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2008-11-07 TSMC enhances 0.13µm process tech
TSMC has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology.
2007-05-28 Re-synthesis solution offers area, speed, power benefits
Nangate Inc. has claimed that its Design optimiser solution is capable of creating an optimised gate-level design with area, speed or power benefits.
2006-08-03 Chip packaging delivers 30% reduction in thickness
Chip packaging delivers 30% reduction in thickness
Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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