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2012-05-21 Amkor plans chip packaging facility in Korea
Amkor plans chip packaging facility in Korea
2012-04-30 GlobalFoundries announces 3D chip stacking at 20nm
GlobalFoundries announces 3D chip stacking at 20nm
2011-12-02 Toshiba to shut three chip plants
Toshiba to shut three chip plants
2011-07-08 E-beam lithography touts smaller chips
MIT researchers claim to have devised a method to make e-beam lithography practical as a mass-production technique while improving the resolution of high-speed e-beam lithography.
2011-06-23 'Smart' car key sol'n enables NFC connection
NXP launches the NCF2970 (KEyLink Lite), its production-ready, single-chip, multi-function 'smart' car key solution that connects to external NFC-compliant devices, such as mobile phones, tablets and laptops.
2011-06-10 Apple overtakes HP as top chip buyer in 2010
Apple overtakes HP as top chip buyer in 2010
2011-03-24 Picochip ships base station-on-a-chip solutions
Picochip ships base station-on-a-chip solutions
2011-02-18 AMD, Intel to launch USB 3.0 chips in 2012
The duo will separately demonstrate within the year PC chipsets supporting the new USB 3.0 interface and start chip production in early 2012.
2010-06-17 Hybrid TV leapfrogs Fresco's growth
Fabless chip company Fresco Microchip Inc.'s has tripled the production of hybrid TV receiver chips from the initial 50 lakh units in the Q1 to 1.50 crore units in June—all in just two quarters.
2010-05-19 Sharp to boost blue LED chip production
Sharp to boost blue LED chip production
2010-03-01 EUV delay makes alternatives a reality
EUV lithography is delayed again and is now targeted for chip production at the 16nm half-pitch node, leaving the industry to face the dreaded double-patterning or some variation of the technology.
2010-02-15 Motorola invests in HD media tech
Motorola Inc. is investing to support production of a family of single-chip media ICs based on the Zenverge Entertainment Nexus (ZEN), a groundbreaking new architecture for digital HD.
2009-11-12 Cree embarks on China manufacturing
Cree's first chip-production facility outside North America will also make components in the future.
2009-06-29 Microformed chip shield suits portable apps
Microformed chip shield suits portable apps
2009-03-16 Intel still pushes China fab plan
Intel has asserted that it remains on schedule to have its 300mm fab in China in production next year, denying industry rumours about the company calling off its plans for the facility.
2009-03-13 Analyst: Recession breaks China's chip industry
Analyst: Recession breaks China's chip industry
2009-01-19 Chip allows video editing on handset
Chip allows video editing on handset
2008-12-02 Global chip market slowed down
Global chip market slowed down
2008-10-30 Bleak future ahead for OEMs
Gartner suggested that many OEMs would not increase production of electronic equipment for the holiday season.
2008-09-19 Prices drop despite memory IC production cuts
Prices drop despite memory IC production cuts
2008-09-09 Project aims at 32nm mask lithography
A joint R&D project will develop technologies and measurement processes for next-generation chip production.
2008-07-18 Crystal oscillators employ photo AT chips
Epson Toyocom has begun production of crystal products that employ the company's photo AT chips.
2006-10-01 Ensuring the accuracy of third-party IP
The best and most unambiguous measure of functional correctness is the extent to which IP has been validated in silicon production. The article discusses the most basic need of every chip designer—functionally correct IP.
2008-06-23 DECT/CAT-iq solution enters mass production
DECT/CAT-iq solution enters mass production
2008-06-05 TSMC introduces 40-nm design flow
TSMC is set to roll out its latest design methodology for IC production at the 40-nanometer node.
2008-05-07 Weak market delays IM Flash chip production
Weak market delays IM Flash chip production
2008-02-06 Rumours cloud EUV's viability for chip production
Rumours cloud EUV's viability for chip production
2007-12-06 ATMI, IBM ink deal to develop implanted photoresists
ATMI and IBM have signed an agreement to develop advanced chemical formulations for implanted photoresist strip apps that will allow the production of next-gen chip devices targeting 45nm and above processes.
2007-12-03 Is analogue the next fertile frontier for chip outsourcing
Is analogue the next fertile frontier for chip outsourcing
2007-10-08 Toshiba explores 450mm fab, EUV litho tech
Apart from exploring several new chip-production tech, Toshiba is also in talks with lithography partner Nikon and ASML Holding NV about the EUV technology.
Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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