- Article
(38) -
Forum
(0) -
Blog
(0)
total search38 articles
sort by relevance
sort by date
| 2012-02-08 | Panel: Collaboration on mixed-signal designs Panel: Collaboration on mixed-signal designs |
| 2011-10-05 | Deal with complexity of hardware design project management Deal with complexity of hardware design project management |
| 2011-06-07 | ST enables 20nm design with test chip tape-out ST enables 20nm design with test chip tape-out |
| 2011-05-30 | Nvidia joins Imec's Insite CMOS scaling programme Nvidia has entered a three-year collaboration agreement with Imec for its Insite CMOS scaling programme, which focuses on the system design impact at sub-20nm nodes. |
| 2011-02-21 | Boost communication, build better custom component Read about the tips for successfully building components through close collaboration between design engineers and manufacturers. |
| 2011-01-20 | Test chip primed for 32/28nm HKMG IC manufacture Mentor Graphics reports its collaboration with Common Platform Alliance members to design a test chip using its netlist-to-GDSII solution for CPA 32/28nm high-k metal gate IC manufacturing. |
| 2010-06-21 | GlobalFoundries CEO calls for concerted effort in EDA Design Automation Conference (DAC) keynoter and GlobalFoundries CEO Doug Grose believes that IC design firms need to redefine relationships with manufacturing partners, and foundries must create new model that brings manufacturing and design into an integrated process. |
| 2010-03-29 | Renesas, Cavium partner on ref design Renesas, Cavium partner on ref design |
| 2010-03-19 | Mentor, ST partner on 32/20nm design solutions Mentor, ST partner on 32/20nm design solutions |
| 2010-02-25 | Mephisto tools IMEC's green radios program In collaboration with Mephisto Design Automation (MDA), IMEC will use MDA's M-Design to develop mixed-signal reconfigurable radios for its green radios program. |
| 2009-10-23 | Cadence, ARM team up for SoC design Cadence, ARM team up for SoC design |
| 2009-02-18 | LG, Intel collaborate on MIDs Intel and LG Electronics have announced a collaboration around the design and production of mobile Internet devices based on Intel's MID hardware platform "Moorestown" and Linux-based Moblin ver 2.0 software platform. The LG device is expected to be one of the first Moorestown designs to market. |
| 2008-11-26 | SiliconBlue, Magma announce tech partnership The collaboration will provide an FPGA design environment for SiliconBlue's iCE65 FPGA product line. |
| 2008-10-01 | Collaboration to enable 32nm, 28nm SoCs Collaboration to enable 32nm, 28nm SoCs |
| 2008-04-16 | Support IP with topology routing This is the second of a two-part article that follows the capture of Intellectual Property (IP) by the design engineer. It focuses on the PCB designer collaboration of the IP through the remaining design flow. |
| 2008-04-16 | Tackle IP sharing in PCB design Tackle IP sharing in PCB design |
| 2008-04-04 | ARC, Toshiba to develop multicore tech ARC International and Toshiba have extended their collaboration to develop configurable multi-processor technology which offers a set of design tools and resources to produce optimized processor designs. |
| 2007-11-29 | Fraunhofer to provide design support for Atmel's MCU based chip Fraunhofer to provide design support for Atmel's MCU based chip |
| 2007-11-07 | Nokia, ST conclude 3G chipsets deal Nokia and ST have concluded a multifaceted agreement that transfers a core part of Nokia's IC operations to ST and positions ST to design and manufacture 3G chipsets based on Nokia's modem tech, energy mgmt and RF tech. |
| 2007-07-06 | PicoChip collaborates with Systems4Silicon Systems4Silicon's collaboration with PicoChip for PHY chip support enables MIMO design services provider to offer clear time-to-market benefits. |
| 2007-06-25 | ST, Freescale team makes progress in auto chip design ST, Freescale team makes progress in auto chip design |
| 2007-06-07 | Acrobat 3D ver.8 allows CAD data interoperability Adobe Acrobat 3D ver.8 software drives document-based 3D design collaboration and CAD data interoperability capabilities inside manufacturing organisations. |
| 2007-06-01 | IC designers analyse DFM tools IC design experts believed that DFM is best addressed through design rules, preverified blocks and improved standard-cell libraries, said the experts. |
| 2007-05-25 | Partnership simplifies FPGA, PCB design collaboration Partnership simplifies FPGA, PCB design collaboration |
| 2007-05-11 | Agilent, Mentor team to ease auto product verification Agilent and Mentor Graphics' collaboration complements Agilent's physical layer test tools with Mentor's vehicle protocol analysis and node emulation products |
| 2007-04-24 | Design data management tool allows scalability, collaboration Design data management tool allows scalability, collaboration |
| 2007-02-21 | NXP, Purple Labs take Linux to 3G handsets In collaboration with French design company Purple Labs, NXP has launched the Nexperia cellular system solution 7210 with Linux open-source OS for 3G handsets. |
| 2006-12-20 | ISA, Cadence discuss low power design ISA, Cadence discuss low power design |
| 2006-12-13 | Fabbrix declares collaboration with PDF Solutions Fabbrix declares collaboration with PDF Solutions |
| 2006-12-12 | Cadence, Advantest enter automotive testing partnership Cadence Design Systems Inc. and Advantest Corp. have announced a collaborative partnership to deliver a methodology for zero-defect testing of digital automotive electronics. This collaboration will enable faster time-to-market and more complete testing of complex digital devices for new automobiles. |
Most Popular Articles
Search EE Times India
Max's Cool Beans
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
