What is CAE (Computer-Aided Engineering)?
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| 2012-05-09 | Red Hat opens R&D centres in Pune, Bangalore The Pune centre is Red Hat's largest engineering facility outside of North America at 50,000 square feet. |
| 2012-05-08 | IET in pact with India Semiconductor Association Both IET and ISA would organise membership promotion activities to increase awareness of the member benefits and activities of the other institution. |
| 2012-04-25 | IBM most preferred employer for engineers: Survey About 43 per cent engineering students in India ranked IBM as their most preferred employer, followed by Infosys, TCS, Wipro and Accenture. |
| 2012-04-20 | Manipal Institute offers campus-wide access to MathWorks' tools EE-Times India talks to MathWorks' Kishore Rao on challenges in the education sector, bridging employability gap, and its partnership with Manipal Institute. |
| 2012-04-13 | Patient experience: An approach to medical electronics design Drug-device combination products, particularly those in the diabetes space, show how patients are now more invested in ease of use, discretion, and design in medical devices. |
| 2012-03-30 | Qualcomm to set up R&D centre in Singapore The IC design and engineering R&D centre will focus on chipset design and development. |
| 2012-03-26 | MIPI M-PHY testing sol'n automates 700 tests Tektronix's Opt. M-PHYTX for its DPO/DSA/MSO70000 series oscilloscopes is an automated solution for MIPI M-PHY testing that boosts test engineering setup time and consistency. |
| 2012-02-28 | Cadence launches 'Design Contest 2012' in India The contest aims at fostering the spirit of inventiveness among the engineering student community in India. |
| 2012-02-23 | 13% pay hike for design engineers in 2012 According to a survey, India's engineering design/services sector projects the second highest salary increase of 13% in 2012. |
| 2012-01-20 | COTS SBC touts Intel Core i7 chip Extreme Engineering Solutions' Xcalibur4401 6U CompactPCI COTS single board computer is available in conduction- and air-cooled versions for military, communications, and industrial applications. |
| 2012-01-12 | 28nm platforms to accelerate India's transformation India’s engineering talent and Xilinx’s 28nm technologies have the potential to accelerate the country’s transformation into a global R&D hub, says Xilinx CEO Moshe Gavrielov. |
| 2012-01-06 | Retention, diversification are buzzwords for 2012 Mistral Solutions' Krishnakumar points out some major challenges that could exist in the product engineering space during 2012... |
| 2012-01-02 | EE Times: 10 Hot Gadgets The 10 hot gadgets are selected from the Consumer Electronics Association's honorees of engineering design and advancement of the upcoming CES 2012. |
| 2011-12-16 | Shift from FPGAs for prototype to ASICs for production The idea of migrating an FPGA design into an ASIC can be overwhelming to a design team, but careful planning can significantly ease the process. |
| 2011-11-08 | 'Cloud'...Trending Hot! Capturing media buzz and touted as "The Next Big Thing", is 'cloud computing' just a myth or reality? Find out. |
| 2011-10-17 | A 3D future 3D ICs have undergone over a decade of major semiconductor engineering efforts to make the structures more manufacturable and next year will see a gamut of 3D ICs. |
| 2011-09-26 | 3U VPX power supply offers 300W power Extreme Engineering Solutions (X-ES) releases the XPm2120, a conduction-cooled, VITA 62, 3U VPX power supply that takes a MIL-STD-704 input voltage of 28VDC and provides up to 300W of power. |
| 2011-09-22 | Understanding 6LoWPAN: The wireless embedded Internet (Part 2) Read about 6LoWPAN's history and standardisation, its relation to other trends like ZigBee and wireless sensor networks, and some application examples. |
| 2011-08-25 | NI launches 2011 Graphical Design contest National Instruments India launches the Graphical System Design Achievement contest for 2011 to recognise and reward engineering and science applications built using NI graphical system design tools. |
| 2011-08-23 | How to configure an asymmetric multi-core app for DSPs Learn how to configure the memory resources of several example multi-core DSP applications properly so that they support asymmetric processing on Freescale StarCore DSPs. |
| 2011-08-04 | Design software simplifies hardware integration NI launches NI LabVIEW 2011 offering increased development efficiency through engineering-specific libraries and its ability to interact with almost any hardware device. |
| 2011-07-29 | Intel pursues low-power SoC applications Intel's SoC engineering group gears up software, graphics, IP and interconnect assets to create complete SoC solutions aimed at leading performance per watt at 22nm and below. |
| 2011-07-22 | Virtual prototyping sol'n boosts design productivity Synopsys unveils Virtualizer tool set as a part of its next-generation virtual prototyping solution that accelerates software development schedules by up to nine months with lower engineering effort. |
| 2011-07-12 | The true cost of off-the-shelf analogue ICs Any associated up-front non-recurring engineering costs must be considered along with hard tooling—wafer fabrication masks, test hardware and software and more. |
| 2011-06-28 | NI LabVIEW software optimised for high-school labs National Instruments announces the latest edition of its NI LabVIEW for Education software for high school, which claims to turn high school lab computers into full-featured engineering stations. |
| 2011-06-21 | Datamatics to acquire Vista Infosystems Datamatics Software Services has signed a definitive agreement to acquire a controlling stake in Vista Infosystems aimed at strengthening its focus on Engineering and Embedded Systems space. |
| 2011-06-09 | Green programming controls power use A University of Washington research project creates a system called EnerJ that identifies the role of green programming in reducing the energy consumption of computers through the code itself. |
| 2011-05-24 | Micro sensors feature convergent optical design Banner Engineering introduces the VSM Series micro sensors for a wide variety of applications such as die sensing, part presence verification and assembly machines with articulated or reciprocating motion. |
| 2011-04-26 | NI launches green grant programme NI's 2011 Green Engineering Grant programme seeks to promote and recognise development efforts in the areas of renewable energy, energy efficiency and smart grid systems. |
| 2011-04-18 | Innovation erosion poses challenge Richarson discusses ways to improve the success rate of seeing innovations through to commercialisation in order to minimise innovation erosion. |
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