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2011-12-12 128Gb NAND device touts 1Tb data storage
Intel and Micron jointly develop a 20nm 128Gb, multi-level-cell (MLC) device that is said to enable a terabit of data storage in a fingertip-size package by using just eight die.
2011-07-29 Real-time clock touts small 3.2x1.5mm size
Real-time clock touts small 3.2x1.5mm size
2009-09-11 Revised crosstalk-aware routing saves on die size
Revised crosstalk-aware routing saves on die size
2009-02-09 2Gbit DDR3 DRAM based on 46-nm tech
The DDR3 DRAM is based on Qimonda's 46nm Buried Wordline tech and has a die size of less than 55mm².
2008-11-07 TSMC enhances 0.13µm process tech
TSMC has enhanced its 0.13um process technology with immediate availability of a 1.5/6/32V technology.
2008-10-28 Design MOSFETS for shrinking DC-DC converters
Learn how to meet the demands of a particular application as a response to the ever-shrinking space allocated to DC-DC converters.
2008-09-16 MIPS32 34K core family offers multi-threading capability
A new multi-threading implementation of the MIPS architecture offers performance improvements with minimal increase in die size.
2008-01-15 Chip improves car audio amp performance metrics
TAEC's latest member in its family of automotive ICs improves audio amp performance metrics—noise and distortion are diminished, operating stability is better, slew rates are faster and die size is reduced.
2007-12-17 Micron touts 'smallest' 68nm 1Gbit DDR2 device
Micron has introduced what it claims as the world's smallest1Gbit DDR2 memory with a die size of just 56mm², fabricated on 68nm DRAM process technology.
2007-03-16 Advanced package-stacking fits more functions
The primary benefit in multiple-die packaging is the dramatic increase in component density. The size and weight of the product is likely to be reduced and functionality enhanced. The functional enhancement is achieved through the integration of several device types.
2007-02-20 ST samples 'smallest' 65nm NOR flash
STMicroelectronics (ST) has announced that it is sampling 1Gbit and 512Mbit 65nm NOR flash with the smallest die size available on the market.
2006-02-27 Nanoradio offers WiFi chip set with smallest footprint
Nanoradio AB has announced the launch of its first generation NRX700WiFi chipset for portable electronic devices features a total die size of 20mm2.
2005-09-01 Process vs. density in DRAMs
Evaluate the leading DDR2 DRAM devices manufactured by Micron, Samsung, Infineon and Elpida in terms of die size and density
Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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