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| 2012-05-25 | LED equipment vendors face tough ride LED equipment vendors face tough ride |
| 2012-05-14 | Govt to set up lab to test imported telecom equipment Govt to set up lab to test imported telecom equipment |
| 2012-05-11 | Applied Materials to shift solar wafer manufacturing to Asia The company, as part of its restructuring plan, will relocate its solar equipment facility to Asia from Europe. |
| 2012-05-07 | LSI processor offloads complex networking tasks LSI debuts the AXE2502, a new version of its Axxia communication processor that offloads complex networking tasks from servers and networking equipment. |
| 2012-04-20 | Atmel RF transceiver touts 60% less power usage Atmel's AT86RF233 is a 2.4GHz low-power, high-performance RF transceiver targeted at battery-operated applications including utility meters, industrial monitoring systems, and energy-harvesting equipment. |
| 2012-04-10 | Huawei second in wireless equipment, beats NSN Huawei second in wireless equipment, beats NSN |
| 2012-04-04 | TI enables bare die IC programme TI's bare die programme enables the design of end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs). |
| 2012-03-30 | Fuse offers high breaking capacity of 1500A Schurter's high-voltage equipment fuse, the SHT 6.3x32 offers a high breaking capacity of 1500A at rated voltage of 500VAC to protect personnel and electronic systems from over-current and short circuit events. |
| 2012-03-23 | IC manufacturing spending to decline in 2012 According to Gartner, this investment weakness will continue through the first half of 2012 and will surge in the second half of the year. |
| 2012-03-14 | USB Isolators provide rugged construction B&B Electronics' Ulinx UHR401 and UHR402 aim at isolation and protection of connected equipment from surges, spikes and ESD. |
| 2012-03-01 | Toshiba buys WD's 3.5inch HDD equipment Toshiba buys WD's 3.5inch HDD equipment |
| 2012-02-16 | Intel unveils 'Crystal Forest' Intel's new Crystal Forest platform will enable equipment manufacturers to design more flexible platforms more efficiently and securely. |
| 2012-02-02 | Timing ICs enable SyncE transmission over OTNs Microsemi's ZL30153 and ZL30154 timing devices support Ethernet and OTN clock rates enabling telecom equipment to support multiple services over a single network. |
| 2012-02-02 | Tellabs plans restructuring, to shut India unit In a restructuring, Tellabs is cutting 530 jobs companywide and shutting down R&D facilities in four locations including India. |
| 2012-01-27 | Apple biggest chip buyer in 2011 Gartner reveals that leading electronic equipment manufacturers accounted for Rs.5.39 lakh crore ($105.6 billion) of semiconductors on a design total available market (TAM) basis in 2011. |
| 2012-01-12 | Optical fibre glass processor handles 1.8mm dia Vytran's GPX-3600 multipurpose system processes very large diameter fibres for applications that require special splicing, such as splicing an 800µm-diameter fibre spliced to a 1.8mm-diameter fibre. |
| 2012-01-09 | SoCs boost analogue, mixed signal integration Maxim's TINI family of CE solutions include power SoCs, touchscreen controllers, cameras and audio codecs that enable smaller smartphones, tablets, TVs and home monitoring equipment. |
| 2011-12-30 | Microwave filters can be surface mounted GigOptix Inc.'s new surface mountable microwave filters target point-to-point wireless backhaul, radar, electronic warfare and test and measurement equipment apps. |
| 2011-12-28 | Wireless infrastructure spending up 9% in 2011 Spending for wireless network infrastructure equipment will amount to Rs.2.17 lakh crore in 2011, forecasts IHS. |
| 2011-12-19 | Lam Research buys Novellus Lam Research acquires Novellus Systems in an all-stock transaction worth about Rs.16,836.73 crore ($3.3 billion). |
| 2011-12-14 | Multi-vendor equipment interoperability Multi-vendor equipment interoperability |
| 2011-12-12 | TEMA suggests induction of domestic equipments TEMA asks govt to make it mandatory for the Indian telcos to induct homemade telecom equipment; and stop relying too much on foreign cos. |
| 2011-12-09 | Li-ion charge control IC targets portable apps Renesas' R2A20055NS, a compact lithium-ion battery-charging control IC is available in a 2 × 2.5mm ultra-miniature, high thermal dissipation, 10-pin HUSON package for portable equipment. |
| 2011-12-05 | ASIC Serdes achieves CEI-28G-VSR compliance Avago announces that its 28Gbps high-bandwidth, low-power Serialiser/Deserialiser (SerDes) core is CEI-28G-VSR compliant enabling a broader range of data networking applications. |
| 2011-11-25 | Nokia Siemens cuts 17000 jobs Nokia Siemens Networks plans restructuring to save Rs.6,410.26 crore by 2013 end. |
| 2011-11-24 | Power amp boasts frequency coverage up to 90GHz GigOptix reveals 0.25W iT2012 MMIC power amplifier that claims to target military electronic warfare, radar, test and measurement equipment and broadband telecom equipment applications. |
| 2011-11-16 | PV capital equipment spending reduces by 3 PV capital equipment spending reduces by 3 |
| 2011-11-28 | Finding the right processor safety strategies for your system The processor solution suited for safety-critical application varies for every development team, even when designing the same type of end equipment. |
| 2011-11-14 | STB IC designed for high-definition PVR ST releases the STiH225 claimed as highly integrated chip for interactive high-definition PVR cable STBs that will decrease equipment design, cost and certification challenges for its customers. |
| 2011-10-31 | IC optimised for UHS-I speed of 104MB/s ST introduces EMIF06-MSD03F3, an IC combining EMI filtering and ESD protection, targeting developers of equipment such as mobile phones, tablets and 3G dongles using SD 3.0 UHS-I micro-SD cards. |
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