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| 2012-01-19 | 2012: Accelerated era of design innovation 2012: Accelerated era of design innovation |
| 2012-01-24 | Address last gasp concerns in smart meter design Address last gasp concerns in smart meter design |
| 2011-11-14 | STB IC designed for high-definition PVR ST releases the STiH225 claimed as highly integrated chip for interactive high-definition PVR cable STBs that will decrease equipment design, cost and certification challenges for its customers. |
| 2011-09-28 | 8bit MCUs feature configurable logic Microchip reveals 8bit PIC MCUs that aim to enable designers to enhance the functionality, reduce design size, and decrease the cost and power consumption of product in the industrial markets. |
| 2011-09-22 | Test solution optimised for high test quality ARM and Mentor announce a reference flow for ARM base designs that is said to optimise high test quality, lower cost and shorten design-for-test development schedules. |
| 2011-07-26 | Will ST–Ericsson recover from losses? The ST–Ericsson joint venture is in rough waters with huge losses that the company has plans to recover through restructuring and cost cutting by the end of 2012. |
| 2011-07-06 | 600V rectifiers present robust, cost-effective design 600V rectifiers present robust, cost-effective design |
| 2011-06-09 | Analysis: Lower EDA design costs to drive growth Analysis: Lower EDA design costs to drive growth |
| 2011-06-02 | Broadcom HD satellite STB SoC targets BRICA markets Broadcom introduces the Broadcom BCM7358, a 40nm HD satellite STB SoC which promises to reduce design complexity, size and cost for fast deployment of HD satellite STBs in BRICA markets. |
| 2011-05-24 | 3W, 6W LED drivers feature compact design 3W, 6W LED drivers feature compact design |
| 2011-05-18 | OpenCores aims for 'super-low-cost' ASIC design OpenCores aims for 'super-low-cost' ASIC design |
| 2011-04-29 | Silver box reference design targets power supplies Silver box reference design targets power supplies |
| 2011-04-15 | DDR4 IP solution with optimised integration debuts Cadence team debuts a DDR4 IP solution and integration environment that claims to speed integration, reduce cost and ensure design manufacturability. |
| 2011-03-24 | Wipro to expand chip services unit by 10-15% Calls for cost reduction and timely device development have paved the way for fabless ASIC houses such as Wipro, which provides IT solutions, IC design services, supply chain management, among others. |
| 2011-03-22 | SM3320-RF-EV reference design SM3320-RF-EV reference design |
| 2010-11-29 | Broadcom's dual-thread CPU scores over competition Broadcom revealed a MIPS-compatible CPU for its broadband SoCs with optimised power and cost dual-thread design that gives it an edge over competition. |
| 2010-11-26 | Spartan-6 based design platforms enhance connectivity Spartan-6 based design platforms enhance connectivity |
| 2010-11-24 | Boundary-scan test sol'n tailored for budget customers Corelis Inc.'s TestGenie is a low-cost, low-risk boundary-scan test solution for companies with limited resources, minimal JTAG experience, fixed schedules and tight test budgets. |
| 2010-11-19 | Optical modules enhance design flexibility Optical modules enhance design flexibility |
| 2010-11-01 | Desktop scanner embraces 3D technology Here's a look inside NextEngine's low-cost, desktop 3D Scanner that creates mesh files of 3D objects for industrial design, reverse engineering, CGI and content creation vs. more expensive scanners. |
| 2010-08-13 | Low-cost SD decoder simplifies STB design Low-cost SD decoder simplifies STB design |
| 2010-08-10 | LED drivers boast compact design for portable apps LED drivers boast compact design for portable apps |
| 2010-07-16 | MCUs improve glucometer accuracy, efficiency The proper MCU that integrates digital and analogue functionality, while balancing cost is recommended to implement small size, low power and high performance glucometers. |
| 2010-07-29 | Development board promises simplified PSoC 3 design Development board promises simplified PSoC 3 design |
| 2010-07-19 | Engineers discuss 3D chip standard A group of about 60 engineers gathered at a Semicon West 2010 in San Francisco took the first crack at outlining standards needed for 3D silicon chips including address design, yield and cost problems. |
| 2010-07-14 | MCU tools ease digital power design MCU tools ease digital power design |
| 2010-07-07 | Lattice tool targets low-cost FPGA apps Lattice tool targets low-cost FPGA apps |
| 2010-06-24 | Performing cost-effective headset design, test Performing cost-effective headset design, test |
| 2010-06-25 | Overview of ultrasound imaging systems, electrical components required for main subfunctions This application note is an introduction to ultrasound imaging systems. It discusses the trend towards smaller, lower cost and more portable imaging solutions. |
| 2010-06-18 | Overview of ultrasound imaging systems, electrical components required for main subfunctions This application note is an introduction to ultrasound imaging systems. It discusses the trend towards smaller, lower cost and more portable imaging solutions. |
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