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| 2011-12-21 | Five firms to develop HD security for SD cards Electronic giants are teaming up to develop HD content protection technology for flash memory cards. |
| 2011-09-12 | e-Passports to add more biometrics by 2014 The e-Passport trend is set to continue with the migration from paper or machine readable passports to 90 per cent smart card-based passports by 2016, says IMS Research. |
| 2010-06-25 | IBM to produce Infineon secure ICs for e-passports Infineon Technologies AG has tapped IBM Corp. to manufacture its highly secure ICs for secure identification applications, including electronic passports. |
| 2009-11-16 | Contactless chips integrate large memory STMicroelectronics' RFID chip allows the implementation of security schemes based on its unique 64bit ID as well as lockable memory blocks. |
| 2009-10-27 | R&D project makes EU eID possible The electronic ID will provide secure authentication for services offered by governments and public authorities. |
| 2007-11-13 | TI touts FRAM tech for e-passport market TI has revealed its plans to enter the secure-government-ID market with products built around FRAM and MCU technologies, to tap the potentially huge global demand for contactless chips. |
| 2007-03-21 | Avert attacks in contactless MCUs Contactless high-security chips are equipped with the newest countermeasures—and these countermeasures have to withstand the most extensive tests. |
| 2006-11-07 | NXP rolls out thinner smart card ICs NXP Semiconductors has announced ultrathin smart card ICs that are finer than a human hair or a sheet of paper. The company said the chips in its SmartMX family can be manufactured to be 75µm thick, which is 50 per cent thinner than the current industry standard for smart card ICs. |
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