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| 2008-11-07 | TSMC enhances 0.13µm process tech TSMC has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology. |
| 2007-05-28 | Re-synthesis solution offers area, speed, power benefits Nangate Inc. has claimed that its Design optimiser solution is capable of creating an optimised gate-level design with area, speed or power benefits. |
| 2006-08-03 | Chip packaging delivers 30% reduction in thickness Chip packaging delivers 30% reduction in thickness |
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Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...











