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| 2012-05-23 | ONFi IP, VIP solutions target NAND Flash storage Posedge teams with PerfectVIPs to provide Open NAND Flash Interface (ONFi) IP solution and ONFi verification solutions targeted at storage and memory ASIC development. |
| 2012-05-22 | Samsung creates graphene transistor This discovery could lead to the development of transistors that can overcome the limits of conventional silicon, claims Samsung. |
| 2012-05-21 | Amkor plans chip packaging facility in Korea Amkor will invest Rs.1,832.46 crore in its new centre, which will focus on the design, development and full scale production of semiconductor packaging and test services. |
| 2012-05-21 | Cadence in-circuit acceleration aids system dev't Cadence's in-circuit acceleration offers a single heterogeneous environment for system-level verification, resulting in up-to-10x increased efficiency in system development. |
| 2012-05-18 | ST's STM32 MCU gains Java development toolkit ST's STM32 MCU gains Java development toolkit |
| 2012-05-17 | Cadence offers NVMe IP sub-system for SSD apps Cadence NVM Express solution enables faster development of SoCs at lower cost. |
| 2012-05-15 | eBay to open software development centre in Bangalore eBay to open software development centre in Bangalore |
| 2012-05-09 | China weapon development "faster than expected China weapon development "faster than expected |
| 2012-05-01 | Huawei, Intel to set-up lab on LTE TDD The companies will set-up Interoperability Test lab in China to accelerate development of the LTE TDD ecosystem. |
| 2012-04-27 | TI's multi-core DSPs implement JPEG 2000 codec TI implements JPEG 2000 codecs on four TMS320C6678 multi-core DSPs which are made available on Advantech's DSPC-8681E half-length PCI express card to aid broadcast and digital cinema development. |
| 2012-04-26 | Posedge opens R&D centre in Bangalore The Bangalore R&D team will develop Wi-Fi systems for the growing wireless market segment. |
| 2012-04-24 | Xilinx unveils design platform for 4K2K display Xilinx reveals the Display Targeted Design Platform (TDP) to speed development of 4K2K monitors and high resolution projection systems. |
| 2012-04-16 | JEDEC plans to standardise non-volatile wireless memory JEDEC invites interested companies worldwide to participate in the development of open industry standards, which is already supported by Nokia, Micron, and Samsung. |
| 2012-04-11 | Intel, Xilinx invest in EDA startup Chip design provider Oasys will use the funding to expand its research and development team and worldwide support structure. |
| 2012-03-30 | Freescale offers development kit for robotic designers Freescale offers development kit for robotic designers |
| 2012-03-30 | Qualcomm to set up R&D centre in Singapore The IC design and engineering R&D centre will focus on chipset design and development. |
| 2012-03-28 | NEC to set up development centre in India NEC to set up development centre in India |
| 2012-03-28 | Dev't kit available for Energy Micro Gecko MCU Energy Micro's EFM32G-DK3550 Gecko MCU development kit includes full SEGGER J-Trace and J-Link support. |
| 2012-03-27 | Nokia, Microsoft invest Rs.118 crore to train developers The companies will fund a university app development programme to foster the creation of apps for Windows Phones and Nokia's platforms. |
| 2012-03-23 | Altera, TSMC develop 3D IC test vehicle Altera uses TSMC's Chip-on-Wafer-on-Substrate integration process for development of the 3D devices. |
| 2012-03-20 | MindTree, Netbiscuits to deliver mobile web developments MindTree partners with Netbiscuits to develop and deliver services, templates and development methodologies for MindTree customers. |
| 2012-03-20 | Dev't kit supports safety designs on XC2000 Hitex's 16bit SafeTkit for XC2000 is a complete development package targeted at functional safety designs based on Infineon's XC2000 architecture. |
| 2012-03-20 | Hybrid CMOS image sensor sol'n ups resolution TowerJazz's TS11IS CMOS image sensor solution allows the development of higher resolution high-end sensors with smaller pixels and enhanced performance. |
| 2012-03-20 | Budget 2012: Industry Speaks Let's check out who all are happy and who are not with Pranab Mukherjee's 'Budget 2012'... |
| 2012-03-19 | Synopsys, Applied Materials to develop new TCAD models The new TCAD models will enable customers to speed up process development for 14nm and 11nm logic and new memory chip technologies. |
| 2012-03-16 | Highlights: Budget 2012 EE Times India highlights a list of announcements focussed on tax reforms, corporate tax policy, India's manufacturing sector... |
| 2012-03-16 | Infosys to hire 500 product R&D engineers Infosys plans to strengthen its product R&D team in order to accelerate design and development of its offerings. |
| 2012-03-12 | PDK available for 14nm logic chips Imec's early-version PDK for 14nm logic chips targets the introduction of a number of new key technologies, such as FinFET technology and EUV lithography. |
| 2012-03-09 | Applied Materials, IME open 3D chip packaging lab The centre is expected to help accelerate the development and adoption of 3D packaging technology globally. |
| 2012-03-07 | T-ray tech development boosts medical scanners T-ray tech development boosts medical scanners |
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