB is reportedly planning to sell its combined 36 per cent stake that it holds with eight other companies in the chipmaker.
2008-06-30 ARC offers multimedia codecs with licensing model
ARC has started offering its multimedia codecs under a fixed price, all-you-can-use licensing model.
2008-05-22 Floorplan tool delivers predictability
The Hydra is a flexible automated floorplan synthesis tool that delivers superior predictability.
2007-11-01 45nm designs face I/O planning, placement challenges
45nm designs face I/O planning, placement challenges
2007-11-01 Mobile TV chip suppliers enter race for survival
Mobile TV chip suppliers enter race for survival
2007-10-04 Nokia to discontinue in-house mobile chip devt
Nokia to discontinue in-house mobile chip devt
2007-08-13 WiMAX chip providers gearing up for 700MHz band
WiMAX chip providers gearing up for 700MHz band
2007-06-15 TI to use high-k for gate stacking at 45nm
TI is planning to integrate high-k dielectrics for gate-stack applications to address leakage and power in chip designs.
2006-10-16 Action Semi moves to high-end chips for PMPs
Actions Semiconductor Co. Ltd is moving up-market with two new chip series for personal media players (PMPs). It is also planning to add basic gaming functionality to its high-end SoCs and is in the early stages of building up an IP portfolio for mobile TV.
2006-05-08 ST, Microsoft partner on HDTV STBs
STMicroelectronics (ST) is planning to demonstrate the compatibility of a chip for HDTV STBs and other digital consumer equipment with the Windows CE 5.0 from Microsoft.
2006-02-27 Vietnam approves Intel chip plant
Vietnam approves Intel chip plant
2006-02-16 Outsourcing: Navigating a maze of decisions
The cheapest, fastest and best way to finish your chip design may be to get somebody else to do it. A complex web of providers, both domestic and offshore, will be happy to help. But successfully outsourcing IC design takes careful planning, strong project management and a realistic set of expectations.
2006-01-09 Intel plans Vietnamese chip plant, says AP report
Intel plans Vietnamese chip plant, says AP report
2005-09-23 Infineon to approve memory sell-off on Nov. 17, says report
German newspaper Handelsblatt has raised the old idea that Infineon Technologies AG is planning to sell off its loss-making memory chip division, according to a report that referenced the newspaper article.
2005-10-14 ST plans chip manufacturing in India, says report
ST plans chip manufacturing in India, says report
2005-11-01 Die, package design get closer
Targeting designs headed for flip-chip packages, Synopsys' floor-planning and analysis tool enables concurrent die and package design flows.
2001-05-01 Cadence, Agere tool would foster IC co-design
This article describes the Cadence and Agere team-up to develop a tool with chip I/O planning capabilities.
Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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