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| 2012-05-21 | Amkor plans chip packaging facility in Korea Amkor will invest Rs.1,832.46 crore in its new centre, which will focus on the design, development and full scale production of semiconductor packaging and test services. |
| 2012-05-21 | Getting closer to the peak of simulation-driven design Getting closer to the peak of simulation-driven design |
| 2012-03-30 | Spatial audio generation from portable devices (Part 2) Here's the second instalment of this series that tackles the design techniques used in the LM48901 quad Class D spatial array IC. |
| 2012-01-27 | Apple biggest chip buyer in 2011 Gartner reveals that leading electronic equipment manufacturers accounted for Rs.5.39 lakh crore ($105.6 billion) of semiconductors on a design total available market (TAM) basis in 2011. |
| 2012-01-03 | 2012: The Year of Transformation in Indian ESDM Industry? Sankhya Technologies CEO expects many new start-ups to enter the ESDM market for design tools and services during 2012. |
| 2011-08-25 | Car networking sol'n activates selective ECUs NXP launches a stand-alone TJA1145 CAN transceiver and system basis chip UJA1168 with 5V/100mA MCU supply, giving design engineers precision control over a vehicle's bus communication network. |
| 2011-07-05 | Ansys to buy Apache Design for Rs.1,400 crore Ansys to buy Apache Design for Rs.1,400 crore |
| 2011-07-04 | V850 improves BGM design V850 improves BGM design |
| 2011-06-28 | Avoid design misinterpretations that put system operation in jeopardy Avoid design misinterpretations that put system operation in jeopardy |
| 2011-06-03 | Synopsys, R&S to hasten LTE design, verification Synopsys, R&S to hasten LTE design, verification |
| 2011-05-24 | 3W, 6W LED drivers feature compact design 3W, 6W LED drivers feature compact design |
| 2011-04-18 | An in-depth look at ESL Here's a look at the past progression of design entry methods and the fundamental motivations behind the progressions. |
| 2011-04-07 | ISA: Robust growth for India's IC design market ISA: Robust growth for India's IC design market |
| 2011-03-09 | Electronics industry rises to globalisation As we move into another decade of evolutionary change in the electronics industry, an electronic device can be designed in one country, manufactured in another, then marketed and sold anywhere in the world. |
| 2011-02-09 | IP suites aid critical function availability Lattice Semiconductor Corp. releases five IP suites including PCIe, Ethernet Networking, DSP, Video and Display, and Value that use the company's LatticeECP3 FPGA family to offer faster design of electronic systems. |
| 2011-02-01 | Ease production at 65nm with DFM Know the DFM tools and technologies that could ensure high yield manufacturing of analogue/ RF SoCs. |
| 2011-01-18 | GlobalFoundries readies 28nm digital design flow GlobalFoundries readies 28nm digital design flow |
| 2011-01-07 | Cortex-A9 based chips aimed at high-end CE devices Freescale rolls out the i.MX6 processor series based on ARM Cortex-A9 which offers one-, two- and four-core models so OEMs can deploy several models for one design, with good, better and best product levels. |
| 2010-12-27 | Apply requirements planning in embedded system design (Part 6 Apply requirements planning in embedded system design (Part 6 |
| 2010-12-27 | Apply requirements planning in embedded system design (Part 5 Apply requirements planning in embedded system design (Part 5 |
| 2010-12-22 | LeCroy's oscilloscope wins Electronic Design award LeCroy's oscilloscope wins Electronic Design award |
| 2010-12-20 | Apply requirements planning in embedded system design (Part 4 Apply requirements planning in embedded system design (Part 4 |
| 2010-12-20 | Apply requirements planning in embedded system design (Part 3 Apply requirements planning in embedded system design (Part 3 |
| 2010-12-13 | Apply requirements planning in embedded system design (Part 2 Apply requirements planning in embedded system design (Part 2 |
| 2010-12-13 | Apply requirements planning in embedded system design (Part 1 Apply requirements planning in embedded system design (Part 1 |
| 2010-09-06 | Premier Farnell enhances product offering in Asia Pacific Premier Farnell has expanded stock levels for four brands Multicomp, Pro-Power, Tenma and Duratool within Asia Pacific by 30 per cent as part of its proposition to increase the product range that it offers to electronic design engineers. |
| 2010-09-01 | Why ambient temperature matters The baseline temperature in an electronic system is a very important parameter for thermal design and must be carefully considered. |
| 2010-07-28 | Introduction to electronic calibration, methods for correcting manufacturing tolerances in medical equipment designs Introduction to electronic calibration, methods for correcting manufacturing tolerances in medical equipment designs |
| 2010-06-30 | Harmony among electronic components in musical instruments Harmony among electronic components in musical instruments |
| 2010-07-05 | Protection of automotive electronics from electrical hazards, guidelines for design and component selection Protection of automotive electronics from electrical hazards, guidelines for design and component selection |
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