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| 2012-05-24 | Copper wire bonding is growing, TI says Copper wire bonding is growing, TI says |
| 2012-04-12 | A new technique cools electronic devices 25% faster According to a researcher, the copper-graphene film's thermal conductivity allows it to cool electronic devices much faster than pure copper. |
| 2012-04-02 | Liquid-like compound shows more thermoelectrics Researchers identify a new type of thermoelectric, liquid-like Copper-Selenium material with a thermoelectric figure of merit of 1.5 at 727°C (1000°K), said to be one of the highest values in any bulk material. |
| 2012-01-10 | Four-atom-wide wire conducts as well as copper Four-atom-wide wire conducts as well as copper |
| 2012-01-04 | Platform touts 0.11µm aluminium BEoL process UMC's A+ technology platform touts a specialised 0.11µm aluminium BEoL process that offers a cost effective substitute to other mainstream copper technologies. |
| 2011-12-14 | Ethernet compliance, debug tool supports TWDPc Tektronix improves its Ethernet SFF 8431 SFP+ compliance and debug products with support for the Transmitter Waveform Distortion Penalty for Copper (TWDPc) measurement. |
| 2011-11-30 | Heterojunction silicon solar cell with copper Heterojunction silicon solar cell with copper |
| 2011-11-16 | Graphene could replace copper as interconnects Graphene could replace copper as interconnects |
| 2011-10-12 | Multi-contact probe tests 30µm x 50µm pads Cascade Microtech debuts the InfinityQuad, touted as the only multi-contact probe head capable of automatically probing aluminium, copper or gold pads as small as 30µm x 50µm. |
| 2011-10-10 | Cu nanowires to replace ITO films The copper nanowire films have the same properties as ITO that are currently used in electronic devices and solar cells, according to a recent research. |
| 2011-09-30 | Taskforce enables dealing with increased bandwidth IEEE unveils that the IEEE P802.3bj Task Force aims to develop specifications for 100Gbit Ethernet transmission over backplanes and short-reach copper assemblies. |
| 2011-09-09 | Novel superconductors tout higher efficiency Researchers have developed superconducting wires using fibres made of single crystals of sapphire that is said to carry approximately 40 times more electricity than a copper wire of the same size. |
| 2011-07-28 | Ethernet switches feature ST, SC fibre connectors B&B Electronics introduces the ELinx ESW100 series of unmanaged Ethernet switches that feature LC small form-factor, standard ST and SC fibre connectors with industrial-hardened certifications. |
| 2011-06-28 | PCI-SIG targets PCIe Gen 4 with 16GTps throughput The PCI Special Interest Group is working on getting at least one more high-speed, 16GTransfers/s version of PCI Express from copper links before the anticipated shift to optical interconnects. |
| 2011-05-16 | Perform debug for antenna issues in copper processes Perform debug for antenna issues in copper processes |
| 2011-05-09 | Use thicker copper to achieve high-current drive in power ICs Use thicker copper to achieve high-current drive in power ICs |
| 2011-03-07 | Boost analogue IC power dissipation with copper pillars Boost analogue IC power dissipation with copper pillars |
| 2011-02-22 | Can carbon-rich sources yield pure graphene? Rice researchers have evolved a one-step process that involves depositing carbon-rich sources on copper and nickel substrates to produce graphene in any form—single-, bi- or multi-layer sheets that may prove useful in various applications. |
| 2011-02-10 | Aluminium unseats copper in car power systems Aluminium unseats copper in car power systems |
| 2011-01-27 | CDDI: Missed opportunity The development of the Copper Data Distributed Interface (CDDI) presents a lesson about how making management decisions based solely on marketing can cause companies to lose out on opportunities. |
| 2010-12-23 | PCB thermal tech packs copper heatsink within board PCB thermal tech packs copper heatsink within board |
| 2010-12-08 | Server adapter family offers four 1GbE ports Interface Masters packs 4 1GB ports, PCI-e Gen 2.0x4, low-power consumption and support for SFP and RJ45 copper. |
| 2010-10-28 | MLCCs offer 0.15mm thickness AVX Corp. extends its UT series of multi-layer ceramic capacitor (MLCC) family with low profile, fine copper termination (FCT) devices. |
| 2010-10-22 | IBM, Solar Frontier join forces on thin-film PV tech The duo will collaborate to expand upon IBM's technology based on the elements copper, zinc, tin, sulphur, and selenium (CZTS) material for thin-film solar cell technology. |
| 2010-07-30 | Intel explores silicon photonics Intel Corp. researchers have demonstrated 50Gbit/s optical transmitter and receiver chips that it plans to scale up to terabit-per-second speeds prior to commercialisation. |
| 2010-07-09 | TI adopts new packaging tech for 45nm devices Texas Instruments is adopting an emerging technology called fine-pitch copper pillar flip-chip for packaging devices at the 45nm/40nm nodes and below. |
| 2010-06-29 | MOSFETs utilise copper clip technology MOSFETs utilise copper clip technology |
| 2010-06-16 | Copper nanowires devised for circuitry, transparent panels Copper nanowires devised for circuitry, transparent panels |
| 2010-03-22 | Bipolar transistors enable copper power rating of 0.74W Bipolar transistors enable copper power rating of 0.74W |
| 2010-03-09 | IBM takes a step closer to on-chip optical comms IBM scientists have taken a step closer in replacing electrical signals that communicate via copper wires between computer chips with tiny silicon circuits that communicate using pulses of light. |
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