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| 2009-12-17 | ON Semi bags CMD in an all cash deal ON Semi bags CMD in an all cash deal |
| 2008-08-06 | CMD sells LED driver assets CMD sells LED driver assets |
| 2007-01-29 | CMD, SPEL collaborate in small-profile packaging CMD, SPEL collaborate in small-profile packaging |
| 2006-12-14 | CMD expands family of DDR power solutions CMD expands family of DDR power solutions |
| 2006-09-26 | CMD develops port protection solutions for HDMI CMD develops port protection solutions for HDMI |
| 2006-09-06 | CMD announces HDMI protection solutions CMD announces HDMI protection solutions |
| 2006-05-11 | CMD expands PhotonIC portfolio of WLED drivers CMD expands PhotonIC portfolio of WLED drivers |
| 2006-05-09 | Power saving tech enhances white LED apps efficiency California Micro Devices has developed a power saving technology and PhotonIC products that are designed to increase efficiency in white LED apps at the lowest BOM and the smallest footprint. |
| 2006-04-10 | CMD offers EMI filter for wireless handsets CMD offers EMI filter for wireless handsets |
| 2005-12-23 | EMI filters target cell phone audio CMD's CM1418 and CM1419 EMI inductor-based filter arrays with ESD protection are aimed at audio applications in wireless handsets. |
| 2005-12-22 | CMD's ASIP device saves 55-per-cent board space CMD's ASIP device saves 55-per-cent board space |
| 2005-09-05 | Smallest EMI filters save board space for wireless handsets California Micro Devices said its new 0.4mm pitch CSP Centurion electromagnetic interference filters set a new price/performance standard for the industry. |
| 2005-08-25 | Protecting the HDMI interface HDMI combines a high-speed unidirectional TMDS data link with low speed, bi-directional control and status links and configuration protocols in a single user-friendly high-performance connector. |
| 2005-09-28 | CMD expands wafer foundry resources with support from Epson CMD expands wafer foundry resources with support from Epson |
| 2005-11-04 | STATS ChipPAC opens wafer bump plant in China Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market. |
| 2005-11-04 | CMD to build 200-, 300mm fabs in China CMD to build 200-, 300mm fabs in China |
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