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| 2012-02-13 | Imec develops 300mm fab-compatible DSA process line Imec develops a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography. |
| 2010-06-28 | Stanford dean provides CMOS, education outlook James Plummer, dean of Stanford's school of engineering talks about the outlook for CMOS, engineering, education and globalisation. |
| 2010-06-25 | Nikon plans to revive fab tool business Nikon has formulated a three-year medium term management plan that will run from fiscal 2011 to 2013. One of the goals is to bring the fab tool business back in the black. |
| 2010-06-14 | EUV litho for 22nm unlikely to take-off EUV comes closer to the technical specifications that would allow high volume manufacturing but its arrival time is unlikely to benefit the mass production of the 22nm node. |
| 2010-06-04 | Industry favours 193nm immersion, EUV litho in survey A survey of technologists attending the Sematech Litho Forum revealed industry hails 193nm immersion double patterning and EUV as technologies to consider for manufacturing at 32nm and beyond. |
| 2010-04-28 | EUV light source achieves breakthrough output Japan's Extreme Ultraviolet Lithography System Development Association (EUVA) claims to have achieved the highest output for EUV light source at 104W. |
| 2010-04-08 | EUV hits another hurdle in inspection tools EUV has hits another hurdle in the form of inspection tools as Sematech researcher Bryan Rice confessed that the industry still does not have them despite a lengthy R&D effort. |
| 2010-03-25 | Was EUV the wrong bet for the industry? If so, what should it be working on instead? And who will benefit in the long run? Litho experts and executives deliberate on these hot questions. |
| 2010-03-04 | Nanoimprint for HDDs still under wraps While nanoimprint has still not emerged in mainstream production in semiconductor fabs, the technology has been delayed even in perhaps its biggest potential market: HDDs. |
| 2010-03-03 | Delays, double-patterning dominates SPIE Litho The themes of this year's SPIE Advanced Lithography event were clear: D and D—delays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D. |
| 2010-03-02 | Nikon outlines litho plan Nikon outlined its lithography roadmap that includes a revised roadmap for extreme ultraviolet (EUV) lithography. |
| 2010-03-01 | EUV delay makes alternatives a reality EUV lithography is delayed again and is now targeted for chip production at the 16nm half-pitch node, leaving the industry to face the dreaded double-patterning or some variation of the technology. |
| 2010-02-25 | Intel delays EUV litho Intel Corp.'s yet again delays it extreme ultraviolet (EUV) plans in favour of extending its 193nm immersion to the 11nm logic node. |
| 2010-02-24 | Samsung wants EUV litho by 2012 Samsung Electronics Co. Ltd declared at the LithoVision 2010 that it is keenly pushing its plans of extreme ultraviolet (EUV) lithography by 2012 despite signs that the technology will not be ready. |
| 2010-01-28 | 450mm, EUV delays to slow down Moore's Law An analyst cited that the 450mm fabs and extreme ultraviolet (EUV) lithography delays may indicate signs of the Moore's Law slowing down. |
| 2010-01-25 | Analysts see further delay in 450mm, EUV, TSVs IC Insights forecasts more delays for two emerging and key IC manufacturing technologies: 450mm and extreme ultraviolet (EUV) lithography. |
| 2009-10-12 | ASML pushes EUV litho for 2012 ASML offered a rough road map for extreme ultraviolet (EUV) lithography systems that could be ready for commercial use in late 2012. |
| 2009-09-23 | Soaring prices hinder Canon's litho dreams The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources. |
| 2008-10-22 | EUV lithography most likely for 22-nm node EUV lithography most likely for 22-nm node |
| 2008-08-14 | Sematech shows progress on EUV at 22 nm Sematech demo a way of using EUV lithography to define silicon devices with a half-pitch resolution of 22 nm. |
| 2008-07-22 | Chipmakers gear up for double-patterning ASML, Canon and Nikon are racing each other to capitalise on the shift towards double-patterning tech at the 32nm node. |
| 2008-03-18 | Sematech to host lithography forum Sematech to host lithography forum |
| 2008-02-06 | Rumours cloud EUV's viability for chip production The procurement of an R&D EUV lithography tool from Nikon has been pushed out by Intel. The event has raised more questions about the viability of EUV for mass chip production. |
| 2008-01-23 | IMEC, CNSE collaborate to boost EUVL Belgian research group IMEC and the CNSE of the University at Albany in New York have collaborated to carry out EUVL experiments as a means to accelerate the introduction of EUVL into manufacturing. |
| 2007-06-25 | Intel plans inverse litho due to EUV delay With the possible delay of its extreme ultraviolet lithography, Intel disclosed that it is developing a DFM technology that could extend optical scanners to the 22nm node. |
| 2007-04-16 | Litho woes pulling down semicon industry The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative—a version of 193nm immersion—is proving expensive. |
| 2007-02-28 | Nikon to ship two prototype EUV tools to Intel, Selete Nikon Corp. here outlined its roadmap in the extreme ultraviolet (EUV) lithography arena and disclosed plans to ship two prototype tools by year's end. |
| 2007-02-27 | IBM extends immersion lithography to 22nm IBM extends immersion lithography to 22nm |
| 2006-11-20 | EUV lithography makes slow progress, reports Intel EUV lithography makes slow progress, reports Intel |
| 2006-08-10 | Lithography research stalls at 32nm Lithography research stalls at 32nm |
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