csp What does CSP stand for? Search results

What does CSP stand for?

CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.

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2012-02-21	A look at Micro SMDxt wafer level CSP A look at Micro SMDxt wafer level CSP
2011-11-03	32bit MCUs come in 2x2mm CSP 32bit MCUs come in 2x2mm CSP
2011-03-29	Micro SMD wafer level CSP Micro SMD wafer level CSP
2010-04-27	32bit MCU fits in 5mm² PCB area NXP Semiconductors adds the LPC1102 32bit MCU with 32KB of flash and 8KB of RAM on-chip available in WL-CSP with dimensions of 2.17mm x 2.32mm to it's LPC1100 MCU family.
2010-02-03	Atmel to put smart card operations on sale Atmel Corp. disclosed it will continue to explore the potential sale of its smart card business and discontinue sale of its CSP and aerospace businesses.
2009-12-28	Integrated switch eases sub-system load management Texas Instruments Inc. debuts a fully-integrated load switch with typical ON resistance of 5.7mΩ at 3.6V, 4x lower than the nearest competitor.
2009-12-07	Low-noise ADCs deliver 125Hz output data rate ADI's new ADCs offer ease of use, an on-chip oscillator and comes in a 3mm x 3mm CSP package.
2009-11-02	Converter cuts need for external Schottky diode Maxim Integrated Products has introduced the MAX8884Y/MAX8884Z 700mA step-down converters with dual 300mA LDOs in a 2mm x 2mm CSP.
2009-07-14	Intro to Flip-Chip CSP Intro to Flip-Chip CSP
2007-09-10	RF noise canceller suits advanced mobile comm Quellan has announced an RF noise canceller, based on its CSP noise canceling tech, for advanced mobile communications products.
2007-01-18	Test, burn-in sockets accept 0.40mm pitch devices Aries Electronics has announced that all sizes of its CSP/Micro BGA test and burn-in sockets accept devices with pitches as low as 0.40mm. These sockets can be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices.
2006-12-19	Low-jitter clock oscillators designed for mass storage nets Raltron Electronics Corp. has released a family of high-frequency clock oscillators with low-jitter performance. The Pb-free, RoHS-compliant CS9, CSP and CLP are designed specifically for use in mass storage networks, Fibre Channel and Ethernet applications.
2006-12-13	Tessera claims thinnest WLCSP for camera modules Tessera Technologies Inc. has announced what claims as one of the slimmest surface-mountable wafer-level chip-scale packages (WLCSPs) available for camera modules, MEMS and optical detectors.
2006-06-28	Analogue switches suit mobile terminals Pericom Semiconductor Corp. has introduced a family of advanced analogue switches created for mobile terminal applications which feature CSP, very low On-Resistance and wide voltage ranges.
2006-05-31	FlipChip, Engent to develop 3D wafer level CSP tech FlipChip, Engent to develop 3D wafer level CSP tech
2006-04-28	Rohm announces single-chip Hall ICs for bipolar detection Rohm Co. Ltd has announced the BU52000 series of single-chip Hall ICs for bipolar detection. Packed in WLCSP4 CSP, the device is ideal for mobile phone magnetic switches.
2006-04-10	CMD offers EMI filter for wireless handsets California Micro Devices is offering its generation Praetorian CM1452 EMI filter with ESD protection for wireless handsets in a 0.40mm pitch chip-scale package (CSP).
2005-12-19	Analogue switches in CSP offer 0.5Ω R_{ON Analogue switches in CSP offer 0.5Ω R_ON}
2005-09-05	Smallest EMI filters save board space for wireless handsets California Micro Devices said its new 0.4mm pitch CSP Centurion electromagnetic interference filters set a new price/performance standard for the industry.
2001-06-19	Inductance analysis of chip scale packages This application note is intended to demonstrate a simple model that relates the maximum operating clock frequency of a CSP based on the IC's power dissipation, the typical lead equivalent inductance and the number of pairs of leads used for power and ground.
2005-09-16	Smallest single-port USB 2.0 analog switch in MicroPak CSP Smallest single-port USB 2.0 analog switch in MicroPak CSP
2001-03-30	CSP MOSFETs Offer Both Size And Performance Advantages CSP MOSFETs Offer Both Size And Performance Advantages
2001-03-30	Portable Applications Drive Packaging Evolution This paper gives an overview about the Micro SMD chip-scale packaging technology. It describes Micro SMD's advantages over traditional leaded plastic packages and explains mounting and handling considerations.
2001-04-01	Solder joint reliability of BGA/CSP for mobile phones Solder joint reliability of BGA/CSP for mobile phones
2001-04-01	Solder joint reliability of BGA/CSP for mobile phones Solder joint reliability of BGA/CSP for mobile phones
2001-05-16	Effective interconnect space reduction formation Significant technical progress has been made with newly developed materials and with the introduction of new components, this evolution has become possible. This paper describes the benefits of using microvias.
2001-07-16	Reworking CSPs, µBGAs and flip-chips Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.
2001-07-16	Implementing ball attach for CSPs Drawing from the experiences of the actual implementation of a ball-attach line, the authors brief readers on the vital issues of ball attachment.
2001-08-16	Conductive elastomers deliver sockets for GHz CSPs The author discusses the conductive elastomer technology as applied to sockets, detailing tests for electrical and mechanical characterization.
2001-09-16	Improving compression-type flip-chip bonding This technical article describes the compression-type flip-chip bonding technique that enables high-quality, high-density and low-cost processes in LSI packaging.

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